公开(公告)号：US09771649B2

公开(公告)日：2017-09-26

申请号：US14704422

申请日：2015-05-05

Applicant: Linco Technology Co., Ltd.

Inventor： Chung-Yu Yeh ,  Huei-Chia Su ,  Cheng-Peng Yeh ,  Tsung-Wei Chang ,  Yi-Yuan Huang ,  Wan-Yu Huang ,  Mu-Sen Lu

IPC: C23C14/34 ,  C23C14/50 ,  H01L21/673 ,  H01L21/677 ,  H01J37/32 ,  C23C14/54 ,  C23C14/56 ,  H01J37/34

CPC classification number: C23C14/50 ,  C23C14/541 ,  C23C14/568 ,  H01J37/32715 ,  H01J37/3411 ,  H01L21/67336 ,  H01L21/67346 ,  H01L21/6776

Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.

公开(公告)号：US09611542B2

公开(公告)日：2017-04-04

申请号：US14702100

申请日：2015-05-01

Applicant: Linco Technology Co., Ltd.

Inventor： Cheng-Peng Yeh ,  Huei-Chia Su ,  Chung-Yu Yeh ,  Tsung-Wei Chang ,  Yi-Yuan Huang ,  Wan-Yu Huang ,  Mu-Sen Lu

IPC: B05C9/12 ,  C23C14/54 ,  C23C16/458 ,  H01L23/427 ,  B05C9/14 ,  C23C14/35 ,  B05C11/10

CPC classification number: C23C14/541 ,  B05C9/14 ,  B05C11/1021 ,  C23C14/35 ,  C23C14/56 ,  C23C16/4586 ,  H01J37/32752 ,  H01L21/67109 ,  H01L21/6776 ,  H01L23/427

Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.

公开(公告)号：US20160326637A1

公开(公告)日：2016-11-10

申请号：US14704422

申请日：2015-05-05

Applicant: Linco Technology Co., Ltd.

Inventor： Chung-Yu Yeh ,  Huei-Chia Su ,  Cheng-Peng Yeh ,  Tsung-Wei Chang ,  Yi-Yuan Huang ,  Wan-Yu Huang ,  Mu-Sen Lu

IPC: C23C14/50 ,  H01J37/34

CPC classification number: C23C14/50 ,  C23C14/541 ,  C23C14/568 ,  H01J37/32715 ,  H01J37/3411 ,  H01L21/67336 ,  H01L21/67346 ,  H01L21/6776

Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.

Abstract translation: 衬底载体单元包括衬底载体和相变材料。 衬底载体在其中限定了隔离空间。 相变材料被填充到衬底载体的隔离空间中，并且具有在18℃和95℃之间的熔点。相变材料能够从基底载体吸收热能作为潜热以改变 从固体到液体。

公开(公告)号：US20160318061A1

公开(公告)日：2016-11-03

申请号：US14702100

申请日：2015-05-01

Applicant: Linco Technology Co., Ltd.

Inventor： Cheng-Peng Yeh ,  Huei-Chia Su ,  Chung-Yu Yeh ,  Tsung-Wei Chang ,  Yi-Yuan Huang ,  Wan-Yu Huang ,  Mu-Sen Lu

IPC: B05C9/14 ,  B05C11/10

CPC classification number: C23C14/541 ,  B05C9/14 ,  B05C11/1021 ,  C23C14/35 ,  C23C14/56 ,  C23C16/4586 ,  H01J37/32752 ,  H01L21/67109 ,  H01L21/6776 ,  H01L23/427

Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.

Abstract translation: 膜沉积系统包括基板载体，成膜装置，输送装置和冷却装置。 衬底载体包括在其中限定隔离空间的载体主体和填充到隔离空间中且熔点在18℃至95℃之间的相变材料。相变材料能够 从载体吸收热能作为潜热，以将相变材料的相从固体改变为液体。 冷却装置被配置为从衬底载体吸收热能，以便将相变材料的相位从液体改变为固体。