公开(公告)号：US20210381121A1

公开(公告)日：2021-12-09

申请号：US16893956

申请日：2020-06-05

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D3/32 ,  H01R43/26 ,  C25D5/12

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US11643742B2

公开(公告)日：2023-05-09

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/64 ,  C25D3/32 ,  C25D3/12 ,  C25D3/46 ,  C25D5/12 ,  H01R43/26

CPC classification number: C25D3/46 ,  C25D3/32 ,  C25D3/64 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US11280014B2

公开(公告)日：2022-03-22

申请号：US16893956

申请日：2020-06-05

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D3/32 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US20220170172A1

公开(公告)日：2022-06-02

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D5/12 ,  H01R43/26 ,  C25D3/32

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.