公开(公告)号：US12040592B2

公开(公告)日：2024-07-16

申请号：US17445786

申请日：2021-08-24

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Hao Huang ,  Siu Kwan Cheung ,  Huanlin Zhu ,  Lijun Zhu

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/498 ,  H01S5/02315 ,  H01S5/183

CPC classification number: H01S5/02469 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49833 ,  H01S5/02315 ,  H01S5/183

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

公开(公告)号：US12055633B2

公开(公告)日：2024-08-06

申请号：US17109943

申请日：2020-12-02

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Huanlin Zhu ,  Lijun Zhu ,  Raman Srinivasan ,  Ed Murphy

IPC: G01S17/89 ,  G01S7/4865 ,  G03B17/02 ,  H01S5/183 ,  H05K9/00

CPC classification number: G01S17/89 ,  G01S7/4865 ,  G03B17/02 ,  H01S5/183 ,  H05K9/0007

Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.

公开(公告)号：US11804695B2

公开(公告)日：2023-10-31

申请号：US17247660

申请日：2020-12-18

Applicant: Lumentum Operations LLC

Inventor： John Michael Miller ,  Lijun Zhu ,  Huanlin Zhu ,  Benjamin Kesler ,  Ajit Vijay Barve

IPC: H01S5/183 ,  F21S8/00 ,  F21Y115/30

CPC classification number: H01S5/18302 ,  F21S8/003 ,  F21Y2115/30

Abstract: In some implementations, an emitter module may include an emitter layer including a first emitter array configured to produce a first beam that provides flood illumination, and a second emitter array configured to produce a second beam that provides spot illumination. The emitter module may include a first optics layer, positioned in front of the emitter layer, that includes a first collimating lens positioned in front of the first emitter array, and a second collimating lens positioned in front of the second emitter array. The emitter module may include a second optics layer, positioned in front of the first optics layer, that includes an optical diffuser positioned in front of the first collimating lens, and a beamsplitter grating positioned in front of the second collimating lens.

公开(公告)号：US12166331B2

公开(公告)日：2024-12-10

申请号：US17301261

申请日：2021-03-30

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Siu Kwan Cheung ,  Lijun Zhu ,  Raman Srinivasan ,  Huanlin Zhu

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/02315 ,  H01S5/02355 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

Abstract: An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.

公开(公告)号：US11955770B2

公开(公告)日：2024-04-09

申请号：US17301332

申请日：2021-03-31

Applicant: Lumentum Operations LLC

Inventor： Hao Huang ,  Mikhail Dolganov ,  Huanlin Zhu ,  Lijun Zhu

IPC: H01S3/00 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/042 ,  H01S5/068 ,  H01S5/183

CPC classification number: H01S5/0428 ,  H01S5/02345 ,  H01S5/0261 ,  H01S5/06825 ,  H01S5/183

Abstract: A driver circuit may include a source, a first circuit path, and a second circuit path. The a first circuit path may be connected to the source and include a first anode pad, a first set of connecting elements to connect the first anode pad to an anode of an optical load, a second anode pad that is separate from the first anode pad, a second set of connecting elements to connect the anode of the optical load to the second anode pad, and a switch. The switch being in a closed state causes current to charge the first set of connecting elements and the second set of connecting elements through the first circuit path. The switch transitioning from the closed state to the open state causes the first set of connecting elements to discharge current through the second circuit path to provide an electrical pulse to the optical load.