公开(公告)号：US20120186863A1

公开(公告)日：2012-07-26

申请号：US13355916

申请日：2012-01-23

申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

IPC分类号： H05K1/02

CPC分类号： H05K1/111 ,  H01L23/12 ,  H01L23/32 ,  H01L24/00 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/09745 ,  Y02P70/611

摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.

摘要翻译： 一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在 提供每个导电焊盘的上表面。 导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。 实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏 。

公开(公告)号：US20120211271A1

公开(公告)日：2012-08-23

申请号：US13399547

申请日：2012-02-17

申请人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

发明人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

IPC分类号： H05K1/02

CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。