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    METHOD OF PRODUCING SUBSTRATE WITH FINE UNEVEN PATTERN, RESIN COMPOSITION, AND LAMINATE
    3.
    发明申请
    METHOD OF PRODUCING SUBSTRATE WITH FINE UNEVEN PATTERN, RESIN COMPOSITION, AND LAMINATE 审中-公开

    公开(公告)号：US20200166835A1

    公开(公告)日：2020-05-28

    申请号：US16619696

    申请日：2018-06-05

    申请人： MITSUI CHEMICALS, INC.

    发明人： Takashi ODA ,  Hisanori OHKITA ,  Yasuhisa KAYABA

    IPC分类号： G03F7/00 ,  B29C59/02 ,  H01L21/027 ,  C08G61/08

    摘要： A method of producing a substrate with a fine uneven pattern is a method of producing a substrate having a fine uneven pattern on a surface thereof, the method including a step (a) of preparing a laminate provided with a substrate and a first resin layer provided on the substrate and having a first fine uneven pattern formed on a surface thereof; and a step (b) of forming a second fine uneven pattern corresponding to the first fine uneven pattern on the surface of the substrate by etching the surface of the first fine uneven pattern using the first resin layer as a mask, in which the first resin layer is formed of a resin composition (P) including a fluorine-containing cyclic olefin polymer (A) or a cured product of the resin composition (P).

    RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
    7.
    发明申请
    RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE 审中-公开

    公开(公告)号：US20200241419A1

    公开(公告)日：2020-07-30

    申请号：US16753184

    申请日：2018-05-30

    申请人： MITSUI CHEMICALS, INC.

    发明人： Keisuke KAWASHIMA ,  Takashi ODA ,  Koji INOUE

    IPC分类号： G03F7/11 ,  C08F232/08

    摘要： Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.

    CULTURE MATERIAL AND USE THEREOF
    8.
    发明申请
    CULTURE MATERIAL AND USE THEREOF 有权

    公开(公告)号：US20210309954A1

    公开(公告)日：2021-10-07

    申请号：US17279036

    申请日：2020-06-18

    申请人： MITSUI CHEMICALS, INC.

    发明人： Makoto KIYA ,  Hiroshi MIYASAKO ,  Katsutoshi KINOSHITA ,  Tomoaki MATSUGI ,  Takashi ODA ,  Katsuhiro ESASHIKA

    IPC分类号： C12M1/00

    摘要： A culture material including a 4-methyl-1-pentene polymer for cells, tissues, or organs, the culture material having a water contact angle at a culture surface of 50° to 100°, a sagging distance by a test method described below of 0 to 5 mm, and an oxygen permeation rate at a temperature of 23° C. and a humidity of 0% of 4500 to 90000 cm3/(m2×24 h×atm). A test piece having the same material as the culture material and the same thickness as the culture surface of the culture material and having a flat plate shape of 100 mm long and 10 mm wide is made. The test piece is fixed onto a test board in a state where the test piece protrudes lengthwise in a horizontal direction from a top surface of the test board, the top surface being horizontal.