公开(公告)号：US09854674B1

公开(公告)日：2017-12-26

申请号：US15460683

申请日：2017-03-16

Applicant: LuxNet Corporation

Inventor： Ho-I Chen ,  Yi-Ching Chiu ,  Bo-Wei Liu ,  Hsing-Yen Lin ,  Hua-Hsin Su

IPC: H05K1/00 ,  H05K1/14 ,  H01R12/61 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/141 ,  H01R4/02 ,  H01R4/021 ,  H01R12/61 ,  H01R12/62 ,  H01R12/707 ,  H05K1/0245 ,  H05K1/112 ,  H05K2201/041 ,  H05K2201/058

Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.

公开(公告)号：US09847307B1

公开(公告)日：2017-12-19

申请号：US15459523

申请日：2017-03-15

Applicant: LuxNet Corporation

Inventor： Ho-I Chen ,  Po-Chao Huang ,  Yi-Ching Chiu ,  Pi-Cheng Law ,  Hua-Hsin Su

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/00 ,  H01L23/373 ,  H01P3/08 ,  H04B10/80

CPC classification number: H01L23/66 ,  H01L23/3731 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6638 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/19107 ,  H01P3/081 ,  H04B10/801

Abstract: The present invention relates to a two-end driving, high-frequency sub-substrate structure, comprising a sub-substrate body, wherein: the sub-substrate body has an upper side provided with a first signal pad area and a second signal pad area, the first signal pad area and the second signal pad area are symmetric with respect to each other, each of the first signal pad area and the second signal pad area extends from one of two lateral portions of the sub-substrate body in an extending direction toward a center of the sub-substrate body and terminates in an end, the end of the first signal pad area is adjacent to but spaced from the end of the second signal pad area, the first signal pad area is configured for supporting a semiconductor chip provided thereon, the second signal pad area is provided with a jumper wire connected to an electrode of the semiconductor chip, there are two grounding pad areas provided respectively on two lateral sides of the first signal pad area and the second signal pad area and constituting a portion of a coplanar waveguide, the sub-substrate body has an inner layer or bottom side that is provided with a grounding layer or combined with a grounding layer.