DOUBLE-VALVE DEVICE FOR A FILM DEPOSITION APPARATUS
    4.
    发明申请
    DOUBLE-VALVE DEVICE FOR A FILM DEPOSITION APPARATUS 审中-公开
    用于薄膜沉积装置的双阀装置

    公开(公告)号:US20170016110A1

    公开(公告)日:2017-01-19

    申请号:US14798555

    申请日:2015-07-14

    CPC classification number: H01L21/67126

    Abstract: A double-valve device includes a base unit, two valve units and a transport unit. The base unit has a surrounding wall, an entrance wall connected to the surrounding wall and formed with an entrance opening, an exit wall connected to the surrounding wall oppositely of the entrance wall and formed with an exit opening, and a spacing wall disposed between the entrance and exit walls and formed with a pass-through opening. The surrounding wall, the entrance wall and the spacing wall cooperatively define a buffer chamber. The surrounding wall, the spacing wall and the exit wall cooperatively define a joint chamber. The valve units are respectively disposed in the buffer and joint chambers for respectively sealing and unsealing the entrance and pass-through openings.

    Abstract translation: 双阀装置包括基座单元,两个阀单元和运输单元。 基座单元具有围壁,入口壁与周围壁连接并形成有入口,出口壁与入口壁相对的周壁连接并形成有出口, 入口和出口壁,并形成一个通过开口。 周围的壁,入口壁和间隔壁协同地限定了缓冲室。 周围的壁,间隔壁和出口壁协同地限定了联合室。 阀单元分别设置在缓冲器和接头室中,用于分别密封和开封入口和通孔。

    Film Deposition System Having a Substrate Carrier and a Cooling Device
    6.
    发明申请
    Film Deposition System Having a Substrate Carrier and a Cooling Device 有权
    具有基板载体和冷却装置的膜沉积系统

    公开(公告)号:US20160318061A1

    公开(公告)日:2016-11-03

    申请号:US14702100

    申请日:2015-05-01

    Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.

    Abstract translation: 膜沉积系统包括基板载体,成膜装置,输送装置和冷却装置。 衬底载体包括在其中限定隔离空间的载体主体和填充到隔离空间中且熔点在18℃至95℃之间的相变材料。相变材料能够 从载体吸收热能作为潜热,以将相变材料的相从固体改变为液体。 冷却装置被配置为从衬底载体吸收热能,以便将相变材料的相位从液体改变为固体。

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