公开(公告)号：US20220170172A1

公开(公告)日：2022-06-02

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D5/12 ,  H01R43/26 ,  C25D3/32

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US20180347038A1

公开(公告)日：2018-12-06

申请号：US15607925

申请日：2017-05-30

Applicant: MacDermid Enthone Inc.

Inventor： Cherry S. Santos ,  Tyler Banker ,  John Swanson ,  Ernest Long ,  Fengting Xu

IPC: C23C16/448 ,  C23C18/54 ,  C23C16/56 ,  H05K3/18 ,  H05K3/14

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

公开(公告)号：US20210381121A1

公开(公告)日：2021-12-09

申请号：US16893956

申请日：2020-06-05

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D3/32 ,  H01R43/26 ,  C25D5/12

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US10774425B2

公开(公告)日：2020-09-15

申请号：US15607925

申请日：2017-05-30

Applicant: MacDermid Enthone Inc.

Inventor： Cherry S. Santos ,  Tyler Banker ,  John Swanson ,  Ernest Long ,  Fengting Xu

IPC: C23C18/54 ,  H05K3/24 ,  H05K3/18

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

公开(公告)号：US11643742B2

公开(公告)日：2023-05-09

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/64 ,  C25D3/32 ,  C25D3/12 ,  C25D3/46 ,  C25D5/12 ,  H01R43/26

CPC classification number: C25D3/46 ,  C25D3/32 ,  C25D3/64 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US11280014B2

公开(公告)日：2022-03-22

申请号：US16893956

申请日：2020-06-05

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D3/32 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.