公开(公告)号：US20200157394A1

公开(公告)日：2020-05-21

申请号：US16611250

申请日：2018-03-02

Applicant: MEC COMPANY LTD.

Inventor： Itsuro TOMATSU ,  Kosuke KUMAZAKI ,  Yasutaka AMITANI ,  Yuko SHIBANUMA ,  Ikuyo KATAYAMA

IPC: C09J179/02 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C23C22/06 ,  C23C22/63 ,  C23C22/68 ,  C09J11/04 ,  C09J5/02 ,  H05K3/38

Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

公开(公告)号：US20200040460A1

公开(公告)日：2020-02-06

申请号：US16471126

申请日：2017-12-15

Applicant: MEC COMPANY LTD.

Inventor： Daisaku AKIYAMA ,  Itsuro TOMATSU ,  Yasutaka AMITANI ,  Keisuke JOKO ,  Tokuya SATOMI

IPC: C23C22/05 ,  C08J5/12 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C23C22/82

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

公开(公告)号：US20190127606A1

公开(公告)日：2019-05-02

申请号：US16096827

申请日：2017-03-13

Applicant: MEC COMPANY LTD.

Inventor： Daisaku AKIYAMA ,  Yoichi SENGOKU ,  Itsuro TOMATSU ,  Masao OKADA ,  Ryoko MITANI ,  Keisuke JOKO ,  Yasutaka AMITANI ,  Tokuya SATOMI ,  Masaru TAKAHASHI

IPC: C09D183/04 ,  B32B15/08 ,  C09J11/08 ,  C09D7/63 ,  C09J183/04

CPC classification number: C09D183/04 ,  B32B15/08 ,  B32B2255/06 ,  B32B2255/24 ,  C08K3/16 ,  C08K5/092 ,  C08K5/17 ,  C09D5/00 ,  C09D5/002 ,  C09D7/40 ,  C09D7/61 ,  C09D7/63 ,  C09D177/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J183/04 ,  C23C26/00 ,  H05K3/38

Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.