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公开(公告)号:US20240071731A1
公开(公告)日:2024-02-29
申请号:US18495738
申请日:2023-10-26
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: Yi-Yuan HUANG , Yi-Cheng LIU
IPC: H01J37/32 , H01J37/305 , H01L21/3065 , H01L21/67
CPC classification number: H01J37/32633 , H01J37/3053 , H01J37/32458 , H01J37/32513 , H01J37/32623 , H01L21/3065 , H01L21/67069
Abstract: A substrate processing apparatus, comprising: a processing chamber having a plasma intake wall configured to receive plasma from a remote plasma source (RPS) and a surrounding wall having an inner surface defining an interior volume for receiving a substrate; and a substrate support having a substrate supporting surface facing the plasma intake wall and elevatably arranged in the interior volume of the processing chamber. The surrounding wall, in a cross-section of the processing chamber, includes: a first segment having a first width associated with a processing region for the substrate support; a second segment having a width greater than the first width that is further away from the plasma intake wall than the first segment.
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公开(公告)号:US20230245860A1
公开(公告)日:2023-08-03
申请号:US18299079
申请日:2023-04-12
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: Yi-Yuan HUANG , Cheng-Yu TSAO , Cheng-Sheng LIN , Tsung-Wei CHANG , Yi-Cheng LIU
IPC: H01J37/32
CPC classification number: H01J37/3244 , H01J37/32715 , H01J37/32807 , H01J2237/3341
Abstract: A diffusing plate includes a plate body including a rectangular hole-configuring region, a plurality of holes arranged in the rectangular hole-configuring region and arranged concentrically to form a first to an N-th rectangular patterns from an inside to an outside sequentially. Scales of the first to the N-th rectangular patterns are incrementally increased, and N is a positive integer. One portion of the holes are located in an area near a center of the rectangular hole-configuring region, another portion of the holes are located in four corner areas of the rectangular hole-configuring region, each of the holes has a diameter, and the diameter of the one portion of the holes is smaller than the diameter of the another portion of the holes.
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公开(公告)号:US11961714B2
公开(公告)日:2024-04-16
申请号:US17334855
申请日:2021-05-31
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: Yi-Yuan Huang , Yi-Cheng Liu
CPC classification number: H01J37/32357 , H01J37/32449 , H01J37/32522 , H01J37/32743 , H01J37/32834 , H01J2237/3341
Abstract: A substrate processing apparatus comprises a chamber member that defines an interior volume that has an aspect ratio. The chamber member comprises a pair of laterally opposing inlet walls and a loading port. Each of the pair of laterally opposing inlet walls has an inlet port configured to receive output from a remote plasma source. The loading port is arranged between the pair of inlet walls, configured to allow passage of a substrate into the interior volume.
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公开(公告)号:US20230398563A1
公开(公告)日:2023-12-14
申请号:US18074263
申请日:2022-12-02
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: Yi-Yuan HUANG , Yi-Cheng LIU
CPC classification number: B05B13/0235 , B05D3/0493 , B05D3/0218 , B05D3/007
Abstract: A parallel-type coating apparatus for coating at least one object to be coated carried by a carrier includes a double-layer vacuum chamber having feed and discharge chambers opposite to each other in a Z-direction, and a plurality of process chambers for performing at least a fixed point coating on the at least one object to be coated. The double-layer vacuum chamber and the process chambers are arranged in two juxtaposed rows in a Y-direction transverse to the Z-direction. A feed lifting mechanism is disposed in one of the double-layer vacuum chamber 3 and the process chambers, and includes a feed lifting seat movable in the Z-direction. A plurality of first conveying devices are respectively disposed in the other ones of the process chambers for conveying the carrier. A method for coating a multilayer film on at least one object to be coated carried by a carrier is also disclosed.
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公开(公告)号:US20220285132A1
公开(公告)日:2022-09-08
申请号:US17334855
申请日:2021-05-31
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: YI-YUAN HUANG , YI-CHENG LIU
IPC: H01J37/32
Abstract: A substrate processing apparatus comprises a chamber member that defines an interior volume that has an aspect ratio. The chamber member comprises a pair of laterally opposing inlet walls and a loading port. Each of the pair of laterally opposing inlet walls has an inlet port configured to receive output from a remote plasma source. The loading port is arranged between the pair of inlet walls, configured to allow passage of a substrate into the interior volume.
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公开(公告)号:US09771649B2
公开(公告)日:2017-09-26
申请号:US14704422
申请日:2015-05-05
Applicant: Linco Technology Co., Ltd.
