公开(公告)号：US07650897B2

公开(公告)日：2010-01-26

申请号：US10536624

申请日：2003-11-28

Applicant: Lorenz Kopp ,  Henry Kunze ,  Ferdinand Wiener

Inventor： Lorenz Kopp ,  Henry Kunze ,  Ferdinand Wiener

IPC: B08B3/12 ,  B08B6/00

CPC classification number: H01L21/67051 ,  B05B1/205 ,  B08B3/02 ,  H05K3/0085 ,  H05K2203/0746 ,  H05K2203/1509

Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

Abstract translation: 描述了一种喷嘴布置，其可以特别地用作具有印刷电路板的水平吞吐量的镀锌系统中的流动喷嘴。 喷嘴装置包括具有至少一个流体供给开口的纵向壳体（2），用于输送用于处理工件的处理流体，例如印刷电路板，并且优选地，多个用于释放的开槽流体输送开口（8） 治疗液。 在壳体（2）中，形成流体通道（5），用于将处理流体从流体供给口供给流体输送口（8）。 为了实现流体输送口（8）处理流体最均匀的流速，（a）用于处理流体的流体通道（5）的通过量从纵向方向上的流体供给口连续地减少 （2）和/或（b）在从流体输送口（8）输送流体之前提供储存室。

公开(公告)号：US20060102213A1

公开(公告)日：2006-05-18

申请号：US10536624

申请日：2003-11-28

Applicant: Lorenz Kopp ,  Henry Kunze ,  Ferdinand Wiener

Inventor： Lorenz Kopp ,  Henry Kunze ,  Ferdinand Wiener

IPC: B08B3/02

CPC classification number: H01L21/67051 ,  B05B1/205 ,  B08B3/02 ,  H05K3/0085 ,  H05K2203/0746 ,  H05K2203/1509

Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

Abstract translation: 描述了一种喷嘴布置，其可以特别地用作具有印刷电路板的水平吞吐量的镀锌系统中的流动喷嘴。 喷嘴装置包括具有至少一个流体供给开口的纵向壳体（2），用于输送用于处理工件的处理流体，例如印刷电路板，并且优选地，多个用于释放的开槽流体输送开口（8） 治疗液。 在壳体（2）中，形成流体通道（5），用于将处理流体从流体供给口供给流体输送口（8）。 为了实现流体输送口（8）处理流体最均匀的流速，（a）用于处理流体的流体通道（5）的通过量从纵向方向上的流体供给开口连续地减少 （2）和/或（b）在从流体输送口（8）输送流体之前提供储存室。

公开(公告)号：US06217736B1

公开(公告)日：2001-04-17

申请号：US09403397

申请日：1999-10-20

Applicant: Lorenz Kopp ,  Wolfang Plöse ,  Ralf-Peter Wachter

Inventor： Lorenz Kopp ,  Wolfang Plöse ,  Ralf-Peter Wachter

IPC: C25D500

CPC classification number: H05K3/241 ,  C25D17/001 ,  C25D17/007

Abstract: The apparatus according to the invention is used for electrolytically treating a board-shaped substrate to be treated, preferably printed circuit boards, in a continuous system, through which the item to be treated is guidable in a plane of conveyance in a substantially horizontal direction of conveyance, the apparatus having counter-electrodes (2), which are situated substantially parallel to one another opposite the plane of conveyance, and screens (11) for shielding from high current density fields in the edge region of the item to be treated (1), said screens being disposed between the plane of conveyance and the counter-electrodes, the screens each being in the form of at least two flat portions (12,13), which are disposed substantially parallel to each other, one portion (13) of the screens being disposed so as to lie opposite the plane of conveyance, and the other portion (12) being disposed so as to lie opposite the counter-electrodes, and the screens being mounted so as to be displaceable in a direction (20) which extends substantially parallel to the plane of conveyance and substantially perpendicularly relative to the direction of conveyance (23). The usable region of printed circuit board blanks can be extended by this apparatus down to an edge of about 12 mm, where the required tolerance of the layer thickness of the deposited metal cannot be maintained.

