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1.发明授权Magnetic sensor with a chip attached to a lead assembly within a cavity at the sensor's sensing face 失效磁传感器，其芯片附接到传感器感测面处的腔内的引线组件
公开(公告)号：US5912556A
公开(公告)日：1999-06-15
申请号：US744592
申请日：1996-11-06
CPC分类号： G01D11/245 , G01D5/145
摘要： A geartooth sensor is provided with a carrier shaped to form a cavity in which semiconductor chips can be disposed. The carrier partially encapsulates a permanent magnet and a lead assembly. Unencapsulated portions of the lead assembly are exposed within the cavity to permit semiconductor components to be attached to a portion of the lead assembly. A cover is attached to the carrier to seal the cavity and protect the magnetically sensitive components located therein. The carrier, with its associated lead assembly and permanent magnet, can then be attached to a printed circuit board and a support structure to form a geartooth sensor. A protective enclosure can be disposed over the sensitive components of the geartooth sensor.
摘要翻译： 齿轮传感器设置有形成为可以设置半导体芯片的空腔的载体。 载体部分地封装永磁体和引线组件。 引线组件的未封装的部分暴露在腔内，以允许半导体部件附接到引线组件的一部分。 盖子附接到载体以密封空腔并保护位于其中的磁敏部件。 载体及其相关的导线组件和永久磁铁可以连接到印刷电路板和支撑结构以形成齿轮传感器。 保护壳可以放置在齿轮传感器的敏感部件上。
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2.发明授权公开(公告)号：US07644625B2
公开(公告)日：2010-01-12
申请号：US11956811
申请日：2007-12-14
申请人： Lamar F. Ricks
发明人： Lamar F. Ricks
IPC分类号： G01L7/00
CPC分类号： G01L13/025
摘要： A method and apparatus for designing a differential pressure sense die based on a unique silicon piezoresistive technology for sensing low differential pressure in harsh duty applications is disclosed. The pressure sense die comprises of an etched pressure diaphragm and a hole that is drilled through the sense die wherein the pressure sense die possess a backside and a front side and are associated with varying pressures. A top cap can be attached to the front side and an optional constraint for stress relief can be attached to the backside of the differential pressure sense die. The top cap and the constraint comprise of glass and/or silicon and can be attached with an anodic bonding process or glass frit process.
摘要翻译： 公开了一种基于用于在苛刻工作应用中感测低压差的独特硅压阻技术来设计差压感测管芯的方法和装置。 压力感应模具包括蚀刻的压力隔膜和通过感测模头钻出的孔，其中压力感测模具具有背侧和前侧并与变化的压力相关联。 顶盖可以连接到前侧，并且用于应力消除的可选约束可以附着在差压感测模的背面。 顶盖和约束包括玻璃和/或硅，并且可以通过阳极接合工艺或玻璃料加工来附着。
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3.发明授权Packaging methods and systems for measuring multiple measurands including bi-directional flow 有权用于测量多个被测量包括双向流量的包装方法和系统公开(公告)号：US07520051B2
公开(公告)日：2009-04-21
申请号：US11649988
申请日：2007-01-04
IPC分类号： H05K3/30
CPC分类号： G01F5/00 , G01F1/684 , G01F1/72 , G01F15/185 , Y10T29/4913 , Y10T29/49169
摘要： A packing method and system for measuring multiple measurands including bi-directional flow comprises of sampling ports arranged within a flow tube in a symmetrical pattern. The ports are arranged symmetrically with respect to the X and Y centerlines of the flow tube. In addition, the ports are also arranged symmetrical to the restrictor to minimize the amount of turbulent flow within the flow tube.
