Magnetoresistive memory device and manufacturing method of the same
    2.
    发明授权
    Magnetoresistive memory device and manufacturing method of the same 有权
    磁阻存储器件及其制造方法相同

    公开(公告)号:US09590174B2

    公开(公告)日:2017-03-07

    申请号:US14629120

    申请日:2015-02-23

    摘要: According to one embodiment, a manufacturing method of a magnetoresistive memory device includes forming a first magnetic layer on a substrate, forming a magnetoresistive effect element on the first magnetic layer, forming a mask on a part of the magnetoresistive effect element, selectively etching the magnetoresistive effect element using the mask, forming a sidewall insulating film on a sidewall of the magnetoresistive effect element exposed by the etching, selectively etching the first magnetic layer using the mask and the sidewall insulating film and forming a deposition layer containing a magnetic material on a sidewall of the first magnetic layer and the sidewall insulating film, and introducing ions into the deposition layer.

    摘要翻译: 根据一个实施例,磁阻存储器件的制造方法包括在衬底上形成第一磁性层,在第一磁性层上形成磁阻效应元件,在磁阻效应元件的一部分上形成掩模,选择性地蚀刻磁阻 使用该掩模,在通过蚀刻暴露的磁阻效应元件的侧壁上形成侧壁绝缘膜,使用掩模和侧壁绝缘膜选择性地蚀刻第一磁性层,并在侧壁上形成含有磁性材料的沉积层 的第一磁性层和侧壁绝缘膜,并将离子引入沉积层。

    Magnetoresistive element and method of manufacturing the same
    3.
    发明授权
    Magnetoresistive element and method of manufacturing the same 有权
    磁阻元件及其制造方法

    公开(公告)号:US09231196B2

    公开(公告)日:2016-01-05

    申请号:US14200670

    申请日:2014-03-07

    IPC分类号: H01L43/02 H01L43/12 H01L43/08

    CPC分类号: H01L43/12 H01L43/08

    摘要: According to one embodiment, a magnetoresistive element is disclosed. The element includes a lower electrode, a stacked body provided on the lower electrode and including a first magnetic layer, a tunnel barrier layer and a second magnetic layer. The first magnetic layer is under the tunnel barrier layer, the second magnetic layer is on the tunnel barrier layer. The first magnetic layer includes a first region and a second region outside the first region to surround the first region. The second region includes an element in the first region and other element being different from the element.

    摘要翻译: 根据一个实施例,公开了一种磁阻元件。 元件包括下电极,设置在下电极上并包括第一磁性层,隧道势垒层和第二磁性层的层叠体。 第一磁性层位于隧道势垒层下方,第二磁性层位于隧道势垒层上。 第一磁性层包括第一区域和第一区域之外的第二区域以围绕第一区域。 所述第二区域包括所述第一区域中的元件,并且所述元件与所述元件不同。

    Semiconductor memory device and manufacturing method thereof
    4.
    发明授权
    Semiconductor memory device and manufacturing method thereof 有权
    半导体存储器件及其制造方法

    公开(公告)号:US09171886B2

    公开(公告)日:2015-10-27

    申请号:US13032359

    申请日:2011-02-22

    摘要: A semiconductor memory device according to embodiments includes a semiconductor substrate and plural switching transistors provided on the semiconductor substrate. In the semiconductor memory device, a contact plug is embedded between adjacent two of the switching transistors, and is insulated from gates of the adjacent two switching transistors. The contact plug is also electrically connected to a source or a drain of each of the adjacent two switching transistors, and an upper surface of the contact plug is at a position higher than an upper surface of the switching transistors. A memory element is provided on the upper surface of the contact plug and stores data. A wiring is provided on the memory element.

    摘要翻译: 根据实施例的半导体存储器件包括半导体衬底和设置在半导体衬底上的多个开关晶体管。 在半导体存储器件中,接触插头嵌入相邻的两个开关晶体管之间,并且与相邻的两个开关晶体管的栅极绝缘。 接触插塞也电连接到相邻的两个开关晶体管中的每一个的源极或漏极,并且接触插塞的上表面位于高于开关晶体管的上表面的位置。 存储元件设置在接触插头的上表面上并存储数据。 在存储元件上提供布线。

    Magnetoresistive element and method of manufacturing the same
    5.
    发明授权
    Magnetoresistive element and method of manufacturing the same 有权
    磁阻元件及其制造方法

