公开(公告)号：US06985363B2

公开(公告)日：2006-01-10

申请号：US10398032

申请日：2001-09-28

申请人： Yoshihiko Yagi ,  Kazuhiro Uji ,  Michiro Yoshino ,  Kenichi Yamamoto

发明人： Yoshihiko Yagi ,  Kazuhiro Uji ,  Michiro Yoshino ,  Kenichi Yamamoto

IPC分类号： H05K7/06 ,  H01L21/44

CPC分类号： G11C5/063 ,  G06K19/07 ,  G11C5/02 ,  H01L23/4985 ,  H01L23/49855 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/09181 ,  H05K2201/10159 ,  H05K2201/10303 ,  H05K2201/10674 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/48

摘要： To provide a card-type recording medium which is capable of increasing memory capacity and excellent in rigidity and shock resistance, and to provide a method for manufacturing the same. A card-type recording medium comprising a memory module 221, 222, 270 which is so constituted that a plurality of memory chips 15 are mounted on a memory board 21, 22, 70, 63, 65 is mounted on one surface of a base board 10, and an IC chip 13, 14, 60 for controlling operation of the plurality of memory chips is mounted on the other surface of the base board, with all housed in a package 30, 31.

摘要翻译： 提供能够提高存储容量并且具有优异的刚性和抗冲击性的卡式记录介质，并提供其制造方法。 一种卡式记录介质，包括存储器模块221,222,270，其被构造成使得多个存储器芯片15安装在存储器板21,22,70,63,65上，安装在基板的一个表面上 如图10所示，并且用于控制多个存储器芯片的操作的IC芯片13,14,60安装在基板的另一表面上，全部容纳在封装30,31中。

公开(公告)号：US06402011B1

公开(公告)日：2002-06-11

申请号：US09633293

申请日：2000-08-04

申请人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

发明人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

IPC分类号： B23K3102

CPC分类号： B23K3/085 ,  B23K1/008 ,  B23K2101/42 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3494 ,  H05K2203/087 ,  H05K2203/304

摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

摘要翻译： 对于回流焊接，辐射加热被施加到印刷电路板的放置电子部件的一个表面上，并且在其上供应奶油焊膏，并且同时热空气局部地被吹送并大致垂直于待连接点 所述印刷电路板的一个表面。 这种回流方法即使热空气被设定在不超过电子部件的耐热性的温度下，由于与辐射热的组合，所以能够进行安全的焊接。 此外，这种回流方法可以以这样的方式允许焊接，即只有待连接点被选择性地加热，因为热空气局部地吹动并且大致垂直于要连接的点。 因此，这种回流方法可防止对待连接点的其他部分的热损伤，并确保待连接点处的焊料熔化。

公开(公告)号：US6145734A

公开(公告)日：2000-11-14

申请号：US835989

申请日：1997-04-11

申请人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

发明人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

IPC分类号： B23K1/008 ,  B23K3/08 ,  H05K3/34 ,  B23K1/005 ,  B23K1/012

CPC分类号： B23K3/085 ,  B23K1/008 ,  H05K3/3494 ,  B23K2201/42 ,  H05K2203/087 ,  H05K2203/304 ,  H05K3/3415 ,  H05K3/3447

摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.