Electronic component
    1.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号:US07586048B2

    公开(公告)日:2009-09-08

    申请号:US11528331

    申请日:2006-09-28

    IPC分类号: H01L23/28 H05K7/14

    摘要: The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the electronic component has a general outline in the form of a rectangular parallelepiped, provided by forming a lead-out electrode having a multi-layer structure on a substrate and forming a protective layer for protecting the lead-out electrode using thin film forming techniques. The lead-out electrode includes a first electrode which is electrically connected to a coil conductor and which has an exposed part exposed on an outer surface and a second electrode which has an exposed part exposed on the outer surface to extend an electrode width different from an electrode width of the first electrode and which is formed directly above the first electrode and electrically connected to the first electrode.

    摘要翻译: 本发明涉及一种安装在印刷电路板或混合IC(HIC)上的表面贴装型电子元件,并且提供了一种在耐热性和耐压性方面是可靠的低成本电子部件。 作为电子部件的电感器具有长方体形状的一般轮廓,通过在基板上形成具有多层结构的引出电极,并形成用于使用薄膜保护引出电极的保护层 成型技术。 引出电极包括电连接到线圈导体并且具有暴露在外表面上的暴露部分的第一电极和具有暴露在外表面上的暴露部分的第二电极,以延伸不同于 第一电极的电极宽度,并且直接形成在第一电极的上方并与第一电极电连接。

    Electronic component
    2.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号:US20070132060A1

    公开(公告)日:2007-06-14

    申请号:US11606931

    申请日:2006-12-01

    IPC分类号: H01L29/00

    摘要: The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.

    摘要翻译: 本发明提供一种具有改进的耐电压击穿极限值和改善的绝缘性能的电子部件,其可以制成紧凑的并具有多层和大容量。 电子部件包括:第一导体,其具有形成在基板上的底部导体和形成为从底部导体突出的凸起导体,形成在凸起导体上的电介质膜,以及形成在电介质膜上以构成电容器元件的第二导体 与凸起的导体和电介质膜组合。

    Electronic component comprising a coil conductor and a capacity element
    4.
    发明授权
    Electronic component comprising a coil conductor and a capacity element 有权
    电子元件包括线圈导体和电容元件

    公开(公告)号:US07859080B2

    公开(公告)日:2010-12-28

    申请号:US11606931

    申请日:2006-12-01

    IPC分类号: H01L27/08

    摘要: The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.

    摘要翻译: 本发明提供一种具有改进的耐电压击穿极限值和改善的绝缘性能的电子部件,其可以制成紧凑的并具有多层和大容量。 电子部件包括:第一导体,其具有形成在基板上的底部导体和形成为从底部导体突出的凸起导体,形成在凸起导体上的电介质膜和形成在电介质膜上的第二导体,以构成电容器元件 与凸起的导体和电介质膜组合。

    Electronic component
    5.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号:US07667951B2

    公开(公告)日:2010-02-23

    申请号:US11598073

    申请日:2006-11-13

    IPC分类号: H01G4/06 H01G4/005

    摘要: The invention relates to an electronic component including a capacitor and provides an electronic component in which electromigration can be prevented and whose capacitor element has an accurate capacity value. The electronic component includes a bottom conductor formed on a substrate, a dielectric film formed to cover the bottom conductor, an organic insulation film formed on the dielectric film, and a top conductor formed in an opening provided in the organic insulation film over the bottom conductor, the top conductor forming a capacitor element in combination with the bottom conductor and the dielectric film.

    摘要翻译: 本发明涉及包括电容器的电子部件,并且提供可以防止电迁移并且其电容器元件具有精确的容量值的电子部件。 电子部件包括形成在基板上的底部导体,形成为覆盖底部导体的电介质膜,形成在电介质膜上的有机绝缘膜,以及在底部导体上设置在有机绝缘膜中的开口中形成的顶部导体 ,顶部导体与底部导体和电介质膜组合形成电容器元件。

    Electronic component
    6.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号:US20070109719A1

    公开(公告)日:2007-05-17

    申请号:US11598073

    申请日:2006-11-13

    IPC分类号: H01G4/06

    摘要: The invention relates to an electronic component including a capacitor and provides an electronic component in which electromigration can be prevented and whose capacitor element has an accurate capacity value. The electronic component includes a bottom conductor formed on a substrate, a dielectric film formed to cover the bottom conductor, an organic insulation film formed on the dielectric film, and a top conductor formed in an opening provided in the organic insulation film over the bottom conductor, the top conductor forming a capacitor element in combination with the bottom conductor and the dielectric film.

