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    High frequency microelectronics package
    1.
    发明授权
    High frequency microelectronics package 失效
    高频微电子封装

    公开(公告)号：US5736783A

    公开(公告)日：1998-04-07

    申请号：US645848

    申请日：1996-05-14

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/66 ,  H01L23/52

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/3011

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

    High frequency microelectronics package
    2.
    发明授权
    High frequency microelectronics package 有权
    高频微电子封装

    公开(公告)号：US06172412B2

    公开(公告)日：2001-01-09

    申请号：US09220133

    申请日：1998-12-23

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L2940

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

    Ceramic microelectronics package
    4.
    发明授权
    Ceramic microelectronics package 失效
    陶瓷微电子封装

    公开(公告)号：US5465008A

    公开(公告)日：1995-11-07

    申请号：US134269

    申请日：1993-10-08

    申请人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

    发明人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

    IPC分类号： H01L21/00 ,  H01L23/66 ,  H01L23/92 ,  H01L23/12

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

    摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

    Method of making ceramic microwave electronic package
    5.
    发明授权
    Method of making ceramic microwave electronic package 失效
    陶瓷微波电子封装方法

    公开(公告)号：US5448826A

    公开(公告)日：1995-09-12

    申请号：US231492

    申请日：1994-04-22

    申请人： Martin Goetz ,  Joseph Babiarz

    发明人： Martin Goetz ,  Joseph Babiarz

    IPC分类号： H01L21/00 ,  H01L23/66 ,  H05K13/00

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

    摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

    Method of making ceramic microwave electronic package
    6.
    发明授权
    Method of making ceramic microwave electronic package 失效
    陶瓷微波电子封装方法

    公开(公告)号：US5692298A

    公开(公告)日：1997-12-02

    申请号：US526535

    申请日：1995-09-11

    申请人： Martin Goetz ,  Joseph Babiarz

    发明人： Martin Goetz ,  Joseph Babiarz

    IPC分类号： H01L21/00 ,  H01L23/66 ,  H05K3/24

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

    摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。