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    Semiconductor device improved in light shielding property and light shielding package
    1.
    发明授权
    Semiconductor device improved in light shielding property and light shielding package 失效
    半导体器件改善了遮光性能和遮光封装

    公开(公告)号：US5394014A

    公开(公告)日：1995-02-28

    申请号：US149893

    申请日：1993-11-10

    申请人： Masahiko Ishikawa ,  Kohji Hayano ,  Shinichi Mori ,  Masayuki Yamashita ,  Osamu Ueda ,  Namiki Moriga

    发明人： Masahiko Ishikawa ,  Kohji Hayano ,  Shinichi Mori ,  Masayuki Yamashita ,  Osamu Ueda ,  Namiki Moriga

    IPC分类号： H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H01L23/28

    CPC分类号： H01L23/552 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025

    摘要： In accordance with one aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light.

    摘要翻译： 根据本发明的一个方面，提供一种半导体器件，其包括直接由具有遮光性的树脂材料覆盖的半导体芯片以及设置在用于屏蔽半导体器件的树脂材料上的膜 光。 膜可以由具有被金属覆盖的表面和着色为黑色的后表面，以蒸气相沉积的金属或陶瓷层的密封件或者折射率为绝缘材料的绝缘材料的涂层形成， 指数与树脂材料的指数不同。 在本发明的另一方面，提供一种直接用与吸光材料混合的树脂材料覆盖的半导体器件。 在本发明的另一方面，提供一种半导体器件，其包括具有被黑色聚酰亚胺覆盖的表面的半导体芯片，该半导体器件进一步被具有遮光性的树脂材料覆盖。 在本发明的另一方面，提供一种用于覆盖安装在布线板上的半导体器件的封装。 根据这样的改进，特别是相对于厚度仅为1mm的薄型半导体器件而言，防光性能得到改善，并且防止了由于光引起的故障的半导体器件。

    Semiconductor device improved in light shielding property and light shielding package
    2.
    发明授权
    Semiconductor device improved in light shielding property and light shielding package 失效
    半导体器件改善了遮光性能和遮光封装

    公开(公告)号：US5317195A

    公开(公告)日：1994-05-31

    申请号：US792872

    申请日：1991-11-19

    申请人： Masahiko Ishikawa ,  Kohji Hayano ,  Shinichi Mori ,  Masayuki Yamashita ,  Osamu Ueda ,  Namiki Moriga

    发明人： Masahiko Ishikawa ,  Kohji Hayano ,  Shinichi Mori ,  Masayuki Yamashita ,  Osamu Ueda ,  Namiki Moriga

    IPC分类号： H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H01L23/28

    CPC分类号： H01L23/552 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025

    摘要： Provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light.

    摘要翻译： 提供了一种半导体器件，其包括直接由具有遮光性的树脂材料覆盖的半导体芯片以及设置在用于屏蔽半导体器件的光的树脂材料上的膜。 膜可以由具有被金属覆盖的表面和着色为黑色的后表面，以蒸气相沉积的金属或陶瓷层的密封件或者折射率为绝缘材料的绝缘材料的涂层形成， 指数与树脂材料的指数不同。 在本发明的另一方面，提供一种直接用与吸光材料混合的树脂材料覆盖的半导体器件。 在本发明的另一方面，提供一种半导体器件，其包括具有被黑色聚酰亚胺覆盖的表面的半导体芯片，该半导体器件进一步被具有遮光性的树脂材料覆盖。 在本发明的另一方面，提供一种用于覆盖安装在布线板上的半导体器件的封装。 根据这样的改进，特别是相对于厚度仅为1mm的薄型半导体器件而言，防光性能得到改善，并且防止了由于光引起的故障的半导体器件。

    Ink, ink container, image forming method, image forming apparatus, and image formed matter
    3.
    发明授权
    Ink, ink container, image forming method, image forming apparatus, and image formed matter 有权

    公开(公告)号：US10190007B2

    公开(公告)日：2019-01-29

    申请号：US15149440

    申请日：2016-05-09

    申请人： Hiroshi Gotou ,  Masahiko Ishikawa

    发明人： Hiroshi Gotou ,  Masahiko Ishikawa

    IPC分类号： C09D11/322 ,  C09D11/38

    摘要： Provided is an ink containing a colorant, an organic solvent, and water, wherein the ink contains as the organic solvent, at least one kind of an organic solvent having a solubility parameter of greater than or equal to 9 but less than 11.8, wherein a content of the organic solvent having a solubility parameter of greater than or equal to 9 but less than 11.8 is greater than or equal to 20% by mass of a total amount of the ink, wherein a dynamic surface tension A of the ink at 25° C. at a surface lifetime, measured by a maximum foaming pressure method, of 15 msec is less than or equal to 34.0 mN/m, and wherein the dynamic surface tension A and a static surface tension B of the ink at 25° C. satisfy a formula of 10.0%≤[(A−B)/(A+B)]×100≤19.0%.

