CONCURRENT COMPENSATION IN A MEMORY SYSTEM
    1.
    发明公开

    公开(公告)号:US20230207033A1

    公开(公告)日:2023-06-29

    申请号:US17590679

    申请日:2022-02-01

    Abstract: An example method may be used to perform concurrent compensation in a memory array. The example method may include decoding a prime row address corresponding to a respective prime memory cell row of a first row section of a memory array mat to provide a prime section signal, and in response to a determination that the prime row address matches a defective prime row address, providing a redundant section signal corresponding to a respective redundant memory cell row of a second row section of the memory array mat. In response to the prime section signal, initiating a first threshold voltage compensation operation on first sensing circuitry coupled to the first row section; and in response to the redundant section signal indicating a defective prime row, initiating a second threshold voltage compensation operation on second sensing circuitry coupled to the second row section concurrent with the first threshold voltage compensation operation.

    Concurrent compensation in a memory system

    公开(公告)号:US11942171B2

    公开(公告)日:2024-03-26

    申请号:US17590679

    申请日:2022-02-01

    Abstract: An example method may be used to perform concurrent compensation in a memory array. The example method may include decoding a prime row address corresponding to a respective prime memory cell row of a first row section of a memory array mat to provide a prime section signal, and in response to a determination that the prime row address matches a defective prime row address, providing a redundant section signal corresponding to a respective redundant memory cell row of a second row section of the memory array mat. In response to the prime section signal, initiating a first threshold voltage compensation operation on first sensing circuitry coupled to the first row section; and in response to the redundant section signal indicating a defective prime row, initiating a second threshold voltage compensation operation on second sensing circuitry coupled to the second row section concurrent with the first threshold voltage compensation operation.

    Global redundant column select implementation for boundary faults in a memory device

    公开(公告)号:US11551779B2

    公开(公告)日:2023-01-10

    申请号:US17240389

    申请日:2021-04-26

    Abstract: An electronic device includes memory banks and repair circuitry configured to remap data from the memory banks to repair memory elements of the memory banks when a failure occurs. The repair circuitry includes a logic gate configured to receive an output from a memory bank of the memory banks, receive a failure signal indicating whether a corresponding memory element has failed, and transmit the output with a value of the output is based at least in part on the failure signal. The repair circuitry also includes error correction circuitry configured to receive the output via the logic gate and a multiplexer configured to receive the output from the memory bank, receive a repair value, and selectively output the output or the repair value from the repair circuitry as an output of the repair circuitry.

    Apparatuses and methods to mask write operations

    公开(公告)号:US11837316B1

    公开(公告)日:2023-12-05

    申请号:US17812139

    申请日:2022-07-12

    CPC classification number: G11C7/08 G11C7/1009 G11C7/1039 G11C7/1096

    Abstract: An exemplary semiconductor device includes circuitry to implement data mask operations by sending bit-specific, write enable signals (WREN) to control connection of a main or global data line to local data lines during a write operation. For example, a plurality of even sense amplifier stripes each receive a first set of WREN signals to control a corresponding passgate responsible for coupling one global data line to one local data line and a plurality of odd sense amplifier stripes each receive a second set of WREN signals to control a corresponding passgate responsible for coupling one global data line to one local data line.

    GLOBAL REDUNDANT COLUMN SELECT IMPLEMENTATION FOR BOUNDARY FAULTS IN A MEMORY DEVICE

    公开(公告)号:US20220343993A1

    公开(公告)日:2022-10-27

    申请号:US17240389

    申请日:2021-04-26

    Abstract: An electronic device includes memory banks and repair circuitry configured to remap data from the memory banks to repair memory elements of the memory banks when a failure occurs. The repair circuitry includes a logic gate configured to receive an output from a memory bank of the memory banks, receive a failure signal indicating whether a corresponding memory element has failed, and transmit the output with a value of the output is based at least in part on the failure signal. The repair circuitry also includes error correction circuitry configured to receive the output via the logic gate and a multiplexer configured to receive the output from the memory bank, receive a repair value, and selectively output the output or the repair value from the repair circuitry as an output of the repair circuitry.

    Auto-precharge for a memory bank stack

    公开(公告)号:US11232830B1

    公开(公告)日:2022-01-25

    申请号:US17119226

    申请日:2020-12-11

    Abstract: Devices and methods include a command interface configured to receive commands, such as a write with an automatic precharge. A bank-specific decoder decodes the write with an automatic precharge command for a corresponding memory bank and outputs a write auto-precharge (WrAP) signal. This WrAP signal has not been adjusted for a write recovery time for the memory bank. Accordingly, bank processing circuitry in a bank receiving the WrAP signal uses the WrAP to cause its internal lockout circuitry to apply a tWR lockout based at least in part on a mode register setting and on the WrAP signal indicating receipt of the write with an automatic precharge command.

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