公开(公告)号：US20150235121A1

公开(公告)日：2015-08-20

申请号：US14183427

申请日：2014-02-18

Applicant: LuxVue Technology Corporation

Inventor： Vikram Pavate ,  Andreas Bibl

IPC: G06K19/077 ,  H05K3/20 ,  H05K3/14 ,  H05K3/34 ,  H05K3/12

CPC classification number: G06K19/07783 ,  H05K1/0293 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.

Abstract translation: 描述了集成微芯片，集成微芯片的方法和微芯片集成系统。 在一个实施例中，诸如微型RFID芯片或集成无源器件（IPD）的微芯片被静电转印并结合到包括断线的导电图案。 在一个实施例中，线断裂通过合适的切割技术形成，例如激光激光烧蚀，离子束蚀刻或具有化学蚀刻的光刻以适应微芯片。

公开(公告)号：US09367094B2

公开(公告)日：2016-06-14

申请号：US14109864

申请日：2013-12-17

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/02 ,  G06F1/16 ,  G06F3/041 ,  G06F3/042 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性的系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：US09542638B2

公开(公告)日：2017-01-10

申请号：US14183427

申请日：2014-02-18

Applicant: LuxVue Technology Corporation

Inventor： Vikram Pavate ,  Andreas Bibl

IPC: G06K19/06 ,  G06K19/077 ,  H05K1/02 ,  H05K1/16

CPC classification number: G06K19/07783 ,  H05K1/0293 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.

Abstract translation: 描述了集成微芯片，集成微芯片的方法和微芯片集成系统。 在一个实施例中，诸如微型RFID芯片或集成无源器件（IPD）的微芯片被静电转印并结合到包括断线的导电图案。 在一个实施例中，线断裂通过合适的切割技术形成，例如激光激光烧蚀，离子束蚀刻或具有化学蚀刻的光刻以适应微芯片。

公开(公告)号：US20150169011A1

公开(公告)日：2015-06-18

申请号：US14109864

申请日：2013-12-17

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F1/18 ,  G06F3/042 ,  G06F1/16 ,  G06F3/041

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性的系统应用包括可穿戴的，可滚动的和可折叠的显示器。