Abstract translation: 根据本发明的装置用于在连续系统中对待处理的板状基板，优选印刷电路板进行电解处理，通过该连续系统，待处理物体可沿着输送平面中的大致水平方向 所述设备具有相对电极（2），所述对置电极（2）基本上彼此平行于与所述输送平面相对平行;以及用于屏蔽所述待处理物品的边缘区域中的高电流密度场的屏幕（11） ），所述屏幕设置在所述输送平面和所述对置电极之间，所述屏幕各自为基本上彼此平行设置的至少两个平坦部分（12,13）的形式，一个部分（13） 所述屏幕被布置为与所述输送平面相对，并且所述另一部分（12）设置成与所述对置电极相对，并且所述屏幕被安装成 可沿着基本上平行于输送平面延伸的方向（20）移位，并且基本上相对于输送方向（23）垂直。 印刷电路板毛坯的可用区域可以通过该装置延伸到约12mm的边缘，其中不能保持沉积金属的层厚度所需的公差。

公开(公告)号：US06071400A

公开(公告)日：2000-06-06

申请号：US162659

申请日：1998-09-29

Applicant: Rolf Schroder ,  Reinhard Schneider ,  Lorenz Kopp ,  Thomas Rydlewski ,  Horst Steffen

Inventor： Rolf Schroder ,  Reinhard Schneider ,  Lorenz Kopp ,  Thomas Rydlewski ,  Horst Steffen

IPC: H05K3/06 ,  C25D5/02 ,  C25D5/06 ,  C25D17/10 ,  C25F7/00 ,  H05K3/07 ,  H05K3/24 ,  B23H5/00

CPC classification number: H05K3/07 ,  C25D17/005 ,  C25D17/008 ,  C25D5/02 ,  C25F7/00 ,  H05K3/241

Abstract: The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long. Counter-electrodes, which may be also designed as movable brushes, are situated preferably between the brush electrodes. In electrochemical processes, in which metal is deposited, the brushes are deplated cyclically. For this purpose, various possible solutions are proposed.

Abstract translation: PCT No.PCT / EP97 / 01544 Sec。 371日期1997年7月16日 102（e）日期1997年7月16日PCT 1997年3月26日PCT公布。 出版物WO97 / 37062 日期1997年10月9日本发明涉及一种用于通过处理液体处理的物品上的电相互绝缘的导电区域的电化学处理的方法和装置。 绝缘的，例如电路板上的蚀刻结构不能用已知的方法进行电化学处理，因为不存在来自各个区域的电泳电源的电连接。 根据本发明，这种连接是通过用它们的导电和细纤维接触要处理的结构化表面的刷产生的。 横向于运输方向布置的大量刷子涉及以下事实：待处理物品上彼此绝缘地布置的所有导电区域电连接至少一个接一个， 实现的接触时间足够长。 也可以设计为可动刷的对电极优选位于刷电极之间。 在其中沉积金属的电化学工艺中，电刷循环地脱落。 为此，提出了各种可能的解决方案。

