利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.014 秒)

    Method and system for controlling a substrate position in an electrochemical process
    3.
    发明申请
    Method and system for controlling a substrate position in an electrochemical process 审中-公开
    用于控制电化学过程中的衬底位置的方法和系统

    公开(公告)号：US20060193992A1

    公开(公告)日：2006-08-31

    申请号：US11212048

    申请日：2005-08-25

    申请人： Matthias Bonkass ,  Axel Preusse ,  Markus Nopper

    发明人： Matthias Bonkass ,  Axel Preusse ,  Markus Nopper

    IPC分类号： B05D1/18 ,  B05C11/00 ,  B05C19/02

    CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D21/12 ,  H01L21/2885

    摘要： By using signals from an electric drive assembly of an electroplating tool, the operating position of the substrate surface to be plated may be determined in an automated fashion wherein, based on a reference position, the meniscus of the electrolyte and/or any appropriate operating position may be determined. Consequently, accuracy and throughput may be enhanced compared to conventional manual or semi-automatic adjustment procedures.

    摘要翻译： 通过使用来自电镀工具的电驱动组件的信号，可以以自动方式确定要被电镀的基板表面的操作位置，其中基于参考位置，电解液的弯液面和/或任何适当的操作位置 可以确定。 因此，与传统的手动或半自动调节程序相比，可以提高精度和产量。

    System and method for an increased bath lifetime in a single-use plating regime
    4.
    发明申请
    System and method for an increased bath lifetime in a single-use plating regime 审中-公开
    在一次使用电镀方式中增加浴寿命的系统和方法

    公开(公告)号：US20050241947A1

    公开(公告)日：2005-11-03

    申请号：US11043400

    申请日：2005-01-26

    申请人： Markus Nopper ,  Axel Preusse ,  Matthias Bonkass

    发明人： Markus Nopper ,  Axel Preusse ,  Matthias Bonkass

    IPC分类号： B01J19/08 ,  C01B13/10 ,  C23C18/16 ,  C25D7/00 ,  C25D17/00 ,  C25D21/16 ,  C25D21/18 ,  H01L21/768

    CPC分类号： C23C18/1617 ,  C01B13/10 ,  C25D21/18

    摘要： A plating tool for a single-use plating process comprises a reclaim system in combination with a support tank to enable collection of non-consumed plating solution drained off from the process chamber, which is then re-circulated to the support tank after an efficient treatment in the reclaim system. Since the non-consumed plating solution is continuously recycled, the electrolyte may be preserved substantially without any time limit while at the same time production costs for a single-use plating process are significantly reduced.

    摘要翻译： 用于一次性电镀工艺的电镀工具包括与支撑罐组合的回收系统，以能够收集从处理室排出的非消耗电镀溶液，然后在有效处理之后将其再循环到支撑罐 在回收系统中。 由于不消耗电镀溶液被连续地再循环，所以可以基本上保持电解质没有任何时间限制，同时，一次性电镀工艺的生产成本显着降低。

    Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
    5.
    发明申请
    Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface 审中-公开
    用于在衬底表面上金属镀覆期间自动控制多阳极布置的电流分布的方法和系统

    公开(公告)号：US20050067290A1

    公开(公告)日：2005-03-31

    申请号：US10861997

    申请日：2004-06-04

    申请人： Matthias Bonkass ,  Dirk Wollstein ,  Axel Preusse

    发明人： Matthias Bonkass ,  Dirk Wollstein ,  Axel Preusse

    IPC分类号： C25D21/12

    CPC分类号： C25D21/12

    摘要： An electroplating tool is operated in combination with a controller which automatically determines the individual currents for a multi-anode configuration of the plating tool. The calculation of the anode currents may be based on sensitivity data and measurement data as well as on a desired target profile, so that a fast response with respect to process variations may be achieved even for a plating tool including a plurality of process chambers.

    摘要翻译： 电镀工具与控制器一起操作，控制器自动确定电镀工具的多阳极配置的各个电流。 阳极电流的计算可以基于灵敏度数据和测量数据以及期望的目标轮廓，使得即使对于包括多个处理室的电镀工具也可以实现关于工艺变化的快速响应。

    Method and system for controlling ion distribution during plating of a metal on a workpiece surface
    6.
    发明授权
    Method and system for controlling ion distribution during plating of a metal on a workpiece surface 有权
    在工件表面镀金属时控制离子分布的方法和系统

    公开(公告)号：US06974530B2

    公开(公告)日：2005-12-13

    申请号：US10358969

    申请日：2003-02-05

    申请人： Matthias Bonkass ,  Axel Preusse

    发明人： Matthias Bonkass ,  Axel Preusse

    IPC分类号： C25D5/00 ,  C25D5/02 ,  C25D7/12 ,  C25D17/00 ,  C26D7/00

    CPC分类号： C25D5/02 ,  C25D5/006 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008 ,  Y10S204/07

    摘要： The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

    摘要翻译： 电解质和/或离子的流动由设置在电镀反应器中的扩散器元件控制，其中在一个实施例中，漫射元件包括用于调节扩散器元件的通道的有效尺寸的机械调节机构。 在另一个实施例中，扩散器元件包括可相对于彼此移动的至少两个通道图案，以便调整相应通道的重叠并因此调整有效尺寸。 此外，电镀反应器内的离子路径可以由电磁驱动的扩散器元件来控制，从而可获得工件表面上所需的厚度分布。