公开(公告)号：US20230111798A1

公开(公告)日：2023-04-13

申请号：US17959502

申请日：2022-10-04

Applicant: MK ELECTRON CO., LTD.

Inventor： Young Woo LEE ,  Seul Gi LEE ,  Hui Joong KIM ,  Jae Yool SON ,  Jae Hun SONG ,  Jeong Tak MOON

IPC: B23K35/26 ,  C22C13/02

Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

公开(公告)号：US20130175688A1

公开(公告)日：2013-07-11

申请号：US13714200

申请日：2012-12-13

Applicant: MK ELECTRON CO., LTD.

Inventor： Young Woo LEE ,  Im Bok LEE ,  Sung Jae HONG ,  Jeong Tak MOON

IPC: B23K35/26 ,  H01L23/00

CPC classification number: B23K35/262 ,  C22C13/00 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/13 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01032 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A tin(Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver(Ag), about 0.1 to 1 wt. % copper(Cu), about 0.001 to 0.3 wt. % aluminum(Al), about 0.001% to 0.1 wt. % germanium(Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.

Abstract translation: 提供基于锡（Sn）的焊球和包括其的半导体封装。 锡基焊球包括约0.2至4wt。 ％银（Ag），约0.1至1wt。 ％铜（Cu），约0.001〜0.3wt。 ％铝（Al），约0.001％至0.1％ ％锗（Ge），余量为锡和不可避免的杂质。 锡基焊球具有高抗氧化性。

公开(公告)号：US20220212293A1

公开(公告)日：2022-07-07

申请号：US17558989

申请日：2021-12-22

Applicant: MK ELECTRON CO., LTD.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Seul Gi LEE ,  Min Su PARK ,  Hui Joong KIM

IPC: B23K35/26 ,  B23K35/02

Abstract: A lead (Pb)-free, and silver (Ag)-free solder alloy includes a primary metallic element in a content of about 1.1 wt % to about 1.9 wt %, nickel(Ni) in a content of about 0.02 wt % to about 0.09 wt %, copper (Cu) in a content of about 0.2 wt % to about 0.9 wt %, and tin (Sn) and other unavoidable impurities in remaining balance, wherein the primary metallic element is at least one selected from the group including bismuth (Bi), chromium (Cr), indium (In), antimony (Sb), silicon (Si) and zinc (Zn).

公开(公告)号：US20210366858A1

公开(公告)日：2021-11-25

申请号：US17323705

申请日：2021-05-18

Applicant: MK ELECTRON CO., LTD.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Seul Gi LEE ,  Min Su PARK ,  Hui Joong KIM

IPC: H01L23/00

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

公开(公告)号：US20160244891A1

公开(公告)日：2016-08-25

申请号：US15050708

申请日：2016-02-23

Applicant: MK ELECTRON CO., LTD.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Eung Jae KIM ,  Ik Joo MAENG ,  Chan Goo YOO

IPC: C25D3/12 ,  C25D5/12 ,  C25D7/00 ,  C23C18/16 ,  B23K35/02 ,  B23K35/26 ,  B23K35/22 ,  C23C18/31 ,  C25D3/48 ,  B23K1/00

CPC classification number: C25D3/12 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/226 ,  B23K35/262 ,  B23K2101/42 ,  C23C18/1635 ,  C23C18/165 ,  C23C18/31 ,  C25D3/48 ,  C25D5/10 ,  C25D7/00

Abstract: A solder ball for fluxless bonding includes a solder core, a first metal layer on a surface of the solder core, and a second metal layer on the first metal layer. The first metal layer includes at least one of nickel (Ni), silver (Ag), zinc (Zn), tin (Sn), chrome (Cr), antimony (Sb), platinum (Pt), palladium (Pd), aluminum (Al), or an alloy thereof. The second metal layer includes gold (Au). As the above solder ball for fluxless bonding is in use, a solder bump having high reliability may be formed via a relatively short, low cost, and simple process.

