Abstract:
An apparatus includes a memory system having multiple memory subsystems that are operable to concurrently service memory transactions. The memory system has an interface arrangement with an interconnection network that allows for independent access to each memory subsystem, and logic blocks that support the servicing and distribution or routing of memory transactions. Preferably, the apparatus is formed on a semiconductor structure having a combination of compound semiconductor material and Group IV semiconductor material.
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. These materials and fabrication techniques can be utilized to realize a current conservative emitter coupled logic circuit.
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. Furthermore, a small, high performance scheduling engine is implemented in the compound semiconductor material to take advantage of the higher frequency of operation to increase determinism and to reduce response times.
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart form a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. These materials and techniques can be utilized to fabricate and facilitate a dataflow processor that achieves improved execution unit duty cycle performance and deterministic execution performance for at least some dataflow tokens.
Abstract:
A system employing synchronous clock signals utilizes the distribution of a fast clock signal along a forward path to clock generators for providing standard clock signals, and a recovery of such signal via a return path. The fast clock signal has a distinguishable portion, such as a periodic missing pulse or other anomaly, which is used to determine delay characteristics for the fast clock signal to the clock generators. A controllable delay corresponding to the forward path is adjusted, based on the determined delay characteristics, to synchronize delivery of the fast clock signal to the clock generators. Preferably, a significant portion of the clock generation and distribution system is formed on a semiconductor structure have a combination of compound semiconductor material and Group IV semiconductor material.