公开(公告)号：US5448826A

公开(公告)日：1995-09-12

申请号：US231492

申请日：1994-04-22

申请人： Martin Goetz ,  Joseph Babiarz

发明人： Martin Goetz ,  Joseph Babiarz

IPC分类号： H01L21/00 ,  H01L23/66 ,  H05K13/00

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

公开(公告)号：US5753972A

公开(公告)日：1998-05-19

申请号：US645729

申请日：1996-05-14

申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz

发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/66 ,  H01L23/52

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/3011

摘要： A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的微电子封装包括：至少部分导电的基底，其附着到具有在其中心形成的空腔的RF衬底和用于提供从封装的内部到外部的互连的导电路径的图案。 基底可以是金属或陶瓷，其上沉积有金属层。 通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）将密封帽附接到RF基板上，以在微电子器件安装在内部之后密封封装。

公开(公告)号：US5736783A

公开(公告)日：1998-04-07

申请号：US645848

申请日：1996-05-14

申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/66 ,  H01L23/52

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/3011

摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

公开(公告)号：US06172412B2

公开(公告)日：2001-01-09

申请号：US09220133

申请日：1998-12-23

申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

IPC分类号： H01L2940

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/00

摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

公开(公告)号：US5692298A

公开(公告)日：1997-12-02

申请号：US526535

申请日：1995-09-11

申请人： Martin Goetz ,  Joseph Babiarz

发明人： Martin Goetz ,  Joseph Babiarz

IPC分类号： H01L21/00 ,  H01L23/66 ,  H05K3/24

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

公开(公告)号：US5465008A

公开(公告)日：1995-11-07

申请号：US134269

申请日：1993-10-08

申请人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

发明人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

IPC分类号： H01L21/00 ,  H01L23/66 ,  H01L23/92 ,  H01L23/12

CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

公开(公告)号：US07671984B2

公开(公告)日：2010-03-02

申请号：US11587453

申请日：2005-04-26

申请人： Wilhelm Schebesta ,  Werner Hoyme ,  Michael Rode ,  Nico Correns ,  Martin Goetz

发明人： Wilhelm Schebesta ,  Werner Hoyme ,  Michael Rode ,  Nico Correns ,  Martin Goetz

IPC分类号： G01J3/28

CPC分类号： G01N21/274 ,  G01N21/474

摘要： An arrangement for measuring the diffuse reflection of samples and a method for internal recalibration of the measuring head. The spectrometric measuring head with a device for recalibration comprises a housing which is provided with a window and which contains an illumination source, a spectrometer arrangement and at least two standards for internal recalibration. The two standards can be swiveled into the beam path of the measuring head selectively so that the measurement light emitted by the illumination source can be used in its entirety for recalibration. A processor for acquiring and processing measured values and an interface to a bus system are arranged in the housing. Accordingly, relatively time-consuming calibration of the measuring head at the place of use is required only before putting into operation or at longer time intervals. By the internal recalibrations, it is possible to prevent changes in the measured values in long-term operation.

摘要翻译： 用于测量样品的漫反射的装置和用于测量头的内部重新校准的方法。 具有用于重新校准的装置的光谱测量头包括设置有窗口的壳体，其包含照明源，光谱仪布置和用于内部重新校准的至少两个标准。 这两个标准可以选择性地旋转到测量头的光束路径中，使得由照明源发射的测量光可以被整体用于重新校准。 用于获取和处理测量值的处理器和与总线系统的接口被布置在壳体中。 因此，只有在投入使用之前或以更长的时间间隔才需要相对耗时的测量头在使用地点的校准。 通过内部重新校准，可以防止长期运行中测量值的变化。

公开(公告)号：US20070210818A1

公开(公告)日：2007-09-13

申请号：US11371382

申请日：2006-03-09

申请人： Martin Goetz ,  Gary O'Neil ,  Bradford Thomasson

发明人： Martin Goetz ,  Gary O'Neil ,  Bradford Thomasson

IPC分类号： G01R31/02

CPC分类号： G01K7/015

摘要： Apparatus and methods for monitoring temperature which employ certain characteristics of diodes in an effective way to monitor the temperature of a heat generating device and enable use of a signal derived from the monitored temperature to control the heat generating device or accessories if so desired.

摘要翻译： 用于监测采用某些二极管特性的温度的装置和方法，以有效的方式监测发热装置的温度，并且能够使用来自监测温度的信号来控制发热装置或附件（如果需要）。

公开(公告)号：US06744336B1

公开(公告)日：2004-06-01

申请号：US10271392

申请日：2002-10-15

申请人： Martin Goetz ,  Sarah Schwab

发明人： Martin Goetz ,  Sarah Schwab

IPC分类号： H03H964

CPC分类号： H03H9/1092 ,  Y10T29/42

摘要： A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.

摘要翻译： 一种表面声波（SAW）电路封装及其制造方法。 在一个实施例中，封装包括：（1）基本上平面的压电基板，（2）位于基板上方的SAW电路导体，以及（3）位于SAW电路导体上方的钝化层，所述基板和钝化层协作形成 气密密封，用于将SAW电路导体与封装附近的环境隔离开来。

公开(公告)号：US06495398B1

公开(公告)日：2002-12-17

申请号：US09755018

申请日：2001-01-05

申请人： Martin Goetz

发明人： Martin Goetz

IPC分类号： H01L4104

CPC分类号： H03H9/1071

摘要： A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate, (3) sidewalls connected to, and extending from a plane of the substrate and surrounding the SAW conductors and (4) a lid connected to the sidewalls, the substrate, sidewalls and lid cooperating to form a hermetic enclosure for the SAW conductors.

摘要翻译： 一种表面声波（SAW）电路封装及其制造方法。 在一个实施例中，封装包括：（1）基本上平面的压电基板，（2）位于基板上方的SAW电路导体，（3）连接到基板的平面并从基板的平面延伸并围绕SAW导体的侧壁和 4）连接到侧壁的盖子，基板，侧壁和盖子协作以形成用于SAW导体的密封外壳。