公开(公告)号：US20090315160A1

公开(公告)日：2009-12-24

申请号：US12486998

申请日：2009-06-18

申请人： Lei Wang ,  Jin-Sung Lee ,  Qian Wang ,  Zhenging Zhao

发明人： Lei Wang ,  Jin-Sung Lee ,  Qian Wang ,  Zhenging Zhao

IPC分类号： H01L23/495 ,  H01L21/60 ,  H05K7/04 ,  H01R43/00

CPC分类号： H01L23/49541 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85947 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A prefabricated lead frame to bond a chip and a substrate, and a bonding method using the prefabricated lead frame. The prefabricated lead frame includes an inner ring, an outer ring, and a plurality of wires, wherein inner ends and outer ends of the wires are respectively connected to the inner ring and the outer ring, and the prefabricated lead frame has a wire shape corresponding to a chip and a substrate to be bonded. The prefabricated lead frame may be manufactured in batch production to increase the manufacturing efficiency of semiconductor devices, and the prefabricated lead frame may be used instead of a general wire bonding process.

摘要翻译： 用于结合芯片和基板的预制引线框架和使用预制引线框架的接合方法。 预制引线框架包括内环，外环和多根电线，其中电线的内端和外端分别连接到内环和外环，并且预制引线框架具有对应的线形状 连接到芯片和待接合的基板。 预制引线框架可以批量生产以提高半导体器件的制造效率，并且可以使用预制引线框架来代替通常的引线接合工艺。

公开(公告)号：US08084847B2

公开(公告)日：2011-12-27

申请号：US12486998

申请日：2009-06-18

申请人： Lei Wang ,  Jai-sung Lee ,  Qian Wang ,  Zhenging Zhao

发明人： Lei Wang ,  Jai-sung Lee ,  Qian Wang ,  Zhenging Zhao

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85947 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A prefabricated lead frame to bond a chip and a substrate, and a bonding method using the prefabricated lead frame. The prefabricated lead frame includes an inner ring, an outer ring, and a plurality of wires, wherein inner ends and outer ends of the wires are respectively connected to the inner ring and the outer ring, and the prefabricated lead frame has a wire shape corresponding to a chip and a substrate to be bonded. The prefabricated lead frame may be manufactured in batch production to increase the manufacturing efficiency of semiconductor devices, and the prefabricated lead frame may be used instead of a general wire bonding process.

摘要翻译： 用于结合芯片和基板的预制引线框架和使用预制引线框架的接合方法。 预制引线框架包括内环，外环和多根电线，其中电线的内端和外端分别连接到内环和外环，并且预制引线框架具有对应的线形状 连接到芯片和待接合的基板。 预制引线框架可以批量生产以提高半导体器件的制造效率，并且可以使用预制引线框架来代替通常的引线接合工艺。