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    Semiconductor pressure sensor
    1.
    发明授权
    Semiconductor pressure sensor 有权
    半导体压力传感器

    公开(公告)号：US07391101B2

    公开(公告)日：2008-06-24

    申请号：US11287388

    申请日：2005-11-28

    申请人： Yoshimitsu Takahata ,  Hiroshi Nakamura ,  Masaaki Taruya ,  Shinsuke Asada

    发明人： Yoshimitsu Takahata ,  Hiroshi Nakamura ,  Masaaki Taruya ,  Shinsuke Asada

    IPC分类号： H01L23/495 ,  H01L21/00 ,  H01R9/00

    CPC分类号： H01L23/057 ,  G01L19/0084 ,  G01L19/141 ,  G01L19/147 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).

    摘要翻译： 半导体压力传感器即使在温度和压力急剧变化的环境下也能减少接合线的损伤，从而延长寿命。 半导体压力传感器包括由树脂制成并具有凹部（1a）的封装（1），通过插入成型与封装（1）一体形成的引线（2），其一端暴露于凹部 （1a）并且其另一端从所述封装（1）延伸到外部;传感器芯片（3），布置在所述凹部（1a）中用于检测压力;以及接合线（4），其将所述传感器芯片 （3）和引线（2）。 引线（2）和封装（1）之间在凹部（1a）侧的界面被电绝缘性的第一保护树脂部分（6）覆盖，并且接合线（4）被覆盖 具有比第一保护树脂部分（6）软的第二保护树脂部分（7）。

    Semiconductor pressure sensor
    2.
    发明申请
    Semiconductor pressure sensor 有权
    半导体压力传感器

    公开(公告)号：US20070029657A1

    公开(公告)日：2007-02-08

    申请号：US11287388

    申请日：2005-11-28

    申请人： Yoshimitsu Takahata ,  Hiroshi Nakamura ,  Masaaki Taruya ,  Shinsuke Asada

    发明人： Yoshimitsu Takahata ,  Hiroshi Nakamura ,  Masaaki Taruya ,  Shinsuke Asada

    IPC分类号： H01L23/02

    CPC分类号： H01L23/057 ,  G01L19/0084 ,  G01L19/141 ,  G01L19/147 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).

    摘要翻译： 半导体压力传感器即使在温度和压力急剧变化的环境下也能减少接合线的损伤，从而延长寿命。 半导体压力传感器包括由树脂制成并具有凹部（1a）的封装（1），通过插入成型与封装（1）一体形成的引线（2），其一端暴露于凹部 （1a）并且其另一端从所述封装（1）延伸到外部;传感器芯片（3），布置在所述凹部（1a）中用于检测压力;以及接合线（4），其将所述传感器芯片 （3）和引线（2）。 引线（2）和封装（1）之间在凹部（1a）侧的界面被电绝缘性的第一保护树脂部分（6）覆盖，并且接合线（4）被覆盖 具有比第一保护树脂部分（6）软的第二保护树脂部分（7）。

    Semiconductor pressure sensor and die for molding the one
    3.
    发明申请
    Semiconductor pressure sensor and die for molding the one 有权
    半导体压力传感器和模具用于成型

    公开(公告)号：US20070193359A1

    公开(公告)日：2007-08-23

    申请号：US11507461

    申请日：2006-08-22

    申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    IPC分类号： G01L9/00 ,  G01L7/00 ,  G01L9/16

    CPC分类号： G01L19/0084 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

    摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

    Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor
    4.
    发明授权
    Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor 有权
    半导体压力传感器及其制造方法以及用于模制半导体压力传感器的模具

    公开(公告)号：US07603908B2

    公开(公告)日：2009-10-20

    申请号：US12046006

    申请日：2008-03-11

    申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    IPC分类号： G01L9/00

    CPC分类号： G01L19/0084 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

    摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的所述暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

    Semiconductor pressure sensor and die for molding the semiconductor pressure sensor
    5.
    发明申请
    Semiconductor pressure sensor and die for molding the semiconductor pressure sensor 有权
    用于模制半导体压力传感器的半导体压力传感器和模具

    公开(公告)号：US20080178681A1

    公开(公告)日：2008-07-31

    申请号：US12046006

    申请日：2008-03-11

    申请人： Shinsuke ASADA ,  Hiroshi Nakamura ,  Masaaki Taruya

    发明人： Shinsuke ASADA ,  Hiroshi Nakamura ,  Masaaki Taruya

    IPC分类号： G01L9/00

    CPC分类号： G01L19/0084 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

    摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

    Semiconductor pressure sensor and die for molding a semiconductor pressure sensor
    6.
    发明授权
    Semiconductor pressure sensor and die for molding a semiconductor pressure sensor 有权
    用于模制半导体压力传感器的半导体压力传感器和模具

    公开(公告)号：US07412895B2

    公开(公告)日：2008-08-19

    申请号：US11507461

    申请日：2006-09-22

    申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    IPC分类号： G01L9/00

    CPC分类号： G01L19/0084 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

    摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

    Semiconductor pressure sensor
    7.
    发明申请
    Semiconductor pressure sensor 审中-公开
    半导体压力传感器

    公开(公告)号：US20070017294A1

    公开(公告)日：2007-01-25

    申请号：US11287281

    申请日：2005-11-28

    申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

    IPC分类号： G01L9/00

    CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/0627 ,  G01L19/143 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor pressure sensor can simplify conveyance equipment on a production line, improve production operation efficiency to a substantial extent, and reduce the production cost. The semiconductor pressure sensor includes a semiconductor sensor chip for detecting pressure, a processing circuit for correcting and amplifying an electric signal from the semiconductor sensor chip, a sub package having a terminal electrically connected to the semiconductor sensor chip and the processing circuit through bonding wires, and a housing integrally formed with the sub package at an outer side thereof by insert molding. The sub package is formed with a mounting surface on which the semiconductor sensor chip and the processing circuit are mounted.

    摘要翻译： 半导体压力传感器可以简化生产线上的输送设备，大大提高生产运行效率，降低生产成本。 半导体压力传感器包括用于检测压力的半​​导体传感器芯片，用于校正和放大来自半导体传感器芯片的电信号的处理电路，具有通过接合线电连接到半导体传感器芯片的端子和处理电路的子封装， 以及通过嵌件成型在其外侧与子封装体一体形成的壳体。 子封装形成有安装表面，半导体传感器芯片和处理电路安装在该安装表面上。