摘要翻译： 用于测量包括双向流的多个被测量的包装方法和系统包括以对称图案布置在流管内的取样口。 端口相对于流管的X和Y中心线对称布置。 另外，端口也与限制器对称地设置，以使流管内的紊流量最小化。
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公开(公告)号：US07513164B1
公开(公告)日：2009-04-07
申请号：US11958828
申请日：2007-12-18
申请人： Bomani Khemet , Lamar F. Ricks , William S. Hoover
发明人： Bomani Khemet , Lamar F. Ricks , William S. Hoover
IPC分类号： G01L7/00
CPC分类号： G01L9/0055
摘要： An advanced thick film (ATF) pressure transducer can be produced from an advanced thick film stack on a metallic substrate. The metallic substrate has a flexible metallic diaphragm that flexes when there is a pressure differential across its top and bottom surfaces. The conductive and dielectric layers of the ATF stack are patterned into wire networks and bond pads. A strain sensor can be attached to bond pads or can be formed as part of an ATF layer. Flexure of the diaphragm stresses the strain sensor to produce an output proportional to the pressure differential. The ATF pressure transducer can be packaged into a housing that provides easy deployment and electrical interconnectivity.
摘要翻译： 先进的厚膜（ATF）压力传感器可以由金属基底上的先进的厚膜叠层制成。 金属基底具有柔性金属隔膜，当在其顶表面和底表面之间存在压差时，其可挠曲。 ATF堆叠的导电和介电层被图案化成有线网络和接合焊盘。 应变传感器可以连接到接合焊盘，或者可以形成为ATF层的一部分。 隔膜的弯曲应力应变传感器产生与压差成比例的输出。 ATF压力传感器可以封装在一个容易部署和电互连的外壳中。
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公开(公告)号：US07513149B1
公开(公告)日：2009-04-07
申请号：US11948188
申请日：2007-11-30
申请人： Lamar F. Ricks
发明人： Lamar F. Ricks
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/6842
摘要： A MEMS flow sensor has a flow channel that avoids wire bond pads and ancillary circuit elements. A fluid can move from the bottom of the sensor substrate, though an inlet hole, over a sensing element on the top of the substrate, and then through an outlet hole. The inlet hole and the outlet hole can pass from the substrate top to the substrate bottom. A top cap can be fixed to the top of the substrate such that it covers the sensing element, the inlet hole, and the outlet hole. The top cap constrains the flow channel and keeps fluid, either gaseous or liquid, from exiting the channel and contacting the wire bond pads or ancillary circuit elements.
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6.发明授权Position detection apparatus and method for linear and rotary sensing applications 有权线性和旋转传感应用的位置检测装置和方法公开(公告)号：US07173414B2
公开(公告)日：2007-02-06
申请号：US10993964
申请日：2004-11-18
申请人： Lamar F. Ricks , Ryan R. Furio , Andrew Nicol
发明人： Lamar F. Ricks , Ryan R. Furio , Andrew Nicol
IPC分类号： G01B7/30
CPC分类号： G01D5/142 , G01D3/022 , G01D5/24452 , G01D5/2449
摘要： A position detection system and method for linear and rotary sensing applications are disclosed herein, including a plurality of magnetoresistive sensing components for linear and rotary detection sensing, and an integrated circuit for amplifying and calibrating signals generated by the magnetoresistive sensing components in order to provide a full digital calibration and a ratio-metric output voltage or digital output signal indicative of linear and rotary position data.
摘要翻译： 本文公开了用于线性和旋转感测应用的位置检测系统和方法，包括用于线性和旋转检测感测的多个磁阻感测部件，以及用于放大和校准由磁阻感测部件产生的信号的集成电路，以便提供 全数字校准和比例度量输出电压或指示线性和旋转位置数据的数字输出信号。
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7.发明授权公开(公告)号：US07116101B1
公开(公告)日：2006-10-03
申请号：US11314334
申请日：2005-12-20
CPC分类号： G01D5/142
摘要： A Hall-effect sensor apparatus, system and method. In general, a substrate having a surface can be provided. A plurality of Hall-effect sensing elements can then be configured upon the substrate, such that the centerline of a sensing plane associated with the plurality of Hall-effect sensing elements is located towards the surface of substrate, which results in a reduction of the distance between the centerline of the plane of the plurality of Hall-effect sensing elements and an axis of rotation of an associated bias magnet, thereby optimizing the location of the plurality of Hall-effect sensing elements and minimizing sensitivity to misposition and an increase in sensing accuracy.