    摘要翻译: 本发明涉及包括电容器的电子部件,并且提供可以防止电迁移并且其电容器元件具有精确的容量值的电子部件。 电子部件包括形成在基板上的底部导体,形成为覆盖底部导体的电介质膜,形成在电介质膜上的有机绝缘膜,以及在底部导体上设置在有机绝缘膜中的开口中形成的顶部导体 ,顶部导体与底部导体和电介质膜组合形成电容器元件。

    Electronic Component
    7.
    发明申请
    Electronic Component 有权
    电子元器件

    公开(公告)号:US20070089904A1

    公开(公告)日:2007-04-26

    申请号:US11528331

    申请日:2006-09-28

    IPC分类号: H01L23/28

    摘要: The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the electronic component has a general outline in the form of a rectangular parallelepiped, provided by forming a lead-out electrode having a multi-layer structure on a substrate and forming a protective layer for protecting the lead-out electrode using thin film forming techniques. The lead-out electrode includes a first electrode which is electrically connected to a coil conductor and which has an exposed part exposed on an outer surface and a second electrode which has an exposed part exposed on the outer surface to extend an electrode width different from an electrode width of the first electrode and which is formed directly above the first electrode and electrically connected to the first electrode.

    摘要翻译: 本发明涉及一种安装在印刷电路板或混合IC(HIC)上的表面贴装型电子元件,并且提供了一种在耐热性和耐压性方面是可靠的低成本电子部件。 作为电子部件的电感器具有长方体形状的一般轮廓,通过在基板上形成具有多层结构的引出电极,并形成用于使用薄膜保护引出电极的保护层 成型技术。 引出电极包括电连接到线圈导体并且具有暴露在外表面上的暴露部分的第一电极和具有暴露在外表面上的暴露部分的第二电极,以延伸不同于 第一电极的电极宽度,并且直接形成在第一电极的上方并与第一电极电连接。

    Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same
    8.
    发明申请
    Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same 审中-公开
    电容器,其制造方法,使用其的滤光器以及用于其的电介质薄膜

    公开(公告)号:US20060180842A1

    公开(公告)日:2006-08-17

    申请号:US11331104

    申请日:2006-01-13

    摘要: The capacitor (10) in accordance with the present invention comprises a lower electrode (14A), a dielectric layer (16) including an SiO2 layer (20) formed on the lower electrode (14A) and an Si3N4 layer (22) formed on the SiO2 layer (20), and an upper electrode (14B) formed on the dielectric layer (16). When the SiO2 layer (20) is thus interposed between the lower electrode (14A) and Si3N4 layer (22), the lower electrode (14A) and Si3N4 layer (22) adhere to each other more firmly than in the case where the Si3N4 layer (22) is directly formed on the lower electrode (14A) as in a conventional capacitor. Namely, since the dielectric layer (16) includes the Si3N4 layer having a higher dielectric constant, the capacitor (10) in accordance with the present invention yields a large capacitance, while the adhesion between the dielectric layer (16) and lower electrode (14A) is improved over the conventional capacitor.

    摘要翻译: 根据本发明的电容器(10)包括下电极(14A),包括形成在下电极(14A)上的SiO 2层(20)的介电层(16) 和形成在SiO 2层(20)上的Si 3 N 4 N层(22)和形成的上电极(14B) 在电介质层(16)上。 当SiO 2层(20)因此介于下电极(14A)和Si 3 N 4层(22)之间时, 下电极(14A)和Si 3 N 4层(22)彼此更牢固地粘附在Si 3 N 3层(22)的情况下 > N 4层(22)直接形成在下电极(14A)上,如常规电容器那样。 也就是说,由于介电层(16)包括具有较高介电常数的Si 3 N 4 N 4层,所以根据本发明的电容器(10)产生大的 电容,而介电层(16)和下电极(14A)之间的粘附性比常规电容器提高。