公开(公告)号：US20160315040A1

公开(公告)日：2016-10-27

申请号：US15134848

申请日：2016-04-21

Applicant: MK Electron Co., Ltd.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Eung Jae KIM ,  Su-Yong RYU ,  Hui Joong KIM ,  Ho Gun CHA ,  Ik Joo MAENG ,  Chan Goo YOO

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/11318 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13026 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13669 ,  H01L2224/48227 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351

Abstract: Provided are a reverse-reflow core, a semiconductor package, and a method of fabricating a semiconductor package. The semiconductor package includes: a semiconductor apparatus including a bump pad; and a bump portion bonded to the bump pad. The bump portion includes: a core; an intermetallic compound layer formed on the core; and a solder layer coating the intermetallic compound layer, wherein the thickness of a portion of the solder layer decreases as the distance between the portion of the solder layer and the bump pad increases. The reverse-reflow core, the semiconductor package, and the method of fabricating a semiconductor package enable the fabrication of a semiconductor package having high bonding strength and a high degree of precision.

Abstract translation: 提供了反向回流芯，半导体封装和制造半导体封装的方法。 半导体封装包括：包括凸块焊盘的半导体装置; 以及接合到所述凸块焊盘的凸块部分。 凸起部分包括：芯; 形成在所述芯上的金属间化合物层; 以及涂覆金属间化合物层的焊料层，其中焊料层的一部分的厚度随着焊料层的部分和凸块焊盘之间的距离增加而减小。 反向回流芯，半导体封装以及制造半导体封装的方法能够制造具有高结合强度和高精度的半导体封装。