摘要:
A semiconductor integrated circuit device includes a reference voltage generating circuit outputting a reference voltage from a step-up voltage, a step-up circuit stepping up the reference voltage within a range lower than an external power supply voltage and thus outputting the above step-up voltage, a step-down circuit stepping down the external power supply voltage and thus outputting a step-down voltage equal to the reference voltage, and an internal circuit receiving, as a power supply voltage thereof, the step-down voltage.
摘要:
A press forming device for forming a plurality of inwardly directed projections on a circumferential wall of a tubular article to be formed. The press forming device includes a lower die holder adapted to be mounted on a lower base of a press machine, and a die fixed on the lower die holder. The die has a plurality of inside forming parts on a circumferential surface of the die, each for forming one of the projections, respectively. The press forming device further includes a plurality of punches mounted on the lower die holder around an outer circumference of the die, each being arranged to be capable of being moved towards or away from the die, and each having an outside forming part in a position facing one of the inside forming parts for forming one of the projections, respectively. The press forming device also includes an upper die holder adapted to be mounted on an upper raising and lowering base of the press machine and a plurality of pressing members of wedge shape mounted on the upper die holder. Each of the pressing members is mounted at a position above one of the punches for moving one of the punches in a direction towards the die with lowering the raising and lowering base, to thereby press the tubular article between one of the inside forming parts of the die and one of the outside forming parts of the punches, respectively.
摘要:
A semiconductor memory device has an oscillator unit for generating refresh pulses, a refresh address detection unit for detecting refreshed addresses and outputting a predetermined signal upon the completion of the refreshing of all addresses, and an output control unit for continuing a self-refresh mode to refresh all addresses according to the signal from the refresh address detection unit, before releasing the self-refresh mode in response to an external signal. Therefore, the refresh operation is continued until all cells are refreshed, thereby data stored in the semiconductor memory device is not lost and is correctly refreshed.
摘要:
A semiconductor wafer testing method includes a pre-test step for forming a temporary test film on a surface of a semiconductor wafer, a test step for testing the semiconductor wafer by applying a probe to the temporary test film and a post-test step for exfoliating the temporary test film from the surface of the semiconductor wafer. The temporary test film includes test electrode groups each provided with a plurality of regularly arranged test electrodes, and wiring patterns for electrically connecting the test electrodes with corresponding ones of semiconductor unit electrodes in respective semiconductor units on the semiconductor wafer. Probe pins of said probe are arranged so as to be aligned with corresponding ones of the test electrodes of the respective test electrode groups.
摘要:
A stator for a dynamoelectric machine includes an annular stator core composed of a developed core formed by stacking a number of steel sheets, each steel sheet including a plurality of unit cores each of which includes a unit yoke and a magnetic pole tooth and which are sequentially connected together by connecting portions integral with the respective unit yokes, and a stator coil wound on the magnetic pole teeth. Each unit yoke has a circumferential end overlapping, in a direction of stacking of the steel sheets, a circumferential end of the unit yoke adjacent to said each unit yoke.
摘要:
A laminated core for dynamoelectric machines and so on is formed of thin sheet core pieces each blanked into a predetermined configuration and stacked one upon another and are successively welded at a plurality of weld zones of an edge of each core piece by continuous or spot irradiation of laser beams so that the core pieces are combined together. The core piece constituting one of two end faces of the core has first notches formed in one half of the weld zones of the core piece. The core piece constituting the other end face of the core has second notches formed in one half of the weld zones of the core piece constituting the other end face of the core. The first notches are shifted from the second notches by 90 degrees.
摘要:
This invention relates to a memory device internally employing an active period control signal for controlling an active period and an inactive period for internal operation. The memory device comprises a plurality of word lines and bit lines; memory cells provided at intersections thereof; a booster circuit, having an output terminal, for outputting to the output terminal a higher voltage than a power source voltage; and word drivers, connected to each of the word lines, for connecting the output terminal of the booster circuit to a corresponding word line in response to a word selection signals provided during the active period. The memory device also comprises a boosting control signal generation circuit supplying the booster circuit with a boosting control signal to continue a boosting operation of the booster circuit longer than the active period in response to the active period control signal. The output of the booster circuit can recover appropriate voltage level after the termination of the active period so that the error read operation can be avoided.
摘要:
In a voltage drop power supply circuit for a semiconductor integrated circuit device, a first unit generates a constant internal power supply voltage from an external power supply voltage in accordance with a first characteristic line defining a relationship between the external power supply voltage and the internal power supply voltage, and applies the constant internal power supply voltage to internal circuits of the semiconductor integrated circuit device. A second unit generates a burn-in voltage from the external power supply voltage having a level higher than that used in the normal operation in accordance with a second characteristic line defining a relationship between the external power supply voltage and the internal power supply line, and applies the burn-in voltage to the internal circuits when a burn-in test is carried out for the semiconductor integrated circuit device. The second characteristic line crosses the first characteristic line at an intermediate point between lower and upper limit voltages defined by the first characteristic line. The burn-in voltage is greater than the internal power supply voltage used in the normal operation.