公开(公告)号：US20180076047A1

公开(公告)日：2018-03-15

申请号：US15562072

申请日：2016-03-24

申请人： MITSUI CHEMICALS, INC.

发明人： Hirofumi TANAKA ,  Yasuhisa KAYABA ,  Hiroko WACHI ,  Koji INOUE ,  Shoko ONO

IPC分类号： H01L21/3105 ,  C08G73/02 ,  C09D179/02 ,  H01L21/02 ,  H01L21/311

CPC分类号： H01L21/31051 ,  C08G73/0206 ,  C09D179/02 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/02362 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/31138 ,  H01L21/76

摘要： A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.

公开(公告)号：US20210191269A1

公开(公告)日：2021-06-24

申请号：US16757830

申请日：2018-11-13

申请人： MITSUI CHEMICALS, INC.

发明人： Hiroko WACHI ,  Yasuhisa KAYABA ,  Hirofumi TANAKA ,  Kenichi FUJII

IPC分类号： G03F7/11 ,  H01L21/311 ,  G03F7/075

摘要： Provided are a semiconductor element intermediate including: a substrate and a multilayer resist layer, in which the multilayer resist layer includes a metal-containing film, and in which the metal-containing film has a content of germanium element of 20 atm % or more, or a total content of tin element, indium element, and gallium element of 1 atm % or more, as measured by X-ray photoelectric spectroscopy, and an application of the semiconductor intermediate.

公开(公告)号：US20170162382A1

公开(公告)日：2017-06-08

申请号：US15325511

申请日：2015-08-05

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa KAYABA ,  Hirofumi TANAKA ,  Shoko ONO ,  Koji INOUE ,  Hiroko WACHI ,  Tsuneji SUZUKI

IPC分类号： H01L21/02 ,  C08L79/00 ,  C09D157/06

摘要： The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.

公开(公告)号：US20160222244A1

公开(公告)日：2016-08-04

申请号：US15008854

申请日：2016-01-28

申请人： Seiko Epson Corporation ,  Mitsui Chemicals, Inc.

发明人： Takayoshi KAGATA ,  Toshihiro YOSHIMURA ,  Yasuyuki KAGAWA ,  Yukiko EGAMI ,  Hiroshi MAEKAWA ,  Hiroko WACHI ,  Tsuyoshi SANO ,  Akira MIZUTANI ,  Atsushi DENDA

IPC分类号： C09D133/08 ,  C09D11/322

CPC分类号： C09D133/08 ,  C09D11/107 ,  C09D11/322

摘要： An ink composition includes a white coloring material, polymer particles, and a solvent, the polymer particles satisfying the relationship represented by the following expression (1). Y≦0.33X+20  (1) where X is an average particle size D50 (nm) and Y is a melting start temperature (° C.).

摘要翻译： 油墨组合物包含白色着色材料，聚合物颗粒和溶剂，所述聚合物颗粒满足由以下表达式（1）表示的关系。 Y≤0.33X+ 20（1）其中X是平均粒度D50（nm），Y是熔点开始温度（℃）。

公开(公告)号：US20220135787A1

公开(公告)日：2022-05-05

申请号：US17433710

申请日：2020-03-31

申请人： MITSUI CHEMICALS, INC.

发明人： Takashi ODA ,  Hisanori OHKITA ,  Hiroko WACHI ,  Shingo YAMAMOTO

IPC分类号： C08L63/00 ,  B29C59/02 ,  H01L21/027 ,  G03F7/00

摘要： Provided is a photocurable composition used for forming a resin layer of a concave-convex structure including a substrate and a resin layer provided on the substrate and having fine concavities and convexities formed on a surface thereof. A cured film of the photocurable composition has a surface free energy of 15 mJ/m2 to 40 mJ/m2 as measured based on the Kitazaki-Hata theory and a hardness of 0.05 GPa to 0.5 GPa as measured using a nanoindenter.

公开(公告)号：US20210375710A1

公开(公告)日：2021-12-02

申请号：US17284488

申请日：2019-11-19

申请人： Mitsui Chemicals, Inc.

发明人： Hiroko WACHI ,  Hirofumi TANAKA ,  Yasuhisa KAYABA ,  Kenichi FUJII

IPC分类号： H01L23/31 ,  H01L23/29 ,  H01L21/02

摘要： A method of producing a semiconductor element intermediate includes: a preparing step of preparing a substrate having a recessed part on a surface thereof; and a filling step of filling tin oxide into the recessed part by an atomic layer deposition method at a substrate temperature of 250° C. or higher, using a tin oxide precursor including a compound represented by the following Formula (1). In Formula (1), each of R1 to R4 independently represents an alkyl group having from 1 to 6 carbon atoms.

公开(公告)号：US20180327547A1

公开(公告)日：2018-11-15

申请号：US15776013

申请日：2016-11-16

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa KAYABA ,  Hirofumi TANAKA ,  Hiroko WACHI ,  Shoko ONO

IPC分类号： C08G73/02 ,  C08G73/10 ,  C08K5/092 ,  H01L21/02 ,  H01L21/3105

摘要： A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.

公开(公告)号：US20170372993A1

公开(公告)日：2017-12-28

申请号：US15535761

申请日：2015-12-14

申请人： Mitsui Chemicals, inc.

发明人： Yasuhisa KAYABA ,  Shoko ONO ,  Hirofumi TANAKA ,  Koji INOUE ,  Hiroko WACHI

IPC分类号： H01L23/498 ,  H01L23/532

CPC分类号： H01L23/49827 ,  H01L21/02164 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02362 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/145 ,  H01L23/481 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.