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1.发明授权
公开(公告)号：US5612513A
公开(公告)日：1997-03-18
申请号：US530747
申请日：1995-09-19
IPC分类号： H01L21/98 , H01L23/24 , H01L23/538 , H01L23/58 , H01L25/065 , H05K1/18 , H05K3/28 , H05K3/00
CPC分类号： H01L25/50 , H01L23/24 , H01L23/5387 , H01L23/58 , H01L24/97 , H01L25/0655 , H01L2223/6677 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/14 , H01L2924/19043 , H05K1/189 , H05K3/284 , Y10T29/4913 , Y10T29/49146
摘要： An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
摘要翻译： 提供一种用于制造电路的封闭电路和方法。 最初，柔性基板形成有多个电路。 作为示例，每个电路可以包含导电迹线，电池和管芯，全部电气通信。 在制造过程中，将阻挡层放置在基板上，并将可固化的密封剂注入到由阻挡层和基板形成的空腔中以封装每个电路。 屏障可以形成为具有用于每个电路的单独空腔的隔间堤坝，作为具有单个空腔的周边坝，或者作为具有用于由切割图案形成的每个电路的单独空腔的隔离片。 在封装步骤之后，电路可以分成单独的封装电路。
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2.发明授权
公开(公告)号：US5907477A
公开(公告)日：1999-05-25
申请号：US814206
申请日：1997-03-11
IPC分类号： H01L21/98 , H01L23/24 , H01L23/538 , H01L23/58 , H01L25/065 , H05K1/18 , H05K3/28 , H01L23/31 , H05K7/02
CPC分类号： H01L25/50 , H01L23/24 , H01L23/5387 , H01L23/58 , H01L24/97 , H01L25/0655 , H01L2223/6677 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/14 , H01L2924/19043 , H05K1/189 , H05K3/284 , Y10T29/4913 , Y10T29/49146
摘要： An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
摘要翻译： 提供一种用于制造电路的封闭电路和方法。 最初，柔性基板形成有多个电路。 作为示例，每个电路可以包含导电迹线，电池和管芯，全部电气通信。 在制造过程中，将阻挡层放置在基板上，并将可固化的密封剂注入到由阻挡层和基板形成的空腔中以封装每个电路。 阻挡层可以形成为具有用于每个电路的单独空腔的隔间坝，作为具有单个空腔的周边坝，或者作为具有用于由切口图案形成的每个电路的单独的空腔的隔离片。 在封装步骤之后，电路可以分成单独的封装电路。
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3.发明授权
公开(公告)号：US5972152A
公开(公告)日：1999-10-26
申请号：US858021
申请日：1997-05-16
CPC分类号： H05K3/007 , H05K1/0393 , H05K2203/0152 , H05K2203/016 , H05K2203/0278 , Y10S156/922 , Y10T156/11
摘要： Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.
摘要翻译： 公开了将柔性电路基板固定到处理载体的方法。 在一个实施方式中，柔性电路基板和处理载体附接有设置在其间的粘合膜。 在本发明的优选实施方案中，粘合剂膜包括丙烯酸，硅树脂或硅氧烷丙烯酸共混物。 理想地，柔性电路基板的第一表面的总表面积基本上附着在处理载体上。 柔性电路基板在其处理之后从粘合膜移除。 在本发明的优选实施方案中，粘合剂膜是整体的。 根据本发明的一个实施方式，将电气部件附接到柔性电路基板并且柔性电路基板被封装。
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4.发明授权Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate 有权固定柔性基板和加工载体的方法以及处理柔性基板的方法公开(公告)号：US06458234B1
公开(公告)日：2002-10-01
申请号：US09421626
申请日：1999-10-19
IPC分类号： B32B3100
CPC分类号： H05K3/007 , H05K1/0393 , H05K2203/0152 , H05K2203/016 , H05K2203/0278 , Y10S156/922 , Y10T156/11
摘要： Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and, processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.
