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公开(公告)号:US5902655A
公开(公告)日:1999-05-11
申请号:US754945
申请日:1996-11-25
申请人: Masami Matsuoka , Hikaru Aoyagi , Kazuaki Naito , Katsunori Saito
发明人: Masami Matsuoka , Hikaru Aoyagi , Kazuaki Naito , Katsunori Saito
CPC分类号: B32B27/32 , B32B7/12 , Y10T428/1334 , Y10T428/1352 , Y10T428/2495
摘要: There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.1% by weight of (3) and/or (4) and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having specified, physical properties said resin composition having a proportion of the unsaturated carboxylic acid and the like grafted of 0.001 to 50% by weight, the difference in acoustic impedance between the main material layer and adhesive material layer being at least 8.5.times.10.sup.-3 g/cm.sup.2 .multidot..mu.sec. This multi-layer laminate molding is excellent in barrier properties, and non-destructive detection of the adhesive material layer can be carried out easily by the supersonic wave reflection method.
摘要翻译: 公开了一种多层层压成形体,其具有主要由外侧的聚乙烯树脂构成的主要材料层和内侧的乙烯 - 乙酸乙烯酯共聚物皂化产物层或聚酰胺树脂层的层结构,层叠 粘合剂材料层至少包含一种树脂组合物,该树脂组合物含有(A)60至95重量%的至少一种选自(1)具有特定物理性质的高密度聚乙烯树脂的树脂( 2)具有特定物理性能的线性低密度聚乙烯树脂,(3)通过将不饱和羧酸等接枝到上述(1)上获得的改性高密度聚乙烯树脂,和(4)获得的改性线型低密度聚乙烯树脂 通过将不饱和羧酸等接枝到上述(2)上,并含有至少0.1重量%的(3)和/或(4)和(B)40至5重量%的lin 耳朵超低密度聚乙烯树脂具有规定的物理性质,所述树脂组合物的不饱和羧酸等的比例接枝为0.001〜50重量%,主材料层和粘合材料层之间的声阻抗差为 至少8.5x10-3 g / cm2x mu sec。 这种多层层叠成型体的阻隔性优异,可以通过超声波反射法容易地进行粘合材料层的无损检测。
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公开(公告)号:US5643997A
公开(公告)日:1997-07-01
申请号:US474958
申请日:1995-06-07
申请人: Masami Matsuoka , Hikaru Aoyagi
发明人: Masami Matsuoka , Hikaru Aoyagi
CPC分类号: C08L23/0815 , C08L23/06 , C08L51/06 , C08L2205/02 , C08L2205/03 , C08L2205/035
摘要: A polyethylenic resin composition comprising: at least one high density polyethylenic resin selected from (a) a high density polyethylenic resin (Resin A) and (b) a modified high density polyethylenic resin as derived by grafting on the Resin A a monomer of unsaturated carboxylic acid or its derivative (Resin B), at least one linear low density polyethylenic resin selected from (c) a linear low density polyethylenic resin (Resin C) and (d) a modified linear low density polyethylenic resin as derived by grafting on the Resin C the monomer as described in (b) above (Resin D), and (e) a linear very low density polyethylenic resin (Resin E) having a density (g/cm.sup.3) of at least 0.890, but less than 0.910, and a melting point of 110.degree. to 125.degree. C. This polyethylenic resin composition is excellent in fuel oil resistance, low temperature impact resistance, and heat resistance, and provides a material having affinity or adhesive properties to various resinous and metallic materials.
摘要翻译: 1.一种聚乙烯系树脂组合物,其含有:(a)高密度聚乙烯系树脂(树脂A)和(b)通过在树脂A上接枝不饱和羧酸的单体而得到的改性高密度聚乙烯树脂的至少一种高密度聚乙烯树脂 酸或其衍生物(树脂B),至少一种线性低密度聚乙烯树脂,其选自(c)线性低密度聚乙烯树脂(树脂C)和(d)通过在树脂上接枝而衍生的改性线型低密度聚乙烯树脂 C(b)中所述的单体(树脂D)和(e)密度(g / cm 3)为至少0.890但小于0.910的线性极低密度聚乙烯树脂(树脂E)和 熔点为110℃〜125℃。该聚乙烯系树脂组合物的耐燃油性,耐低温冲击性和耐热性优异,并且提供了对各种树脂和金属材料具有亲和性或粘合性的材料。
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公开(公告)号:US6063640A
公开(公告)日:2000-05-16
申请号:US30349
申请日:1998-02-25
申请人: Masataka Mizukoshi , Hidehiko Akasaki , Masao Nakano , Yasuhiro Fujii , Shinnosuke Kamata , Makoto Yanagisawa , Yasurou Matsuzaki , Toyonobu Yamada , Masami Matsuoka , Hiroyoshi Tomita
发明人: Masataka Mizukoshi , Hidehiko Akasaki , Masao Nakano , Yasuhiro Fujii , Shinnosuke Kamata , Makoto Yanagisawa , Yasurou Matsuzaki , Toyonobu Yamada , Masami Matsuoka , Hiroyoshi Tomita
CPC分类号: H01L22/32 , H01L22/22 , H01L2224/05554 , Y10S438/977
摘要: A semiconductor wafer testing method includes a pre-test step for forming a temporary test film on a surface of a semiconductor wafer, a test step for testing the semiconductor wafer by applying a probe to the temporary test film and a post-test step for exfoliating the temporary test film from the surface of the semiconductor wafer. The temporary test film includes test electrode groups each provided with a plurality of regularly arranged test electrodes, and wiring patterns for electrically connecting the test electrodes with corresponding ones of semiconductor unit electrodes in respective semiconductor units on the semiconductor wafer. Probe pins of said probe are arranged so as to be aligned with corresponding ones of the test electrodes of the respective test electrode groups.
摘要翻译: 半导体晶片测试方法包括:在半导体晶片的表面上形成临时测试膜的预测试步骤,通过向临时测试膜施加探针来测试半导体晶片的测试步骤和用于去角质的后测试步骤 来自半导体晶片表面的临时测试膜。 临时测试膜包括各自设置有多个规则排列的测试电极的测试电极组和用于将测试电极与半导体晶片上的各个半导体单元中的相应半导体单元电极电连接的布线图案。 所述探针的探头针布置成与各个测试电极组的相应测试电极对齐。
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公开(公告)号:US4929479A
公开(公告)日:1990-05-29
申请号:US198252
申请日:1988-05-24
CPC分类号: B32B27/32 , A61J1/10 , Y10T428/1334 , Y10T428/24967 , Y10T428/31913 , Y10T428/3192 , Y10T428/31928
摘要: A medical bag composed of a laminate comprising (i) an inner low-density polyethylene layer, (ii) an intermediate layer of ethylene-vinyl acetate copolymer, ethylene-propylene type elastomer, or ethylene-butene-1 type elasomer, and (iii) an outer low-density polyethylene layer. This bag has excellent sanitariness, flexibility, transparency, and heat-resistance, therefore, is suitable for use as a container of blood and various medicinal liquids.
摘要翻译: 包含(i)内部低密度聚乙烯层,(ii)乙烯 - 乙酸乙烯酯共聚物的中间层,乙烯 - 丙烯类弹性体或乙烯 - 丁烯-1型弹性体的层压体的医疗袋和(iii) )外部低密度聚乙烯层。 该袋具有优异的清洁度,柔软性,透明性和耐热性,因此适用于血液和各种药用液体的容器。
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