公开(公告)号：US20240315615A1

公开(公告)日：2024-09-26

申请号：US18610147

申请日：2024-03-19

Applicant: Lextar Electronics Corporation

Inventor： Kai-Hung CHENG ,  Ku-Cheng LIN ,  Chun-Min LIN ,  Ke-Wei LIU

IPC: A61B5/1455

CPC classification number: A61B5/14552

Abstract: A detection element of biological subcutaneous features and a wearable device thereof are provided. The element for detecting biological subcutaneous features has a substrate, a light-detecting semiconductor chip, a grid structure, and a cover. The light-detecting semiconductor chip is located on the substrate for detecting red light or near-infrared light signals. The grid structure including a plurality of opaque light-absorbing blocking walls is located on the light-detecting semiconductor chip for blocking side light and increasing the proportion of near-vertical incident light. The cover is located on the grid structure and serves as a protection lid. The wearable device for detecting biological subcutaneous features has more than one light source of red light or near-infrared light and a plurality of detection elements. The arrangement of the opaque light-absorbing blocking walls that are parallel to each other are substantially parallel to the light-emitting directions of the light source.

公开(公告)号：US20250155609A1

公开(公告)日：2025-05-15

申请号：US18938136

申请日：2024-11-05

Applicant: Lextar Electronics Corporation

Inventor： Kai-Hung CHENG ,  Ku-Cheng LIN ,  Chun-Min LIN ,  Wei-Yi HSU

IPC: G02B3/02 ,  B60K28/06 ,  B60W40/08 ,  G02B3/00 ,  G02B7/02 ,  G06V20/59

Abstract: An optical module is provided. The optical module includes a resin package, a lens and a light emitting element. The resin package has a receiving groove. The lens is disposed on the resin package, and the lens includes a light emitting surface, a light entering surface, and a central axis, wherein the light entering surface has an asymmetric structure. The light emitting element is disposed in the receiving groove, wherein the light emitting element is disposed deviated from the central axis of the lens.

公开(公告)号：US20250160079A1

公开(公告)日：2025-05-15

申请号：US18939166

申请日：2024-11-06

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin CHEN ,  Chun-Min LIN

IPC: H01L33/60 ,  H01L33/50

Abstract: A light source module is provided. The light source module includes a substrate, a light source and a packaging material. The light source is disposed on the substrate, wherein the light source comprises a top surface and a lateral surface. The packaging material is disposed on the substrate and covers the light source, wherein a recess is formed on the packaging material, and the recess corresponds to the top surface.

公开(公告)号：US20240268019A1

公开(公告)日：2024-08-08

申请号：US18424225

申请日：2024-01-26

Applicant: Lextar Electronics Corporation

Inventor： Hsin-Lun SU ,  Jo-Hsiang CHEN ,  Chun-Min LIN

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/036 ,  H05K1/116 ,  H05K1/181 ,  H05K2201/0212 ,  H05K2201/10106

Abstract: A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.