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    On the enhancements of planar based RF sensor technology
    1.
    发明授权
    On the enhancements of planar based RF sensor technology 有权
    关于基于平面的RF传感器技术的增强

    公开(公告)号：US09291649B2

    公开(公告)日：2016-03-22

    申请号：US13828628

    申请日：2013-03-14

    Applicant: MKS Instruments, Inc.

    Inventor： Dennis M. Brown ,  David J. Coumou ,  Raymond Brooks

    IPC: G01R15/18 ,  G01R19/00 ,  H05H1/46

    CPC classification number: G01R19/00 ,  G01R15/181 ,  H01F27/2804 ,  H01F38/30 ,  H01F2038/305 ,  H05H1/46 ,  H05H2001/4682

    Abstract: A radio frequency sensor system includes a printed circuit board (PCB). The PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB. The PCB also includes a first loop. The first loop includes a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces. The first plurality of sensor pads is arranged on the inner perimeter. The PCB also includes a second loop. The second loop includes a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces. The second plurality of sensor pads is arranged on the inner perimeter. A core ring is embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces. A center conductor, for carrying RF current, extends through the aperture. The first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.

    Abstract translation: 射频传感器系统包括印刷电路板（PCB）。 PCB包括第一外部层，第二外部层，第一内部层，第二内部层和限定通过PCB的孔的内部周边。 PCB还包括第一个回路。 第一环包括通过第一多个迹线耦合到第一多个通孔的第一多个传感器焊盘。 第一组多个传感器垫布置在内周上。 PCB还包括第二个回路。 第二环路包括通过第二多个迹线耦合到第二多个通孔的第二多个传感器焊盘。 第二组传感器垫布置在内周上。 核心环被嵌入到靠近第一多个传感器焊盘，第一多个通孔和第一多个迹线的第一内部层内。 用于承载RF电流的中心导体延伸穿过孔。 第一和第二回路基于第一和第二多个传感器焊盘，第一和第二多个通孔，第一和第二多个迹线以及芯环产生电信号。

    Virtual RF sensor
    4.
    发明授权
    Virtual RF sensor 有权
    虚拟射频传感器

    公开(公告)号：US09041480B2

    公开(公告)日：2015-05-26

    申请号：US13832901

    申请日：2013-03-15

    Applicant: MKS Instruments, Inc.

    Inventor： Aaron T. Radomski ,  Dennis M. Brown ,  Nicholas Nelson

    IPC: H03H7/40

    CPC classification number: H03H7/40

    Abstract: A radio frequency (RF) generation system includes an impedance determination module that receives an RF voltage and an RF current. The impedance determination module further determines an RF generator impedance based on the RF voltage and the RF current. The RF generation system also includes a control module that determines a plurality of electrical values based on the RF generator impedance. The matching module further matches an impedance of a load based on the RF generator impedance and the plurality of electrical components. The matching module also determines a 2 port transfer function based on the plurality of electrical values. The RF generation system also includes a virtual sensor module that estimates a load voltage, a load current, and a load impedance based on the RF voltage, the RF generator, the RF generator impedance, and the 2 port transfer function.

    Abstract translation: 射频（RF）生成系统包括接收RF电压和RF电流的阻抗确定模块。 阻抗确定模块还基于RF电压和RF电流来确定RF发生器阻抗。 RF发生系统还包括控制模块，该控制模块基于RF发生器阻抗来确定多个电气值。 匹配模块还基于RF发生器阻抗和多个电气部件来匹配负载的阻抗。 匹配模块还基于多个电气值确定2端口传送功能。 RF发生系统还包括虚拟传感器模块，其基于RF电压，RF发生器，RF发生器阻抗和2端口传递函数来估计负载电压，负载电流和负载阻抗。

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