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公开(公告)号：US09204496B2
公开(公告)日：2015-12-01
申请号：US13883940
申请日：2011-11-08
申请人： Masaki Hanada , Yukio Abe , Koji Yoshimoto , Takahito Ishii , Kazuyuki Kohara
发明人： Masaki Hanada , Yukio Abe , Koji Yoshimoto , Takahito Ishii , Kazuyuki Kohara
CPC分类号： H05B3/20 , H05B3/28 , H05B3/845 , H05B2203/011 , H05B2203/017 , Y10T156/1002
摘要： A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.
摘要翻译： 平面加热元件具有电绝缘基板，至少一对电极，其包括覆盖有导电覆盖层的薄金属线，并且被放置在电绝缘基板的表面上，聚合物电阻器被放置在电绝缘基板上 并且由电极供电，以及覆盖电极和聚合物电阻器的电绝缘覆盖材料16，并且通过热熔将其粘附到电绝缘基板上，并且导电覆盖层的截面形状为 椭圆通常与长轴平行于电绝缘基板的表面。
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公开(公告)号：US20130220994A1
公开(公告)日：2013-08-29
申请号：US13883940
申请日：2011-11-08
申请人： Masaki Hanada , Yukio Abe , Koji Yoshimoto , Takahito Ishii , Kazuyuki Kohara
发明人： Masaki Hanada , Yukio Abe , Koji Yoshimoto , Takahito Ishii , Kazuyuki Kohara
IPC分类号： H05B3/20
CPC分类号： H05B3/20 , H05B3/28 , H05B3/845 , H05B2203/011 , H05B2203/017 , Y10T156/1002
摘要： A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.
摘要翻译： 平面加热元件具有电绝缘基板，至少一对电极，其包括覆盖有导电覆盖层的薄金属线，并且被放置在电绝缘基板的表面上，聚合物电阻器被放置在电绝缘基板上 并且由电极供电，以及覆盖电极和聚合物电阻器的电绝缘覆盖材料16，并且通过热熔将其粘附到电绝缘基板上，并且导电覆盖层的截面形状为 椭圆通常与长轴平行于电绝缘基板的表面。
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公开(公告)号：US20100245633A1
公开(公告)日：2010-09-30
申请号：US12749749
申请日：2010-03-30
申请人： Masaki Hanada
发明人： Masaki Hanada
CPC分类号： H04N5/361 , H01L27/14818 , H01L27/14843
摘要： A solid-state image device has a pixel region in which a plurality of unit pixels 306 are two-dimensionally arranged in the horizontal and vertical directions, the unit pixel 306 being made up of a PD 304 and a VCCD 305, wherein a substrate potential setting pixel 307 is formed in the formation part of the PD 304 of at least one of the unit pixels 306 in a pixel region 301. The substrate potential setting pixel 307 and a substrate potential setting electrode 309 provided outside the pixel region 301 are connected to each other via a low-resistance connection electrode 308. Thus it is possible to suppress a potential difference between high-concentration P-type impurity regions in the pixel region, thereby obtaining a high-quality image with no shading while achieving uniformity over the image.
摘要翻译： 固态图像装置具有其中多个单位像素306在水平和垂直方向上二维排列的像素区域，单位像素306由PD 304和VCCD 305组成，其中衬底电位 设置像素307形成在像素区域301中的至少一个单位像素306的PD 304的形成部分中。衬底电位设置像素307和设置在像素区域301外部的衬底电位设置电极309连接到 彼此通过低电阻连接电极308相互隔开。因此，可以抑制像素区域中的高浓度P型杂质区域之间的电位差，从而获得没有阴影的高质量图像，同时实现图像上的均匀性 。
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公开(公告)号：US07144471B2
公开(公告)日：2006-12-05
申请号：US10068400
申请日：2002-02-06
CPC分类号： B29C66/472 , B29C43/36 , B29C65/1406 , B29C65/1409 , B29C65/1416 , B29C65/1425 , B29C65/1435 , B29C65/148 , B29C65/1496 , B29C65/4835 , B29C66/0242 , B29C66/1122 , B29C66/3474 , B29C66/348 , B29C66/71 , B29C66/7212 , B29C66/7394 , B29C66/8322 , B29C66/91212 , B29C66/91231 , B29C66/91411 , B29C66/91421 , B29C66/91645 , B29C66/961 , B29C2035/0822 , B29C2043/522 , B29K2995/0027 , H01L21/67115 , H01L21/67144 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/32225 , H01L2224/75251 , H01L2224/75252 , H01L2224/8319 , H01L2224/83855 , H01L2224/83868 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H05K1/0306 , H05K3/323 , H05K3/3494 , H01L2924/00 , B29K2309/08 , B29K2083/00 , H01L2224/0401
摘要： A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.
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