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公开(公告)号：US07171858B1
公开(公告)日：2007-02-06
申请号：US11319668
申请日：2005-12-29
申请人： Masao Kanatani , Masaaki Taruya , Hiroshi Nakamura
发明人： Masao Kanatani , Masaaki Taruya , Hiroshi Nakamura
IPC分类号： G01L9/00
CPC分类号： G01L9/06
摘要： A semiconductor pressure sensor is intended to achieve reduction in size and cost by decreasing the number of terminals and the number of pads. In the semiconductor pressure sensor, in a first mode in which correction data is input to a memory, a voltage input change-over switch and an input/output change-over switch are operated by an input signal from a switch change-over terminal in such a manner that a voltage input terminal and an input/output terminal are connected to a digital circuit, whereas in a second mode in which an electric signal corrected and amplified is output, the voltage input change-over switch is connected to a semiconductor sensor chip by means of an input signal from the switch change-over terminal, and the input/output terminal is connected to a correction and amplification circuit.
摘要翻译： 半导体压力传感器旨在通过减少端子的数量和焊盘的数量来实现尺寸和成本的降低。 在半导体压力传感器中，在校正数据被输入到存储器的第一模式中，电压输入转换开关和输入/输出转换开关由来自开关转换端子的输入信号 电压输入端子和输入/输出端子连接到数字电路的方式，而在其中输出经过校正和放大的电信号的第二模式中，电压输入转换开关连接到半导体传感器 通过来自开关转换端子的输入信号芯片，并且输入/输出端子连接到校正和放大电路。
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公开(公告)号：US20070193359A1
公开(公告)日：2007-08-23
申请号：US11507461
申请日：2006-08-22
申请人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
发明人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/0627 , G01L19/0654 , G01L19/141 , G01L19/143 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。
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公开(公告)号：US06668238B2
公开(公告)日：2003-12-23
申请号：US09985833
申请日：2001-11-06
IPC分类号： G01L1700
CPC分类号： G01L19/148 , G01L9/06
摘要： A pressure sensor is provided which is tolerant to noise such as electromagnetic waves, is configured so as to be capable of easily selecting a system environment in which a sensor signal, commonly used for various kinds of systems, can be freely read in at timing as required by a system, and is able to realize reduction in size and cost suitable for automotive use. An element portion for detecting pressure and a circuit portion having a signal processing function are integrally accommodated in the same package. An interface section 24 optimized to interface with external wiring, an A/D conversion section 25 for digitally encoding an analog processed detection signal of the sensor, and a digital processing section 26 for converting the digitized signal into a desired serial signal are added to the circuit portion 2. The entire circuit portion is constituted by at most two ICs alone, and a selection can be made between two output forms including an analog processed detection signal and a digital processed detection signal.
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公开(公告)号：US07391101B2
公开(公告)日：2008-06-24
申请号：US11287388
申请日：2005-11-28
IPC分类号： H01L23/495 , H01L21/00 , H01R9/00
CPC分类号： H01L23/057 , G01L19/0084 , G01L19/141 , G01L19/147 , H01L23/24 , H01L24/45 , H01L24/48 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).
摘要翻译： 半导体压力传感器即使在温度和压力急剧变化的环境下也能减少接合线的损伤，从而延长寿命。 半导体压力传感器包括由树脂制成并具有凹部（1a）的封装（1），通过插入成型与封装（1）一体形成的引线（2），其一端暴露于凹部 （1a）并且其另一端从所述封装（1）延伸到外部;传感器芯片（3），布置在所述凹部（1a）中用于检测压力;以及接合线（4），其将所述传感器芯片 （3）和引线（2）。 引线（2）和封装（1）之间在凹部（1a）侧的界面被电绝缘性的第一保护树脂部分（6）覆盖，并且接合线（4）被覆盖 具有比第一保护树脂部分（6）软的第二保护树脂部分（7）。
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公开(公告)号：US20070029657A1
公开(公告)日：2007-02-08
申请号：US11287388
申请日：2005-11-28
IPC分类号： H01L23/02
CPC分类号： H01L23/057 , G01L19/0084 , G01L19/141 , G01L19/147 , H01L23/24 , H01L24/45 , H01L24/48 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).
