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1.发明申请公开(公告)号：US20100046351A1
公开(公告)日：2010-02-25
申请号：US12495323
申请日：2009-06-30
IPC分类号： G11B17/00
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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2.发明申请公开(公告)号：US20120229934A1
公开(公告)日：2012-09-13
申请号：US13481530
申请日：2012-05-25
IPC分类号： G11B5/48
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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公开(公告)号：US20120238072A1
公开(公告)日：2012-09-20
申请号：US13487435
申请日：2012-06-04
IPC分类号： H01L21/78
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
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4.发明申请FLEXURE BASED SHOCK AND VIBRATION SENSOR FOR HEAD SUSPENSIONS IN HARD DISK DRIVES 有权用于硬盘驱动器中的头枕的基于挠性的震动和振动传感器公开(公告)号：US20120200959A1
公开(公告)日：2012-08-09
申请号：US13449679
申请日：2012-04-18
IPC分类号： G11B5/48
CPC分类号： G11B5/4833 , G11B5/4826 , G11B19/042
摘要： Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
摘要翻译： 用于基于挠性的冲击和振动传感器的系统和方法，用于硬盘驱动器中的头悬挂。 具体地，本发明涉及硬盘驱动器内的操作冲击和振动管理。 在一个实施方案中，组件包括电路嵌入式光波导传感器，其包括具有单层或多层导体迹线的配置的柔性电路板，用于承载和飞行HDD滑块的薄弯曲万向架，连续感测层 由光芯构成，通过包层结构构成单芯阵列或多芯阵列，由光输入和输出核形成的光环，配置在连续感测层上的光栅，形成光栅波导传感器 ，用于将光注入光纤芯的光发射器和接收来自光芯的输出光的接收器。
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公开(公告)号：US20120291260A1
公开(公告)日：2012-11-22
申请号：US13526887
申请日：2012-06-19
IPC分类号： B23P11/00
CPC分类号： G11B33/1426 , G11B33/123 , H05K1/0206 , H05K1/056 , H05K1/189 , H05K2201/09509 , H05K2201/09554
摘要： Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.
摘要翻译： 描述了一种用于硬盘驱动器的前置放大器柔性电缆。 柔性电缆包括可操作以提供机械支撑件的加强层，设置在加强层上的绝缘层，并且具有设置在其中的至少一个通孔以露出加强层，以及设置在绝缘层上的至少一个导电层。 所述至少一个导电层形成电路和至少一个散热元件，其延伸穿过所述通孔并与所述加强层建立接触。 在一个实施方式中，除热元件包括具有凹入的中心部分和边缘部分的矩形板。 凹陷的中心部分穿过绝缘层中的至少一个通孔突出以与加强件机械地联接。 在另一实施方式中，除热元件包括第一部分和第二矩形部分。 第一部分穿过绝缘层中的至少一个通孔突出，以与加强件热耦合，并且第二部分设置在绝缘层上方，使得第二部分可以热耦合到前置放大器。
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公开(公告)号：US20100051334A1
公开(公告)日：2010-03-04
申请号：US12549993
申请日：2009-08-28
申请人： Voonyee HO , Takeshi TANAKA , Masami INOUE , Martin John MCCASLIN
发明人： Voonyee HO , Takeshi TANAKA , Masami INOUE , Martin John MCCASLIN
CPC分类号： H05K1/0271 , G11B5/486 , H05K1/0237 , H05K1/028 , H05K1/167 , H05K3/244 , H05K2201/0352 , H05K2201/09236 , H05K2201/09672 , Y10T29/49124
摘要： A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.
摘要翻译： 在悬架体上形成第一绝缘层。 在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖写入布线迹线。 写入布线迹线和读取布线迹线形成在第二绝缘层上。 写入布线迹线布置在写入布线迹线的上方。 写入布线迹线包括导体层和增强合金层。 依次形成加强合金层以覆盖导体层的上表面和侧表面。
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