摘要翻译： 霍尔效应传感器装置，系统和方法。 通常，可以提供具有表面的基板。 然后可以在衬底上配置多个霍尔效应感测元件，使得与多个霍尔效应感测元件相关联的感测平面的中心线朝向衬底的表面定位，这导致距离的减小 在多个霍尔效应感测元件的平面的中心线和相关联的偏置磁体的旋转轴线之间，从而优化多个霍尔效应感测元件的位置并且最小化对错位的灵敏度和感测精度的增加 。
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8.发明授权Wet/wet differential pressure sensor based on microelectronic packaging process 有权湿/湿差压传感器基于微电子封装工艺公开(公告)号：US08230745B2
公开(公告)日：2012-07-31
申请号：US12273960
申请日：2008-11-19
申请人： Paul Rozgo , Alistair Bradley , Ryan S. Jones , Lamar F. Ricks
发明人： Paul Rozgo , Alistair Bradley , Ryan S. Jones , Lamar F. Ricks
CPC分类号： G01L13/025 , G01L9/0054 , G01L19/0069 , G01L19/145 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/16151 , H01L2924/00014
摘要： Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.
摘要翻译： 基于微电子封装工艺的湿/湿差压传感器的方法和系统。 具有孔的顶盖可以通过压力感测隔膜连接到MEMS配置的压力感测模具的顶部，以便允许感测的介质与压力感测隔膜的顶侧接触。 具有用于应力消除的孔的可选约束可以附接到压力感测模的背面。 可以使用粘合剂和/或弹性体密封件和/或焊料来密封压力感测模具，允许感测到的介质与压力感测膜片的两侧接触，而不与引线接合和其它金属化表面接触。 MEMS配置的压力感应模具也可以用标准的芯片附着材料粘合到基板上。 这种微电子封装方法产生高性能和成本有效的解决方案，从而提供湿湿压力感测能力。
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公开(公告)号：US08175835B2
公开(公告)日：2012-05-08
申请号：US11383834
申请日：2006-05-17
申请人： Anthony M. Dmytriw , Lamar F. Ricks
发明人： Anthony M. Dmytriw , Lamar F. Ricks
CPC分类号： G01F25/0007 , G01F15/022
摘要： A sensor includes one or more sensor transducers coupled with a signal conditioning IC incorporating signal conditioning circuitry and memory devoted to storing end-user downloadable coefficients. In a preferred embodiment, the IC is an ASIC and the end-user downloadable coefficients are pre-selected by the end-user based on its needs, and the coefficients are pre-stored in the ASIC when the sensor is calibrated. This results in a more cost-effective and space-efficient sensor device with improved functionality over that available in the prior art.
摘要翻译： 一个传感器包括一个或多个传感器传感器，它与一个信号调理IC耦合，该信号调节IC结合了信号调节电路和用于存储最终用户可下载系数的存储器。 在优选实施例中，IC是ASIC，并且最终用户可下载系数由最终用户基于其需要预先选择，并且当传感器被校准时，系数被预先存储在ASIC中。 与现有技术相比，这导致了具有更高成本效益和节省空间的传感器装置，其功能性得到改进。
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公开(公告)号：US20110132096A1
公开(公告)日：2011-06-09
申请号：US12634551
申请日：2009-12-09
申请人： Lamar F. Ricks
发明人： Lamar F. Ricks
摘要： The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor. The on-board heating element may be configured to heat the pressure sensor assembly to various temperatures so that temperature related offsets and/or errors may be identified, and then compensated for with the zener diode trim network.
摘要翻译： 本公开一般涉及压力传感器，更具体地，涉及用于补偿压力传感器用于应力，温度和/或其他诱导偏移和/或误差的方法和装置。 在一个示例性实施例中，压力传感器可以包括安装到压力传感器封装的基板的压力感测芯片。 压力传感器芯片可以包括板载补偿。 在一些情况下，车载补偿可以包括位于压力感测芯片上或其中的车载加热元件和车载齐纳二极管调整网络。 齐纳二极管调整网络可以包括一个或多个齐纳二极管和一个或多个电阻元件，其中齐纳二极管可以被选择性地激活以“修整”电阻网络以补偿压力传感器的一个或多个偏移和/或误差。 车载加热元件可以被配置为将压力传感器组件加热到各种温度，使得可以识别温度相关的偏移和/或误差，然后用齐纳二极管调整网络进行补偿。
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