摘要:
It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.The semiconductor inspection apparatus includes means for imaging a shape on a wafer or on an exposure mask; means for storing an image inspected by the imaging means; means for storing design data of the semiconductor circuit corresponding to a position on the wafer or on the exposure mask which are to be imaged by the imaging means; means for storing a design-data image obtained as a result of converting the design data into an image; means for generating a design-data ROI image by converting an interest drawing region found from a relative crude-density relation of a shape included in the design-data image into an image; and a position alignment section configured to carry out position alignment on the inspected image and the design-data image. The semiconductor inspection apparatus makes use of the design-data ROI image in order to identify a position at which the inspected image and the design-data image match each other or compute the degree of coincidence.
摘要:
It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.The semiconductor inspection apparatus includes means for imaging a shape on a wafer or on an exposure mask; means for storing an image inspected by the imaging means; means for storing design data of the semiconductor circuit corresponding to a position on the wafer or on the exposure mask which are to be imaged by the imaging means; means for storing a design-data image obtained as a result of converting the design data into an image; means for generating a design-data ROI image by converting an interest drawing region found from a relative crude-density relation of a shape included in the design-data image into an image; and a position alignment section configured to carry out position alignment on the inspected image and the design-data image. The semiconductor inspection apparatus makes use of the design-data ROI image in order to identify a position at which the inspected image and the design-data image match each other or compute the degree of coincidence.
摘要:
The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matching processing device, matching processing between the design image and the photographic image is performed, a partial design image is obtained by clipping a portion having the highest correlation (step 101), and processing for deforming the photographic image in accordance with the clipped design image (steps 102 to 105) is performed, so that correlation between the deformed image obtained and the design image is taken to be set as the similarity degree.
摘要:
The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matching processing device, matching processing between the design image and the photographic image is performed, a partial design image is obtained by clipping a portion having the highest correlation (step 101), and processing for deforming the photographic image in accordance with the clipped design image (steps 102 to 105) is performed, so that correlation between the deformed image obtained and the design image is taken to be set as the similarity degree.
摘要:
Provided is a template matching method and a template matching apparatus, where the degree of matching between a template and the actual image upon template matching is maintained at a high level, without depending on a partial appearance of a lower layer. Proposed as one embodiment, is a method and an apparatus for template matching, where either an area is set in which comparison of the template and the image is not conducted, or a second area is set inside the template where comparison different from comparison conducted in a first comparison area is to be conducted, and the template matching is conducted on the basis either of comparison excluding the non-comparison area, or of comparison using the first and second areas.
摘要:
Provided is a template matching method and a template matching apparatus, where the degree of matching between a template and the actual image upon template matching is maintained at a high level, without depending on a partial appearance of a lower layer. Proposed as one embodiment, is a method and an apparatus for template matching, where either an area is set in which comparison of the template and the image is not conducted, or a second area is set inside the template where comparison different from comparison conducted in a first comparison area is to be conducted, and the template matching is conducted on the basis either of comparison excluding the non-comparison area, or of comparison using the first and second areas.
摘要:
An evaluation value indicative of the extent of lines in each direction is calculated for a pre-processed image in which 0s are filled in and extended in the lateral direction of the inputted image and which has been reduced ⅛th in the longitudinal direction. To obtain the angle of rotation of an image from the change in the evaluation value obtained while the angle relative to the lateral direction of the pre-processed image is modified in small steps, a parallel line is drawn for each direction, a projection is taken, and the sum of squares serves as the evaluation value of the direction. The direction having the highest evaluation value serves as the obtained direction of rotation from the normal position. The projection of each direction references the point of intersection between the parallel line drawn for each direction and the coordinate line of the horizontal axis.
摘要:
An evaluation value indicative of the extent of lines in each direction is calculated for a pre-processed image in which 0s are filled in and extended in the lateral direction of the inputted image and which has been reduced ⅛th in the longitudinal direction. To obtain the angle of rotation of an image from the change in the evaluation value obtained while the angle relative to the lateral direction of the pre-processed image is modified in small steps, a parallel line is drawn for each direction, a projection is taken, and the sum of squares serves as the evaluation value of the direction. The direction having the highest evaluation value serves as the obtained direction of rotation from the normal position. The projection of each direction references the point of intersection between the parallel line drawn for each direction and the coordinate line of the horizontal axis.
摘要:
Provided is a defect review device enabling identification of a defect and a defect coordinate 33. The defect review device comprises a distance inspection image generation unit 5 for generating, on the basis of an inspection image 28, a distance inspection image 29 in which distance values between pixels constituting the contour of an actual pattern 28a and pixels lying in a direction normal to the contour are set in respect of the individual pixels, a distance design image generation unit 6 for generating a distance design image 27 in which values between pixels constituting the contour of a design pattern 26a corresponding to the actual pattern 28a and pixels lying in a direction normal to the contour are set in respect of the individual pixels, a distance difference image generation unit 9 for generating a distance difference image 30 in which differences in distance value between the distance design image 27 and the distance inspection image 29 are set in respect of the individual pixels, and a defect coordinate identifying unit 10 for identifying, on the basis of the distance difference image 30, a defect coordinate 33 at which a defect 28b takes place.
摘要:
A data management equipment connected with a general inspection system for detecting a defect candidate on a wafer and acquiring a location thereof, a design data server for storing a design data for a semiconductor circuit and a defect review system for acquiring a defect data image on the basis of the location and comparing the defect candidate image with a defect-free reference image to identify a defect. The data management equipment includes a first detecting unit for finding that the general inspection system is acquiring a location, a storage controlling unit responsive to the finding to start to store the location from the general inspection system in a storage unit and a defect-circumferential design data acquiring unit for acquiring from a portion of the design data a defect-circumferential design data such that a reference image including the location can be produced from the defect-circumferential design data.