摘要翻译： 半导体压力传感器即使在温度和压力急剧变化的环境下也能减少接合线的损伤，从而延长寿命。 半导体压力传感器包括由树脂制成并具有凹部（1a）的封装（1），通过插入成型与封装（1）一体形成的引线（2），其一端暴露于凹部 （1a）并且其另一端从所述封装（1）延伸到外部;传感器芯片（3），布置在所述凹部（1a）中用于检测压力;以及接合线（4），其将所述传感器芯片 （3）和引线（2）。 引线（2）和封装（1）之间在凹部（1a）侧的界面被电绝缘性的第一保护树脂部分（6）覆盖，并且接合线（4）被覆盖 具有比第一保护树脂部分（6）软的第二保护树脂部分（7）。
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6.发明授权Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor 有权半导体压力传感器及其制造方法以及用于模制半导体压力传感器的模具公开(公告)号：US07603908B2
公开(公告)日：2009-10-20
申请号：US12046006
申请日：2008-03-11
申请人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
发明人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/0627 , G01L19/0654 , G01L19/141 , G01L19/143 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的所述暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。
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7.发明申请Semiconductor pressure sensor and die for molding the semiconductor pressure sensor 有权用于模制半导体压力传感器的半导体压力传感器和模具公开(公告)号：US20080178681A1
公开(公告)日：2008-07-31
申请号：US12046006
申请日：2008-03-11
申请人： Shinsuke ASADA , Hiroshi Nakamura , Masaaki Taruya
发明人： Shinsuke ASADA , Hiroshi Nakamura , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/0627 , G01L19/0654 , G01L19/141 , G01L19/143 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。
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8.发明授权Semiconductor pressure sensor and die for molding a semiconductor pressure sensor 有权用于模制半导体压力传感器的半导体压力传感器和模具公开(公告)号：US07412895B2
公开(公告)日：2008-08-19
申请号：US11507461
申请日：2006-09-22
申请人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
发明人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/0627 , G01L19/0654 , G01L19/141 , G01L19/143 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。
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公开(公告)号：US20070017294A1
公开(公告)日：2007-01-25
申请号：US11287281
申请日：2005-11-28
申请人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
发明人： Shinsuke Asada , Hiroshi Nakamura , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , G01L19/0627 , G01L19/143 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor pressure sensor can simplify conveyance equipment on a production line, improve production operation efficiency to a substantial extent, and reduce the production cost. The semiconductor pressure sensor includes a semiconductor sensor chip for detecting pressure, a processing circuit for correcting and amplifying an electric signal from the semiconductor sensor chip, a sub package having a terminal electrically connected to the semiconductor sensor chip and the processing circuit through bonding wires, and a housing integrally formed with the sub package at an outer side thereof by insert molding. The sub package is formed with a mounting surface on which the semiconductor sensor chip and the processing circuit are mounted.
摘要翻译： 半导体压力传感器可以简化生产线上的输送设备，大大提高生产运行效率，降低生产成本。 半导体压力传感器包括用于检测压力的半导体传感器芯片，用于校正和放大来自半导体传感器芯片的电信号的处理电路，具有通过接合线电连接到半导体传感器芯片的端子和处理电路的子封装， 以及通过嵌件成型在其外侧与子封装体一体形成的壳体。 子封装形成有安装表面，半导体传感器芯片和处理电路安装在该安装表面上。
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公开(公告)号：US09168865B2
公开(公告)日：2015-10-27
申请号：US13561405
申请日：2012-07-30
申请人： Hiroshi Nakamura
发明人： Hiroshi Nakamura
摘要： An organic EL lighting device for a vehicle is provided, which includes an organic EL lighting portion provided in a matrix form on a ceiling of the vehicle, an organic EL touch portion provided on the organic EL lighting portion, an organic EL detection portion for detecting a position in which the organic EL touch portion is touched, an organic EL determination portion for determining a lighting area of the organic EL lighting portion based on the position detected by the organic EL detection portion, and an organic EL driving portion for lighting the lighting area of the organic EL lighting portion determined by the organic EL determination portion.
摘要翻译： 本发明提供一种车辆用有机EL照明装置，其特征在于，包括在车辆的天花板上以矩阵状设置的有机EL照明部，设置在有机EL照明部上的有机EL接触部， 有机EL触摸部分被触摸的位置，用于基于由有机EL检测部分检测到的位置来确定有机EL照明部分的照明区域的有机EL确定部分和用于点亮照明的有机EL驱动部分 由有机EL确定部分确定的有机EL照明部分的面积。
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