摘要:
A light emitting device is provided which has a reflector having a reflection surface made of porous alumina having an apparent density of 2.5 to 3.3 g/cm3, and an LED disposed on the reflection surface or near the reflection surface. There are provided: a light emitting device equipped with an LED chip and a reflector having a high reflectivity relative to near infrared to ultraviolet rays irradiated from an LED chip and fluorescent material; and the reflector.
摘要翻译:提供一种发光器件,其具有反射面,该反射体具有由表观密度为2.5〜3.3g / cm 3的多孔质氧化铝构成的反射面,以及配置在反射面或反射面附近的LED。 提供:配备有LED芯片和反射器的发光装置,其相对于从LED芯片和荧光材料照射的紫外线相对于近红外线具有高反射率; 和反射器。
摘要:
A light emitting device is provided which has a reflector having a reflection surface made of porous alumina having an apparent density of 2.5 to 3.3 g/cm3, and an LED disposed on the reflection surface or near the reflection surface. There are provided: a light emitting device equipped with an LED chip and a reflector having a high reflectivity relative to near infrared to ultraviolet rays irradiated from an LED chip and fluorescent material; and the reflector.
摘要翻译:提供了一种发光器件,其具有反射器,反射器具有由表面密度为2.5至3.3g / cm 3的多孔氧化铝制成的反射表面,以及设置在反射表面上或接近反射的LED 表面。 提供:配备有LED芯片和反射器的发光装置,其相对于从LED芯片和荧光材料照射的紫外线相对于近红外线具有高反射率; 和反射器。
摘要:
A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
摘要:
A light emitting device is provided, including a resin which can be manufactured according to a simple process and deliver a desired scattering property. The light emitting device is manufactured according to a step for mixing two or more types of immiscible liquid materials to obtain a composition containing at least two types of materials phase-separated in a sea-island structure, and a step for arranging the composition in proximity to an LED chip, curing the composition with the sea-island structure being maintained, thereby forming an encapsulation resin. Accordingly, it is possible to form an island region which serves as a scattering center, according to a simple step of mixing materials.
摘要:
A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.
摘要:
A light emitting device is provided, including a resin which can be manufactured according to a simple process and deliver a desired scattering property. The light emitting device is manufactured according to a step for mixing two or more types of immiscible liquid materials to obtain a composition containing at least two types of materials phase-separated in a sea-island structure, and a step for arranging the composition in proximity to an LED chip, curing the composition with the sea-island structure being maintained, thereby forming an encapsulation resin. Accordingly, it is possible to form an island region which serves as a scattering center, according to a simple step of mixing materials.