    Reinforced Solid Polymer Electrolyte Composite Membrane, Membrane Eelctrode Assembly For Solid Polymer Fuel Cell, and Solid Polymer Fuel Cell
    6.
    发明申请
    Reinforced Solid Polymer Electrolyte Composite Membrane, Membrane Eelctrode Assembly For Solid Polymer Fuel Cell, and Solid Polymer Fuel Cell 有权
    强化固体聚合物电解质复合膜，固体聚合物燃料电池和固体聚合物燃料电池的膜鳗弧形装置

    公开(公告)号：US20110070521A1

    公开(公告)日：2011-03-24

    申请号：US12672131

    申请日：2008-08-08

    申请人： Masahiko Ishikawa ,  Tomoyuki Takane

    发明人： Masahiko Ishikawa ,  Tomoyuki Takane

    IPC分类号： H01M8/10

    CPC分类号： H01M8/1016 ,  H01M8/0289 ,  H01M8/0293 ,  H01M8/0637 ,  H01M2300/0094 ,  Y02E60/521 ,  Y02E60/566

    摘要： The invention provides a solid polymer fuel cell whose operational stability over time has been enhanced. A reinforced solid polymer electrolyte composite membrane for a solid polymer fuel cell according to the present invention comprises two or more polymer electrolyte membranes and one or more layers of a sheet-like porous reinforcing member, wherein the polymer electrolyte membranes provide both the upper and lower surfaces of the composite membrane, and pores in the sheet-like porous reinforcing member are substantially filled with the electrolyte from the polymer electrolyte membranes, and wherein the sheet-like porous reinforcing member contains a peroxide decomposition catalyst.

    摘要翻译： 本发明提供了一种固体聚合物燃料电池，其操作稳定性随时间增加。 本发明的固体高分子型燃料电池用强化固体高分子电解质复合膜含有2种以上的高分子电解质膜和1层以上的片状多孔质增强材料，其中，上述聚合物电解质膜 复合膜的表面和片状多孔质增强构件中的孔基本上由聚合物电解质膜填充电解质，并且其中片状多孔增强构件含有过氧化物分解催化剂。

    Heat-resistant resin composition
    7.
    发明授权
    Heat-resistant resin composition 失效
    耐热树脂组合物

    公开(公告)号：US5321097A

    公开(公告)日：1994-06-14

    申请号：US054194

    申请日：1993-04-30

    申请人： Takao Kawaki ,  Akikazu Amagai ,  Masahiko Ishikawa ,  Toshiaki Yamada ,  Yasuhiro Hirai ,  Hajime Ban

    发明人： Takao Kawaki ,  Akikazu Amagai ,  Masahiko Ishikawa ,  Toshiaki Yamada ,  Yasuhiro Hirai ,  Hajime Ban

    IPC分类号： C08G18/40 ,  C08G18/64 ,  C08L79/08 ,  C08L81/02 ,  C08L81/04

    CPC分类号： C08L79/08 ,  C08G18/4081 ,  C08G18/6438 ,  C08G18/6453 ,  C08L81/02

    摘要： A heat-resistant resin composition comprising a melt-kneaded product of:(A) at least one member selected from the group consisting of a polyamideimide resin precursor composed mainly of a recurring unit of the formula (1)-a, ##STR1## wherein R is a divalent aromatic group or aliphatic group, R.sup.1 is a hydrogen atom, an alkyl group or a phenyl group, and Ar is a trivalent aromatic group composed of at least one six-membered ring, and a polyamideimide resin composed mainly of a recurring unit of the formula (1)-b, ##STR2## wherein R, R.sup.1 and Ar are as defined in the above formula (1)-a, (B) a polyphenylene sulfide resin, and(C) an organic isocyanate compound having at least two isocyanate groups in the molecule, the amount of said organic isocyanate compound being 0.5 to 5 parts by weight based on 100 parts by weight of the total amount of the compounds (A) and (B).

    摘要翻译： 1.一种耐热性树脂组合物，其特征在于，含有以下物质的熔融混炼物：（A）选自主要由式（1）-a，（IMAGE）的重复单元组成的组的聚酰胺酰亚胺树脂前体中的至少一种 1）-a其中R是二价芳族基团或脂族基团，R1是氢原子，烷基或苯基，Ar是由至少一个六元环组成的三价芳族基团和聚酰胺酰亚胺树脂 主要由式（1）-b，其中R，R 1和Ar如上述式（1）-a定义的重复单元-b，（B）聚苯硫醚树脂， 和（C）分子中具有至少两个异氰酸酯基的有机异氰酸酯化合物，所述有机异氰酸酯化合物的量相对于化合物（A）和（A）的总量的100重量份为0.5〜5重量份， B）。