摘要翻译： 公开了将柔性电路基板固定到处理载体的方法。 在一个实施方式中，柔性电路基板和处理载体附接有设置在其间的粘合膜。 在本发明的优选实施方案中，粘合剂膜包括丙烯酸，硅树脂或硅氧烷丙烯酸共混物。 理想地，柔性电路基板的第一表面的总表面积基本上附着在处理载体上。 柔性电路基板在其处理之后从粘合膜移除。 在本发明的优选实施方案中，粘合剂膜是整体的。 根据本发明的一个实施方式，将电气部件附接到柔性电路基板并且柔性电路基板被封装。
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5.发明授权
公开(公告)号：US5700981A
公开(公告)日：1997-12-23
申请号：US598461
申请日：1996-02-08
CPC分类号： H01L23/24 , H01L21/56 , H01L23/293 , H01L23/3135 , H01L2924/0002 , Y10T29/49146
摘要： A method for encapsulating an electronic component includes providing a substrate; providing an enclosure dam around at least a portion of electronic component placed relative to the substrate; providing a first substantially uncured flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component. An encapsulated body having the above attributes is also disclosed.
摘要翻译： 封装电子部件的方法包括提供基板; 提供围绕围绕所述基板放置的电子部件的至少一部分的封闭坝; 在所述电子部件外部和所述外壳内提供第一基本上未固化的可流动的封装材料; 在第一封装材料的顶部和封壳内提供第二封装材料; 并且将所述第一封装材料固化成基本上不可流动的状态，所述第二封装材料和所述封装件在固化期间相对于所述电子部件和基板保持所述第一可流动封装材料，所述固化的第一材料和所述第二材料共同形成 在电子部件上形成封装体。 还公开了具有上述属性的包封体。
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6.发明授权
公开(公告)号：US5973263A
公开(公告)日：1999-10-26
申请号：US914308
申请日：1997-08-18
CPC分类号： H01L23/24 , H01L21/56 , H01L23/293 , H01L23/3135 , H01L2924/0002 , Y10T29/49146
摘要： An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
摘要翻译： 公开了一种用于封闭电子元件的封装体，其包括处于可流动状态的缓慢固化的两部分环氧树脂的第一层; 第二层材料位于第一层的外侧，并且当第一层材料处于可流动状态时，第二层材料基本上将第一层材料保留在电子元件上; 以及围绕电子元件的坝，第一和第二层材料容纳在坝内。
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公开(公告)号：USRE43940E1
公开(公告)日：2013-01-22
申请号：US11864715
申请日：2007-09-28
IPC分类号： G06F11/00
CPC分类号： G01R31/303 , G01R31/01 , G01R31/2822 , G01R31/3025 , G06K7/0095 , G06K19/0701
摘要： A plurality of battery-operated transceivers encapsulated by lamination to form a sheet of independent transceivers is tested in a two piece fixture that forms an enclosure surrounding each in-sheet transceiver. Each enclosure has an antenna for transmitting a command signal to the transceiver at a known power level and for receiving a reply message from the transceiver containing a power level measurement made by the transceiver. Test methods using the fixture of the present invention are also described. An RFID tag and interrogator may each include a transmitter and a receiver. The tag and interrogator may communicate with each other at different frequency bands and may communicate in accordance with a wireless communication protocol.
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8.再颁专利Method and apparatus for communicating with RFID devices coupled to a roll of flexible material 有权用于与耦合到柔性材料卷的RFID装置通信的方法和装置公开(公告)号：USRE42872E1
公开(公告)日：2011-10-25
申请号：US10997556
申请日：2004-11-24
IPC分类号： G06F11/00
CPC分类号： G01R31/303 , G01R31/01 , G01R31/2822 , G01R31/3025 , G06K7/0095 , G06K19/0701
摘要： A plurality of battery-operated transceivers encapsulated by lamination to form a sheet of independent transceivers is tested in a two piece fixture that forms an enclosure surrounding each in-sheet transceiver. Each enclosure has an antenna for transmitting a command signal to the transceiver at a known power level and for receiving a reply message from the transceiver containing a power level measurement made by the transceiver. Test methods using the fixture of the present invention are also described. Flexible radio frequency identification (RFID) devices are coupled to a roll of flexible material. Each RFID device coupled to the roll is advanced into a wireless communication region. An antenna in the region separately communicates with each of the RFID devices in a manner that isolates the communication from other REID devices counted to the roll outside the region.
