公开(公告)号：US20130277836A1

公开(公告)日：2013-10-24

申请号：US13923011

申请日：2013-06-20

Applicant: MCube, Inc.

Inventor： DAVE PAUL JENSEN ,  HONG WAN ,  JON EWANICH

IPC: H01L23/00

CPC classification number: H01L24/05 ,  B81B3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/1145 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01047

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Abstract translation: 用于使用具有互连的垂直安装来制造传感器或电子设备的方法和结构。 该方法包括提供所形成的装置，其包括形成在模具构件上的至少一个传感器或电子装置，其具有在其上形成有一个或多个导电材料的接触区域。 所得到的器件然后可以在接触区域的附近被单个化，以形成一个或多个单个模具，每一个具有单个的表面区域。 单个模具可以耦合到具有第一表面区域的衬底构件，使得单个模具的单个表面区域耦合到第一表面区域的一部分。 可以使用导电粘合剂，焊接工艺或其它导电接合工艺在管芯和衬底构件之间形成互连。

公开(公告)号：US20150137806A1

公开(公告)日：2015-05-21

申请号：US14606909

申请日：2015-01-27

Applicant: mCube Inc.

Inventor： HONG WAN ,  ANTHONY F. FLANNERY

IPC: G01R33/09

CPC classification number: G01R33/093 ,  G01R33/0206 ,  G01R33/096 ,  G01R33/098

Abstract: A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.

Abstract translation: 一种三轴磁场感测装置的方法和结构。 具有第一接合焊盘和第二接合焊盘的IC层可以形成为覆盖在衬底/ SOI部件上，其中第一，第二和第三磁感应元件耦接于IC层。 可以形成一个或多个导电电缆以连接IC层的第一和第二接合焊盘。 可以去除衬底构件和IC层的一部分，以将第一衬底构件上的第一和第二磁感应元件与第二衬底构件上的第三感测元件分离，并且第三感测元件可以联接到侧壁 的第一衬底构件。