Laser capture microdissection pressure plate and transfer arm
    6.
    发明授权
    Laser capture microdissection pressure plate and transfer arm 失效
    激光捕获显微切割压板和转臂

    公开(公告)号:US06184973B2

    公开(公告)日:2001-02-06

    申请号:US09058711

    申请日:1998-04-10

    IPC分类号: G01N100

    摘要: Systems and methods for laser capture microdissection are disclosed. A laser capture microdissection method includes: providing a sample that is to undergo laser capture microdissection; positioning the sample within an optical axis of a laser capture microdissection instrument; providing a transfer film carrier removably positioned in a transfer film carrier handling subsystem, the transfer film carrier having a substrate surface and a laser capture microdissection transfer film coupled to the substrate surface; and then placing the laser capture microdissection transfer film in juxtaposition with the sample by moving the transfer film carrier handling subsystem, the laser capture microdissection transfer film being placed in juxtaposition with a pressure sufficient to allow laser capture microdissection transfer of a portion of the sample to the laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of the sample to the laser capture microdisection film; and then transferring a portion of the sample to the laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of the sample to the laser capture microdissection transfer film. Transferring includes moving the laser capture microdissection transfer film and the portion of the sample away from the remainder of the sample with the transfer film carrier handling subsystem. The transfer film carrier handling subsystem can be mounted on an inverted microscope. The systems and methods provide the advantages of increased speed and much lower rates of contamination

    摘要翻译: 公开了用于激光捕获显微切割的系统和方法。 激光捕获显微切割方法包括:提供要进行激光捕获显微切割的样品; 将样品定位在激光捕获显微切割仪器的光轴内; 提供可移除地定位在转印膜载体处理子系统中的转印膜载体,所述转印膜载体具有耦合到所述基板表面的基板表面和激光捕获显微切割转印膜; 然后通过移动转印膜载体处理子系统将激光捕获显微切割转印膜与样品并置放置,激光捕获显微切割转印膜以足以允许激光捕获将样品的一部分的显微切割转移到 激光捕获显微切割转移膜,而不强制将其余样品的非特异性转移到激光捕获微分解膜; 然后将样品的一部分转移到激光捕获显微切割转移膜,而不会将剩余的样品的非特异性转移到激光捕获显微切割转移膜。 转移包括使用转印膜载体处理子系统将激光捕获显微切割转移膜和样品的一部分移离样品的其余部分。 转印膜载体处理子系统可以安装在倒置显微镜上。 这些系统和方法提供了增加速度和低得多的污染率的优点

    Laser capture microdissection method and apparatus
    9.
    发明授权
    Laser capture microdissection method and apparatus 失效
    激光捕获显微解剖方法和装置

    公开(公告)号:US06469779B2

    公开(公告)日:2002-10-22

    申请号:US09018452

    申请日:1998-02-04

    IPC分类号: G01N100

    摘要: Systems and methods for laser capture microdissection are disclosed. A method of laser capture microdissection includes providing a sample that is to undergo laser capture microdissection; positioning said sample within an optical axis of a laser capture microdissection instrument; providing a transfer film carrier having a substrate surface and a laser capture microdissection transfer film coupled to said substrate surface; placing said laser capture microdissection transfer film in juxtaposition with said sample with a pressure sufficient to allow laser capture microdissection transfer of a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdisection film; and then transferring a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdissection transfer film. The systems and methods provide the advantages of increased speed and much lower rates of contamination.

    摘要翻译: 公开了用于激光捕获显微切割的系统和方法。 激光捕获显微切割的方法包括提供要进行激光捕获显微切割的样品; 将所述样品定位在激光捕获显微切割仪器的光轴内; 提供具有衬底表面的转移膜载体和耦合到所述衬底表面的激光俘获显微解剖转移膜; 将所述激光捕获显微切割转移膜与所述样品并置,其压力足以允许激光捕获将所述样品的一部分的显微切割转移到所述激光捕获显微切割转移膜,而不强制将所述样品的剩余部分非特异性转移到所述激光捕获 微分片; 然后将所述样品的一部分转移到所述激光捕获显微切割转移膜,而不会将所述样品的剩余部分非特异性转移到所述激光捕获显微切割转移膜。 这些系统和方法提供了增加速度和低得多的污染率的优点。