Inventor: Chung-Yu Yeh , Huei-Chia Su , Cheng-Peng Yeh , Tsung-Wei Chang , Yi-Yuan Huang , Wan-Yu Huang , Mu-Sen Lu
IPC: C23C14/34 , C23C14/50 , H01L21/673 , H01L21/677 , H01J37/32 , C23C14/54 , C23C14/56 , H01J37/34
CPC classification number: C23C14/50 , C23C14/541 , C23C14/568 , H01J37/32715 , H01J37/3411 , H01L21/67336 , H01L21/67346 , H01L21/6776
Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.
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公开(公告)号:US09611542B2
公开(公告)日:2017-04-04
申请号:US14702100
申请日:2015-05-01
Applicant: Linco Technology Co., Ltd.
Inventor: Cheng-Peng Yeh , Huei-Chia Su , Chung-Yu Yeh , Tsung-Wei Chang , Yi-Yuan Huang , Wan-Yu Huang , Mu-Sen Lu
IPC: B05C9/12 , C23C14/54 , C23C16/458 , H01L23/427 , B05C9/14 , C23C14/35 , B05C11/10
CPC classification number: C23C14/541 , B05C9/14 , B05C11/1021 , C23C14/35 , C23C14/56 , C23C16/4586 , H01J37/32752 , H01L21/67109 , H01L21/6776 , H01L23/427
Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.
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公开(公告)号:US20170016110A1
公开(公告)日:2017-01-19
申请号:US14798555
申请日:2015-07-14
Applicant: Linco Technology Co., LTD.
Inventor: Yi-Yuan Huang , Mu-Sen Lu , Wen-Lung Chen
CPC classification number: H01L21/67126
Abstract: A double-valve device includes a base unit, two valve units and a transport unit. The base unit has a surrounding wall, an entrance wall connected to the surrounding wall and formed with an entrance opening, an exit wall connected to the surrounding wall oppositely of the entrance wall and formed with an exit opening, and a spacing wall disposed between the entrance and exit walls and formed with a pass-through opening. The surrounding wall, the entrance wall and the spacing wall cooperatively define a buffer chamber. The surrounding wall, the spacing wall and the exit wall cooperatively define a joint chamber. The valve units are respectively disposed in the buffer and joint chambers for respectively sealing and unsealing the entrance and pass-through openings.
Abstract translation: 双阀装置包括基座单元,两个阀单元和运输单元。 基座单元具有围壁,入口壁与周围壁连接并形成有入口,出口壁与入口壁相对的周壁连接并形成有出口, 入口和出口壁,并形成一个通过开口。 周围的壁,入口壁和间隔壁协同地限定了缓冲室。 周围的壁,间隔壁和出口壁协同地限定了联合室。 阀单元分别设置在缓冲器和接头室中,用于分别密封和开封入口和通孔。
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公开(公告)号:US20220254660A1
公开(公告)日:2022-08-11
申请号:US17168206
申请日:2021-02-05
Applicant: LINCO TECHNOLOGY CO., LTD.
Inventor: YI-YUAN HUANG , YI-CHENG LIU
IPC: H01L21/67 , H01L21/3065 , H01J37/305 , H01J37/32
Abstract: A substrate processing apparatus, comprising: a processing chamber having a plasma intake wall configured to receive plasma from a remote plasma source (RPS) and a surrounding wall having inner surface defining an interior volume for receiving a substrate; and a substrate support having a substrate supporting surface facing the plasma intake wall and elevatably arranged in the interior volume of the processing chamber. The surrounding wall, in a cross-section of the processing chamber, includes: a first segment having a first width associated with a processing region for the substrate support; a second segment having a width greater than the first width that is further away from the plasma intake wall than the first segment.
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10.
公开(公告)号:US20160326637A1
公开(公告)日:2016-11-10
申请号:US14704422
申请日:2015-05-05
Applicant: Linco Technology Co., Ltd.
Inventor: Chung-Yu Yeh , Huei-Chia Su , Cheng-Peng Yeh , Tsung-Wei Chang , Yi-Yuan Huang , Wan-Yu Huang , Mu-Sen Lu
CPC classification number: C23C14/50 , C23C14/541 , C23C14/568 , H01J37/32715 , H01J37/3411 , H01L21/67336 , H01L21/67346 , H01L21/6776
Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.
Abstract translation: 衬底载体单元包括衬底载体和相变材料。 衬底载体在其中限定了隔离空间。 相变材料被填充到衬底载体的隔离空间中,并且具有在18℃和95℃之间的熔点。相变材料能够从基底载体吸收热能作为潜热以改变 从固体到液体。
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