摘要翻译： 通过层压封装以形成独立收发器片的多个电池供电的收发器在形成围绕每一张片内收发器的外壳的两件式夹具中进行测试。 每个外壳具有用于以已知功率电平向收发器发送命令信号并用于从收发器接收包含由收发器进行的功率电平测量的应答消息的天线。 还描述了使用本发明的固定装置的测试方法。 灵活的射频识别（RFID）设备耦合到一卷柔性材料。 耦合到卷的每个RFID设备被推进到无线通信区域中。 该区域中的天线以与隔离来自与该区域外的滚动计数的其他RFID设备的通信的方式，分别与每个RFID设备进行通信。
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9.发明授权Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods 失效电气设备，电气设备的形成方法以及白蚁感测方法公开(公告)号：US06882284B2
公开(公告)日：2005-04-19
申请号：US10346868
申请日：2003-01-17
申请人： Rickie C. Lake , Mark E. Tuttle
发明人： Rickie C. Lake , Mark E. Tuttle
CPC分类号： A01M1/026 , A01M2200/011 , G08B23/00 , Y10T29/49117
摘要： The invention encompasses an electrical apparatus. Such apparatus includes RFID circuitry on a first substrate, and sensor circuitry on a second substrate. A receiving structure is associated with one of the RFID circuitry and the sensor circuitry, and at least one connecting structure is associated with the other of the RFID circuitry and the sensor circuitry. The at least one connecting structure is removable received within the receiving structure. The invention also encompasses a method of forming an electrical apparatus. A first substrate and a second substrate are provided. The first substrate has RFID circuitry thereon, and the second substrate has sensing circuitry thereon. A receptacle is joined with one of the RFID circuitry and the sensor circuitry, and has at least one orifice extending therein. At least one prong is joined with the other of the RFID circuitry and the sensor circuitry. The prong is removably inserted within the receptacle to electrically connect the RFID circuitry with the sensing circuitry.
摘要翻译： 本发明包括电气设备。 这种装置包括在第一基板上的RFID电路和在第二基板上的传感器电路。 接收结构与RFID电路和传感器电路中的一个相关联，并且至少一个连接结构与RFID电路和传感器电路中的另一个相关联。 所述至少一个连接结构可移除地容纳在所述接收结构内。 本发明还包括形成电气设备的方法。 提供第一基板和第二基板。 第一衬底在其上具有RFID电路，并且第二衬底在其上具有感测电路。 容器与RFID电路和传感器电路中的一个连接，并且在其中延伸有至少一个孔。 至少一个插脚与RFID电路和传感器电路中的另一个连接。 插脚可拆卸地插入插座中以将RFID电路与感测电路电连接。
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10.发明授权Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites 有权用于感测设备附近环境变化的设备，用于感测白蚁的设备以及用于感测白蚁的方法公开(公告)号：US06373391B1
公开(公告)日：2002-04-16
申请号：US09373457
申请日：1999-08-12
申请人： Rickie C. Lake , Mark E. Tuttle , Ross S. Dando
发明人： Rickie C. Lake , Mark E. Tuttle , Ross S. Dando
IPC分类号： G08B2300
CPC分类号： A01M1/026 , A01M2200/011 , G08B23/00
摘要： In one aspect, the invention includes a device for sensing a change in an environment proximate the device. The device comprises a planar loop of conductive material extending along a first plane. The conductive material comprises two ends and the loop is configured to be broken upon the change in the environment. The device further comprises a pair of prongs. A first of the pair of prongs extends from one of the two ends of the conductive material and a second of the pair of prongs extends from an other of the two ends of the conductive material. The first and second prongs extend along the first plane. Additionally, the device comprises a circuit support having circuitry supported thereby and a pair of orifices extending therethrough. The prongs extend through the orifices to electrically connect. the circuitry supported by the circuit support to the planar loop of material. In another aspect, the invention includes a device for sensing termites. In yet another aspect, the invention includes a method for sensing termites.
摘要翻译： 在一个方面，本发明包括用于感测靠近设备的环境变化的设备。 该装置包括沿着第一平面延伸的导电材料的平面环。 导电材料包括两个端部，并且环路构造成在环境变化时被破坏。 该装置还包括一对插脚。 一对插脚中的第一个从导电材料的两个端部中的一个延伸，并且一对插脚中的第二个从导电材料的两个端部中的另一个延伸。 第一和第二分支沿第一平面延伸。 此外，该装置包括具有由其支撑的电路的电路支架和一对延伸穿过其中的孔。 插脚延伸通过孔进行电连接。 由电路支撑的电路支撑到平面材料环路。 在另一方面，本发明包括用于感测白蚁的装置。 在另一方面，本发明包括用于感测白蚁的方法。
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