公开(公告)号：US09217541B2

公开(公告)日：2015-12-22

申请号：US13894332

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Stephen Bathurst ,  Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L29/06 ,  F21K99/00 ,  H01L23/00 ,  H01L33/00

CPC classification number: F21K9/00 ,  B81C99/002 ,  H01L24/00 ,  H01L33/0095 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10336 ,  H01L2924/10342 ,  H01L2924/10346 ,  H01L2924/10349 ,  H01L2924/10375 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  Y10T29/49002 ,  H01L2224/03 ,  H01L2924/00

Abstract: A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.

Abstract translation: 稳定结构包括载体基底上的稳定层。 稳定层包括分段腔阵列。 微器件阵列在分级腔阵列内。 每个微器件横向地附接到从分级腔的侧壁横向延伸的剪切释放柱。 从转移头阵列向微器件阵列施加压力以将微器件阵列剪切离开剪切释放柱。 使用转移头阵列从载体衬底拾取剪切的微器件。

公开(公告)号：US20140340900A1

公开(公告)日：2014-11-20

申请号：US13894332

申请日：2013-05-14

Applicant: Luxvue Technology Corporation

Inventor： Stephen Bathurst ,  Hsin-Hua Hu ,  Andreas Bibl

IPC: H05K7/08 ,  F21K99/00

CPC classification number: F21K9/00 ,  B81C99/002 ,  H01L24/00 ,  H01L33/0095 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10336 ,  H01L2924/10342 ,  H01L2924/10346 ,  H01L2924/10349 ,  H01L2924/10375 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  Y10T29/49002 ,  H01L2224/03 ,  H01L2924/00

Abstract: A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.

Abstract translation: 稳定结构包括载体基底上的稳定层。 稳定层包括分段腔阵列。 微器件阵列在分级腔阵列内。 每个微器件横向地附接到从分级腔的侧壁横向延伸的剪切释放柱。 从转移头阵列向微器件阵列施加压力以将微器件阵列剪切离开剪切释放柱。 使用转移头阵列从载体衬底拾取剪切的微器件。