公开(公告)号：US20050076837A1

公开(公告)日：2005-04-14

申请号：US10501492

申请日：2003-02-20

Applicant: Lorenz Kopp

Inventor： Lorenz Kopp

IPC: C25D19/00 ,  C25D17/28 ,  C25D21/00 ,  C25D21/12 ,  C25F7/00 ,  H05K3/00 ,  B05D1/02 ,  B05C11/00

CPC classification number: C25D21/12 ,  C25D17/28 ,  C25F7/00 ,  H05K3/0085

Abstract: The problem confronting manufacturers of printed circuit boards (2) of differing thickness is that, as the current density increases and the diameter of the holes decreases, the treatment effect on various locations on the outer side of the boards and inside the holes becomes more irregular. To resolve this problem, a conveyorized horizontal processing line and a method of wet-processing printed circuit boards (2) is described. To manufacture the printed circuit boards (2), data about the thickness of the workpiece (2) are acquired before it enters the conveyorized processing line and are stored in a data memory, the workpiece (2) is conveyed through the conveyorized processing line and a structural component, which is provided with at least one transport member (3) for the workpiece (2) and with at least one processing facility (6) and which is disposed above the conveying path (100) in the conveyorized processing line, is adjusted in such a manner that the structural component is raised or lowered and/or pivoted relative to the conveying path as a function of the thickness of the respective one of the workpieces passing said structural component.

Abstract translation: 不同厚度的印刷电路板（2）制造商面临的问题是，随着电流密度的增加和孔的直径减小，对板的外侧和孔内部的各种位置的处理效果变得更加不规则 。 为了解决这个问题，描述了传送带式水平处理线和湿式处理印刷电路板（2）的方法。 为了制造印刷电路板（2），关于工件（2）的厚度的数据在进入传送带处理线之前被获取并被存储在数据存储器中，工件（2）被传送通过传送带处理线 设置有用于工件（2）的至少一个输送构件（3）和至少一个处理设备（6）并且设置在输送机处理线路中的输送路径（100）上方的结构部件是 调节成使结构部件相对于输送路径升高或降低和/或枢转，作为通过所述结构部件的各个工件的厚度的函数。

公开(公告)号：US06319383B1

公开(公告)日：2001-11-20

申请号：US09485785

申请日：2000-03-27

Applicant: Lorenz Kopp ,  Peter Langheinrich ,  Reinhard Schneider

Inventor： Lorenz Kopp ,  Peter Langheinrich ,  Reinhard Schneider

IPC: C25D500

CPC classification number: C25D17/06 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  H05K3/241

Abstract: The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to be treated, guided in a horizontal plane of conveyance in a continuous electroplating plant. The device has counter-electrodes 2, 3 located opposite the plane of conveyance and clamps 4, secured to a continuously revolving means of conveyance 5, for contacting the items to be treated 7. The clamps 4 have a lower portion 14 and an upper portion 13 which are electrically conductive, have a surface consisting of metal, are moveable in relation to one another and respectively have at least one contact point 6 for the items to be treated 7. In addition, at least one current source is provided to produce a flow of current between the counter-electrodes and the items to be treated. To avoid the pirate cathode effect of the contact clamps 4 during electrolytic metallisation, there are disposed between the anodes 2, 3 and the clamps 4 upper and lower shields 15, 16 for the electrical field, which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance, and the clamp portions 13, 14 do not quite come into contact with the shields.

Abstract translation: 本发明涉及一种在待处理物品的电解处理过程中，在待处理的平面物品（例如导体箔和印刷电路板）上的电接触点上的金属层厚度的装置和方法， 在连续电镀厂的水平输送平面内。 该装置具有与传送平面相对的对置电极2,3，固定在连续旋转的传送装置5上，用于接触待处理物品7。夹具4具有下部14和上部 13具有导电性，具有由金属组成的表面，可以相对于彼此移动，并且分别具有用于待处理物品7的至少一个接触点6.另外，提供至少一个电流源以产生 在对电极和待处理物品之间的电流流动。为了避免在电解金属化期间接触夹具4的海盗阴极效应，设置在阳极2,3和夹具4上和下屏蔽件15,16之间 对于电场，其延伸得如此靠近传送平面，使待处理的物品在传送平面中被引导，并且夹持部分13,14不完全与屏蔽件接触。

