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公开(公告)号：US20230135461A1
公开(公告)日：2023-05-04
申请号：US17862607
申请日：2022-07-12
发明人： Keisuke AOKI , Tomohisa YAMANE , Katsuhisa KODAMA , Yo TANAKA , Masakazu TANI
摘要： The semiconductor device includes: a heat spreader; a plurality of semiconductor elements; and one or a plurality of temperature detection elements. If a line segment connecting centers of two respective adjacent ones of the semiconductor elements is defined as X, a straight line that passes through one of the centers of the two adjacent semiconductor elements and that is perpendicular to X and parallel to the one-side surface of the heat spreader is defined as Y1, and a straight line that passes through another one of the centers of the two adjacent semiconductor elements and that is perpendicular to X and parallel to the one-side surface of the heat spreader is defined as Y2, at least a part of the temperature detection element is located in an arrangement region interposed between Y1 and Y2, as seen in a direction perpendicular to the one-side surface of the heat spreader.
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公开(公告)号：US20220230943A1
公开(公告)日：2022-07-21
申请号：US17615206
申请日：2019-07-02
发明人： Masakazu TANI
IPC分类号： H01L23/495 , H01L23/433 , H01L21/56 , H01L23/00
摘要： A manufacturing method for a power module capable of shortening a manufacturing time for a power module is obtained. The manufacturing method for a power module includes: a subassembly arranging step of placing a subassembly including a first electrode, a semiconductor device, and a second electrode on a heat sink via a joining material; and a transfer molding step of, after the subassembly arranging step, under a state in which the first electrode, the semiconductor device, and a second-electrode inner portion are arranged in a region surrounded by the heat sink and a molding die, injecting a thermoplastic resin into the region, wherein, in the transfer molding step, the subassembly is joined to the heat sink via the joining material with use of the resin.
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公开(公告)号：US20180084673A1
公开(公告)日：2018-03-22
申请号：US15559843
申请日：2015-03-25
发明人： Yugo ASAI , Shigetoshi IPPOSHI , Masaru SHINOZAKI , Hiroyuki HIGASHINO , Kazuki SAKATA , Masakazu TANI
IPC分类号： H05K7/20
CPC分类号： H05K7/20327 , F28D15/0266 , H05K7/20936
摘要： Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.
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公开(公告)号：US20170309498A1
公开(公告)日：2017-10-26
申请号：US15518353
申请日：2014-11-06
发明人： Masakazu TANI , Yoshiyuki DEGUCHI , Kazuki SAKATA
IPC分类号： H01L21/48 , H01L23/48 , H01L21/768 , H01L23/498 , H01L25/07 , H01L25/18
摘要： A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.
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公开(公告)号：US20230253372A1
公开(公告)日：2023-08-10
申请号：US17892297
申请日：2022-08-22
发明人： Masashi SAKAI , Masakazu TANI
IPC分类号： H01L25/07 , H01L23/31 , H01L23/373
CPC分类号： H01L25/072 , H01L23/3107 , H01L23/3735 , H02M7/003
摘要： A semiconductor device includes a plurality of arms each including: a heat dissipation plate; a switching element; a metal terminal; and a sealing material, the metal terminals of the two specific arms adjacent to each other in the first direction has a first protruding portion which protrudes from a portion of the sealing material on one side in the second direction, the first protruding portion of one specific arm is arranged on a side closer to the other specific arm than a center portion in the first direction is, at the portion of the sealing material on the one side in the second direction, and the first protruding portion of the other specific arm is arranged on a side closer to the one specific arm than a center portion in the first direction is, at the portion of the sealing material on the one side in the second direction.
