公开(公告)号：US20050087847A1

公开(公告)日：2005-04-28

申请号：US10998380

申请日：2004-11-29

申请人： Lee Kuan ,  Chong Hui ,  Lee Lai

发明人： Lee Kuan ,  Chong Hui ,  Lee Lai

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/91 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49537 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a semiconductor die having a circuit side and a back side, a multi layered leadframe attached to the die, a dense array of terminal contacts in electrical communication with the die, and a plastic body encapsulating the die and the leadframe. The leadframe includes circuit side leads attached to the circuit side of the die, and back side leads located proximate to the back side of the die. Both the circuit side leads and the back side leads are wire bonded to bond pads on the die. In addition, the back side leads provide electrical paths between the bond pads and selected terminal contacts that would otherwise be inaccessible due to line/space design rules. A method for fabricating the package includes the steps of: attaching the die to the circuit side leads, attaching the back side leads to the circuit side leads, wire bonding the die to the leads, encapsulating the die, and then forming the terminal contacts.

摘要翻译： 半导体封装包括具有电路侧和背面的半导体管芯，附接到管芯的多层引线框架，与管芯电连通的端子触头的密集阵列，以及封装管芯和引线框架的塑料体。 引线框架包括附接到模具的电路侧的电路侧引线以及靠近模具背面的背面引线。 电路侧引线和后侧引线都与引线接合在芯片上的接合焊盘上。 另外，背面引线提供接合焊盘和所选择的端子触点之间的电路径，否则由于线/空间设计规则将不可访问。 一种制造封装的方法，包括以下步骤：将裸片连接到电路侧引线，将背面引线连接到电路侧引线，将管芯引线接合到引线，封装管芯，然后形成端子触头。

公开(公告)号：US20060246622A1

公开(公告)日：2006-11-02

申请号：US11450485

申请日：2006-06-09

申请人： Dalson Kim ,  Chong Hui ,  Lee Lai ,  Roslan Said

发明人： Dalson Kim ,  Chong Hui ,  Lee Lai ,  Roslan Said

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  B33Y80/00 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at least partially over the first semiconductor device is disclosed. An outer peripheral portion of the second semiconductor device overhangs both the first semiconductor device and the substrate. Discrete conductive elements are placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of the discrete conductive elements pass outside side surface of the substrate. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

摘要翻译： 公开了一种组装方法，其包括提供衬底，将第一半导体器件固定在其第一表面上，并且至少部分地叠置在第一半导体器件上的至少第二半导体器件。 第二半导体器件的外周部分突出于第一半导体器件和衬底两者。 分散导电元件被放置在第二半导体器件的外周部分和衬底的第二表面之间。 离散导电元件的中间部分通过衬底的外侧表面。 还公开了根据该方法形成的组件和封装的半导体器件。

公开(公告)号：US20060197206A1

公开(公告)日：2006-09-07

申请号：US11064107

申请日：2005-02-22

申请人： Dalson Kim ,  Chong Hui ,  Lee Lai ,  Roslan Said

发明人： Dalson Kim ,  Chong Hui ,  Lee Lai ,  Roslan Said

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  B33Y80/00 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at least partially over the first semiconductor device is disclosed. An outer peripheral portion of the second semiconductor device overhangs both the first semiconductor device and the substrate. Discrete conductive elements are placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of the discrete conductive elements pass outside side surface of the substrate. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

摘要翻译： 公开了一种组装方法，其包括提供衬底，将第一半导体器件固定在其第一表面上，并且至少部分地叠置在第一半导体器件上的至少第二半导体器件。 第二半导体器件的外周部分突出于第一半导体器件和衬底两者。 分散导电元件被放置在第二半导体器件的外周部分和衬底的第二表面之间。 离散导电元件的中间部分通过衬底的外侧表面。 还公开了根据该方法形成的组件和封装的半导体器件。