公开(公告)号：US6083374A

公开(公告)日：2000-07-04

申请号：US91560

申请日：1998-06-18

Applicant: Lorenz Kopp

Inventor： Lorenz Kopp

IPC: C25D21/14

CPC classification number: C25D21/14

Abstract: The invention relates to a method for maintaining constant concentrations of substances contained in an electrolytic treatment bath, preferably in baths with aqueous solutions. In order to regenerate the continual depletion of chemicals, substance concentrates are added to the baths according to known methods. The rapid increase in concentrations of damaging substances in the processing solution is disadvantageous. In order to reduce this build-up, a further metering method is known, namely the continuous replacement of bath solution by creating a bath overflow. The addition of bath solution with the bath concentration is balanced out by the overflow. As a consequence of evaporation and entrainment this method also leads to the fact that the operating concentration cannot be maintained for a long period of time in chemically critical baths. With the invention, this problem is resolved by continuous or intermittent removal of bath solution in a defined quantity and addition of fresh bath solution preferably in the same quantity. The changes in the concentrations of substances in the bath occurring through evaporation and entrainment are compensated for completely independently of the metering.

Abstract translation: PCT No.PCT / EP97 / 00097 Sec。 371日期1998年6月18日 102（e）日期1998年6月18日PCT 1997年1月10日PCT PCT。 WO97 / 25456 PCT公开号 日期1997年7月17日本发明涉及一种用于保持电解处理浴中所含物质的恒定浓度的方法，优选在含有水溶液的浴中。 为了再生化学品的不断耗尽，根据已知方法将物质浓缩物加入浴中。 处理液中有害物质的浓度迅速增加是不利的。 为了减少这种积聚，已知另外的计量方法，即通过产生浴溢出来连续更换浴溶液。 加入具有浴浓度的浴液通过溢流平衡。 作为蒸发和夹带的结果，该方法还导致在化学临界浴中长时间不能维持操作浓度的事实。 通过本发明，通过连续或间歇地除去规定量的浴溶液并且优选以相同量添加新鲜浴溶液来解决该问题。 通过蒸发和夹带发生的浴中物质浓度的变化可以完全独立于计量进行补偿。

公开(公告)号：US06350362B1

公开(公告)日：2002-02-26

申请号：US09485786

申请日：2000-03-28

Applicant: Jens-Eric Geisler ,  Ralf-Peter Wachter ,  Lorenz Kopp ,  Manfred Maurer

Inventor： Jens-Eric Geisler ,  Ralf-Peter Wachter ,  Lorenz Kopp ,  Manfred Maurer

IPC: C25D2118

CPC classification number: C25D21/14 ,  H05K3/241

Abstract: A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally contains compounds of an electrochemically reversible redox system. With the oxidized form of said system, metal is dissolved in an ion generator 1, traversed by the fluid, so that these compounds are thereby reduced. For the deposition of metal, the dissolved metal ions on the item to be treated are reduced. The compounds of the redox system in the reduced form are oxidized again on the insoluble anodes in the electroplating system 13. In order to keep the concentration of the metal ions in the electrolytic fluid constant, at least a portion of the electrolytic fluid, contained in the electroplating system, is conducted through one or a plurality of electrolytic auxiliary cells 6.

Abstract translation: 描述了一种用于调节电解液中金属离子浓度的方法和装置，其用于沉积具有不溶性阳极的金属，并且还包含电化学可逆氧化还原体系的化合物。 利用所述系统的氧化形式，将金属溶解在离子发生器1中，由流体穿过，从而减少这些化合物。 为了沉积金属，待处理物品上溶解的金属离子减少。 还原形式的氧化还原体系的化合物在电镀系统13中的不溶性阳极上再次被氧化。为了保持电解液中金属离子的浓度恒定，至少包含一部分电解液 电镀系统通过一个或多个电解辅助电池6传导。

公开(公告)号：US06238529B1

公开(公告)日：2001-05-29

申请号：US09403657

申请日：1999-11-22

Applicant: Jens Geissler ,  Thomas Rydlewski ,  Lorenz Kopp ,  Ralf-Peter Wächter ,  Reinhard Schneider

Inventor： Jens Geissler ,  Thomas Rydlewski ,  Lorenz Kopp ,  Ralf-Peter Wächter ,  Reinhard Schneider