Abstract translation: 用于无助焊接的焊球包括焊料芯，焊料芯表面上的第一金属层和第一金属层上的第二金属层。 第一金属层包括镍（Ni），银（Ag），锌（Zn），锡（Sn），铬（Cr），锑（Sb），铂（Pt），钯（Pd） （Al）或其合金。 第二金属层包括金（Au）。 由于使用上述无助焊接用焊料球，所以可以通过相对较短，成本低且简单的工艺形成具有高可靠性的焊料凸块。

公开(公告)号：US20160315040A1

公开(公告)日：2016-10-27

申请号：US15134848

申请日：2016-04-21

Applicant: MK Electron Co., Ltd.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Eung Jae KIM ,  Su-Yong RYU ,  Hui Joong KIM ,  Ho Gun CHA ,  Ik Joo MAENG ,  Chan Goo YOO

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/11318 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13026 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13669 ,  H01L2224/48227 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351

Abstract: Provided are a reverse-reflow core, a semiconductor package, and a method of fabricating a semiconductor package. The semiconductor package includes: a semiconductor apparatus including a bump pad; and a bump portion bonded to the bump pad. The bump portion includes: a core; an intermetallic compound layer formed on the core; and a solder layer coating the intermetallic compound layer, wherein the thickness of a portion of the solder layer decreases as the distance between the portion of the solder layer and the bump pad increases. The reverse-reflow core, the semiconductor package, and the method of fabricating a semiconductor package enable the fabrication of a semiconductor package having high bonding strength and a high degree of precision.

Abstract translation: 提供了反向回流芯，半导体封装和制造半导体封装的方法。 半导体封装包括：包括凸块焊盘的半导体装置; 以及接合到所述凸块焊盘的凸块部分。 凸起部分包括：芯; 形成在所述芯上的金属间化合物层; 以及涂覆金属间化合物层的焊料层，其中焊料层的一部分的厚度随着焊料层的部分和凸块焊盘之间的距离增加而减小。 反向回流芯，半导体封装以及制造半导体封装的方法能够制造具有高结合强度和高精度的半导体封装。

公开(公告)号：US20150151386A1

公开(公告)日：2015-06-04

申请号：US14558089

申请日：2014-12-02

Applicant: MK ELECTRON CO., LTD. ,  HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Sung Jae HONG ,  Keun Soo KIM ,  Chang Woo LEE ,  Jung Hwan BANG ,  Yong Ho KO ,  Hyuck Mo LEE ,  Jae Won CHANG ,  Ja Hyun KOO ,  Jeong Tak MOON ,  Young Woo LEE ,  Won Sik HONG ,  Hui Joong KIM ,  Jae Hong LEE

IPC: B23K35/26 ,  H01L23/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract translation: 提供了一种无铅焊料，焊膏和半导体器件，更具体地，包括在约0.1重量％至约0.8重量％范围内的Cu的无铅焊料，Pd在约0.001 重量％至约0.1重量％，Al在约0.001重量％至约0.1重量％的范围内，Si在约0.001重量％至约0.1重量％的范围内，Sn和不可避免的杂质作为余量，焊膏和 包括无铅焊料的半导体器件。 无铅焊料和焊膏环保，具有高温稳定性和高可靠性。

公开(公告)号：US20160256962A1

公开(公告)日：2016-09-08

申请号：US15044585

申请日：2016-02-16

Applicant: MK Electron Co., Ltd.

Inventor： Hui Joong KIM ,  Jae Hun SONG ,  Young Woo LEE ,  Jae Hong LEE ,  Jae Yeol SON ,  Eung Jae KIM ,  Ho Gun CHA

IPC: B23K35/26 ,  C22C13/02 ,  B23K35/362 ,  H01L23/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/362 ,  C22C13/02 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2924/00015 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01022 ,  H01L2924/01003 ,  H01L2924/00012

Abstract: A solder ball includes about 1.0 wt % to about 2.0 wt % silver (Ag), about 4.0 wt % to about 8.0 wt % indium (In), about 10.0 wt % to about 20.0 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % deoxidizer, and the balance of tin (Sn). A melting point of the solder is about 170° C. to about 190° C.

Abstract translation: 焊球包括约1.0重量％至约2.0重量％的银（Ag），约4.0重量％至约8.0重量％的铟（In），约10.0重量％至约20.0重量％的铋（Bi），约0.005重量％ 至约0.1重量％的脱氧剂，余量为锡（Sn）。 焊料的熔点为约170℃至约190℃