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公开(公告)号：US20220020661A1
公开(公告)日：2022-01-20
申请号：US17187185
申请日：2021-02-26
发明人： Masakazu TANI
IPC分类号： H01L23/367 , H01L23/473 , H01G2/08 , H01G2/10 , H02M7/537
摘要： A power conversion device includes: a power semiconductor module; a capacitor; a heatsink; cooling fins; a first partition; a cooling flow path through which a coolant flows between the heatsink and the first partition; a second partition extending from the first partition; an inflow path extending from a coolant inlet along another surface of the first partition and a surface of the second partition on a first side surface side, and connected to a first side surface side of the cooling flow path; and an outflow path extending from a coolant outlet along the other surface of the first partition and a surface of the second partition on a second side surface side, and connected to a second side surface side of the cooling flow path, wherein a length of the first side surface of the power semiconductor module is greater than a length of the third side surface thereof.
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公开(公告)号：US20230396183A1
公开(公告)日：2023-12-07
申请号：US18145456
申请日：2022-12-22
发明人： Hiroki KATSUBE , Masakazu TANI , Shota YAMABE , Takuya NAKAMURA
CPC分类号： H02M7/003 , H02G5/02 , H05K5/0247
摘要： This power conversion device includes: a power module unit; and a capacitor module including a capacitor element, and a capacitor busbar. The capacitor busbar has a flat-plate portion, a plurality of power terminal connection portions, a power supply connection portion, and a plurality of element connection portions. An element-connection-portion position range which is a position range in a first direction between two element connection portions located at both ends, and a power-terminal-connection-portion position range which is a position range in the first direction between two power terminal connection portions located at both ends, are within a position range in the first direction where the flat-plate portion is located. A length of the element-connection-portion position range and a length of the power-terminal-connection-portion position range are equivalent to each other. A center position of the element-connection-portion position range and a center position of the power-terminal-connection-portion position range are equivalent to each other.
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公开(公告)号：US20210008962A1
公开(公告)日：2021-01-14
申请号：US16981770
申请日：2018-04-20
发明人： Masakazu TANI
摘要： It provides an operation part calculating an energy recovered by the heat exchanger in the heat exchanger and energies consumed by the air blower for absorption and the air blower for discharge and determining which of the energy recovered by the heat exchange and the energies consumed by the air blower for absorption and the air blower for discharge is greater, and a control part controlling at least one of the air blower for absorption and the air blower for discharge so that the energy consumed by the air blower for absorption and the air blower for discharge becomes small when the operation part determines that the energy consumed by the air blower for absorption and the air blower for discharge is greater than the energy recovered by the heat exchanger.
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公开(公告)号：US20180249596A1
公开(公告)日：2018-08-30
申请号：US15753228
申请日：2016-04-22
发明人： Yugo ASAI , Shigetoshi IPPOSHI , Masaru SHINOZAKI , Hiroyuki HIGASHINO , Kazuki SAKATA , Masakazu TANI
IPC分类号： H05K7/20
摘要： A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion in the inside of the casing. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device, so as to reduce the air bubbles through cooling by the refrigerant when the electronic device is cooled.
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公开(公告)号：US20230187322A1
公开(公告)日：2023-06-15
申请号：US17851499
申请日：2022-06-28
发明人： Yo TANAKA , Masakazu TANI , Tomohisa YAMANE , Katsuhisa KODAMA
IPC分类号： H01L23/495 , H01L23/00 , H02M7/537
CPC分类号： H01L23/49524 , H01L24/37 , H01L23/49548 , H01L23/49575 , H01L24/40 , H02M7/537 , H01L25/072
摘要： In this power semiconductor module, a first lead frame and a second lead frame through which currents flow in opposite directions are arranged so as to overlap each other, whereby the internal inductance can be reduced. In a direction perpendicular to one main surface of a first metal wiring layer, each of the first lead frame and the second lead frame is provided so as not to overlap parts of end surfaces of the first metal wiring layer and a second metal wiring layer. Thus, in a manufacturing process for the power semiconductor module before sealing with sealing resin, it is possible to easily perform positioning between the lead frames and between the metal wiring layer and the lead frame, using the end surfaces, whereby the manufacturing process can be simplified.
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