IPC: C25D1700

CPC classification number: H05K3/241 ,  C25D5/08 ,  C25D17/00

Abstract: The apparatus for electrolytically treating printed circuit boards 3, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: Counter-electrodes 1,2 are disposed opposite the plane of conveyance and substantially parallel thereto on at least one side, so that electrolytic chambers 4,5 are formed between counter-electrodes, which are situated opposite one another, or between the counter-electrodes and the plane of conveyance, the counter-electrodes forming respective substantially continuous electrode faces. Guide elements 7,8 for the printed circuit boards are disposed in the electrolytic chamber. Contact elements 11 are provided for the electrical contacting of the printed circuit boards. Electrolyte spraying arrangements 13 are also provided for conveying the electrolytic fluid towards the surfaces of the printed circuit boards. Openings are provided in the counter-electrodes. The electrolyte spraying arrangements are disposed on the sides of the counter-electrodes remote from the plane of conveyance in such a manner that electrolytic fluid, emerging from the arrangements, can pass the counter-electrodes substantially unhindered at the locations of the openings and can pass to the surfaces of the printed circuit boards.

Abstract translation: 用于电解处理印刷电路板3的装置，其中印刷电路板在输送的大致水平方向上连续引导的装置具有以下特征：对置电极1,2与 在至少一个侧面上大致平行地输送电解室4,5，使电解室4,5形成在相对电极之间或相对电极和输送平面之间的相对电极之间，对电极形成相应的电极 基本连续的电极面。 用于印刷电路板的引导元件7,8设置在电解室中。 接触元件11被设置用于印刷电路板的电接触。 还提供电解质喷涂装置13用于将电解液输送到印刷电路板的表面。 开口设置在对置电极中。 电解液喷射装置设置在远离输送平面的对置电极的侧面上，使得从布置出来的电解液可以在开口的位置上基本上不受阻碍地通过对电极并且可以通过 到印刷电路板的表面。

公开(公告)号：US5932081A

公开(公告)日：1999-08-03

申请号：US849413

申请日：1997-05-19

Applicant: Lorenz Kopp ,  Helmut Scharrer

Inventor： Lorenz Kopp ,  Helmut Scharrer

IPC: C25D17/08 ,  C25D17/06 ,  C25D21/00 ,  C25D21/12 ,  H05K3/18 ,  H05K3/24 ,  C25D5/00

CPC classification number: H05K3/241 ,  C25D17/06

Abstract: The invention relates to a method and device for electroplating plate-shaped product, particularly printed circuit boards, in horizontal continuous plants with optional sequence of product, revolving contacting means serving for electrical connection of a source of bath current via wiper rails with the product, and the beginning and end of each individual product item at the inlet to the electroplating plant, and the transport speed of the product, being detected with the aid of sensors, said sensors sending sensor signals to a control system which ascertains whether a product item is present at the gripping point of the contacting means or not, the contacting means being connected electrically and in the electroplating sense in a low-resistance manner to the sources of bath current only when product is present in the region of contacts of the contacting means.

Abstract translation: PCT No.PCT / DE96 / 00261 Sec。 371日期1997年5月19日 102（e）日期1997年5月19日PCT提交1996年2月12日PCT公布。 出版物WO96 / 24707 日期：1996年8月15日本发明涉及一种用于电镀板形产品，特别是印刷电路板的方法和装置，其具有可选的产品序列的水平连续工厂，用于通过擦拭器电连接浴电流源的旋转接触装置 产品的轨道以及电镀厂入口处的每个单独产品的开始和结束以及借助于传感器检测到的产品的运输速度，所述传感器将传感器信号发送到控制系统，该控制系统确定 无论产品物品是否存在于接触装置的夹持点处，仅当产品存在于接触区域中时，接触装置电连接并且以电镀方式以低电阻方式连接到电流源 的接触装置。