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    High frequency microelectronics package
    1.
    发明授权
    High frequency microelectronics package 有权
    高频微电子封装

    公开(公告)号：US06172412B2

    公开(公告)日：2001-01-09

    申请号：US09220133

    申请日：1998-12-23

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L2940

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

    High frequency microelectronics package
    2.
    发明授权
    High frequency microelectronics package 失效
    高频微电子封装

    公开(公告)号：US5736783A

    公开(公告)日：1998-04-07

    申请号：US645848

    申请日：1996-05-14

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/66 ,  H01L23/52

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/3011

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

    Ceramic microelectronics package
    4.
    发明授权
    Ceramic microelectronics package 失效
    陶瓷微电子封装

    公开(公告)号：US5465008A

    公开(公告)日：1995-11-07

    申请号：US134269

    申请日：1993-10-08

    申请人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

    发明人： Martin Goetz ,  Joseph Babiarz ,  Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner

    IPC分类号： H01L21/00 ,  H01L23/66 ,  H01L23/92 ,  H01L23/12

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49158

    摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从 内到外包装。 基底可以是金属或陶瓷，其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

    High-frequency passband microelectronics package
    5.
    发明授权
    High-frequency passband microelectronics package 有权
    高频通带微电子封装

    公开(公告)号：US06271579B1

    公开(公告)日：2001-08-07

    申请号：US09685632

    申请日：2000-10-09

    申请人： Timothy J. Going ,  Alan W. Lindner

    发明人： Timothy J. Going ,  Alan W. Lindner

    IPC分类号： H01L2940

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A high-frequency passband microelectronic package suitable for housing a high-frequency (e.g.,GHz range) electronic device operating at frequencies within the passband is disclosed herein. The package includes a base, an RF circuit substrate attached to a surface of the base and having a cavity for receiving the electronic device, and transmission lines formed on a surface of the circuit substrate. Each transmission line includes a first conductive pad for attachment to a node of the electronic device, a second conductive pad for attachment by a conductive lead to a node external to the package, and a matching circuit electrically coupled between the pads. The matching circuit includes a non-straight conductive trace shaped to compensate for impedance discontinuities between the node of the electronic device and the node external to the package at the high-frequency passband. For example, the trace can be shaped to compensate for the impedance discontinuity caused by the lead. The shape of the trace is determined by an electromagnetic simulation computer program simulating the frequency response of the transmission line based upon predetermined parameters defining the electromagnetic environment in which the trace will be used, and iterating the shape of the trace until desired performance characteristics are met at a passband frequency range of interest. The transmission lines may include microstrip, co-planar waveguide, and stripline transmission lines. A mating transmission line having such a matching circuit can also be formed on a circuit board having such a high-frequency package mounted thereto.

    摘要翻译： 本文公开了一种适用于容纳以通带内的频率工作的高频（例如，GHz范围）电子设备的高频通带微电子封装。 封装包括基座，附接到基座的表面并具有用于接收电子器件的空腔的RF电路基板，以及形成在电路基板的表面上的传输线。 每个传输线包括用于连接到电子设备的节点的第一导电焊盘，用于通过导电引线连接到封装外部的节点的第二导电焊盘，以及电耦合在焊盘之间的匹配电路。 匹配电路包括非直线导电迹线，其被形状地补偿电子设备的节点与在高频通带处的封装外部的节点之间的阻抗不连续性。 例如，迹线可以被成形为补偿由引线引起的阻抗不连续性。 轨迹的形状由模拟基于传输线的频率响应的电磁仿真计算机程序确定，该程序基于定义将使用轨迹的电磁环境的预定参数，并迭代迹线的形状，直到达到所需的性能特征 在感兴趣的通带频率范围。 传输线可以包括微带，共面波导和带状线传输线。 具有这种匹配电路的匹配传输线也可以形成在具有安装在其上的高频封装的电路板上。