公开(公告)号：US20240120180A1

公开(公告)日：2024-04-11

申请号：US18546174

申请日：2022-02-25

Applicant: Lam Research Corporation

Inventor： Yuanping SONG ,  Johnny PHAM ,  Yiwei SONG ,  Lin XU ,  Christopher KIMBALL

IPC: H01J37/32 ,  B05D1/02

CPC classification number: H01J37/32477 ,  B05D1/02 ,  H01J37/32715 ,  H01J37/32807 ,  B05D2203/30 ,  B05D2506/10 ,  H01J2237/0213

Abstract: A component in a semiconductor processing chamber is provided. An electrically conductive semiconductor or metal body has a CTE of less than 10.0×10−6/K. An intermediate layer is disposed over at least one surface of the body, the intermediate layer comprising a fluoropolymer. A perfluoroalkoxy alkane (PFA) layer is disposed over the intermediate layer to form the component.

公开(公告)号：US20230092570A1

公开(公告)日：2023-03-23

申请号：US17795509

申请日：2021-02-16

Applicant: Lam Research Corporation

Inventor： Lin XU ,  David Joseph WETZEL ,  John DAUGHERTY ,  Hong SHIH ,  Satish SRINIVASAN ,  Yuanping SONG ,  Johnny PHAM ,  Yiwei SONG ,  Christopher KIMBALL

IPC: C25D7/04 ,  H01J37/32 ,  H01L21/683 ,  C25D3/44 ,  C25D5/48 ,  C25D11/08

Abstract: A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10−6/K. A metal oxide layer is then disposed over a surface of the component body.