    公开(公告)号:US08081505B2

    公开(公告)日:2011-12-20

    申请号:US12556389

    申请日:2009-09-09

    IPC分类号: H01L29/82

    摘要: A magnetoresistive element includes a stacked structure including a fixed layer having a fixed direction of magnetization, a recording layer having a variable direction of magnetization, and a nonmagnetic layer sandwiched between the fixed layer and the recording layer, a first protective film covering a circumferential surface of the stacked structure, and made of silicon nitride, and a second protective film covering a circumferential surface of the first protective film, and made of silicon nitride. A hydrogen content in the first protective film is not more than 4 at %, and a hydrogen content in the second protective film is not less than 6 at %.

    摘要翻译: 磁阻元件包括堆叠结构,其包括具有固定磁化方向的固定层,具有可变磁化方向的记录层和夹在固定层和记录层之间的非磁性层,覆盖周向表面的第一保护膜 层叠结构,由氮化硅制成,第二保护膜覆盖第一保护膜的周面,由氮化硅构成。 第一保护膜中的氢含量不大于4原子%,第二保护膜中的氢含量不低于6原子%。

    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体存储器件及其制造方法

    公开(公告)号:US20110266600A1

    公开(公告)日:2011-11-03

    申请号:US13032359

    申请日:2011-02-22

    IPC分类号: H01L29/82 H01L21/8246

    摘要: A semiconductor memory device according to embodiments includes a semiconductor substrate and plural switching transistors provided on the semiconductor substrate. In the semiconductor memory device, a contact plug is embedded between adjacent two of the switching transistors, and is insulated from gates of the adjacent two switching transistors. The contact plug is also electrically connected to a source or a drain of each of the adjacent two switching transistors, and an upper surface of the contact plug is at a position higher than an upper surface of the switching transistors. A memory element is provided on the upper surface of the contact plug and stores data. A wiring is provided on the memory element.

    摘要翻译: 根据实施例的半导体存储器件包括半导体衬底和设置在半导体衬底上的多个开关晶体管。 在半导体存储器件中,接触插头嵌入相邻的两个开关晶体管之间,并且与相邻的两个开关晶体管的栅极绝缘。 接触插塞也电连接到相邻的两个开关晶体管中的每一个的源极或漏极,并且接触插塞的上表面位于高于开关晶体管的上表面的位置。 存储元件设置在接触插头的上表面上并存储数据。 在存储元件上设置接线。

    Magnetoresistive memory and manufacturing method
    7.
    发明授权
    Magnetoresistive memory and manufacturing method 有权
    磁阻记忆及制造方法

    公开(公告)号:US08829580B2

    公开(公告)日:2014-09-09

    申请号:US12854724

    申请日:2010-08-11

    IPC分类号: H01L29/82

    摘要: According to one embodiment, a magnetoresistive memory includes first and second contact plugs in a first interlayer insulating film, a lower electrode on the first interlayer insulating film, a magnetoresistive effect element on the lower electrode, and an upper electrode on the magnetoresistive effect element. The lower electrode has a tapered cross-sectional shape in which a dimension of a bottom surface of the lower electrode is longer than a dimension of an upper surface of the lower electrode, one end of the lower electrode is in contact with an upper surface of the first contact plug. The magnetoresistive effect element is provided at a position shifted from a position immediately above the first contact plug in a direction parallel to a surface of the semiconductor substrate.

    摘要翻译: 根据一个实施例,磁阻存储器包括第一层间绝缘膜中的第一和第二接触插塞,第一层间绝缘膜上的下电极,下电极上的磁阻效应元件和磁阻效应元件上的上电极。 下电极具有锥形横截面形状,其中下电极的底表面的尺寸比下电极的上表面的尺寸长,下电极的一端与上电极的上表面接触 第一个接触插头。 磁阻效应元件设置在与第一接触插塞正上方的位置在平行于半导体衬底的表面的方向上偏移的位置处。

    Method of manufacturing a magnetic random access memory, method of manufacturing an embedded memory, and template
    8.
    发明授权
    Method of manufacturing a magnetic random access memory, method of manufacturing an embedded memory, and template 有权
    磁性随机存取存储器的制造方法,嵌入式存储器的制造方法和模板

    公开(公告)号:US08058080B2

    公开(公告)日:2011-11-15

    申请号:US12699721

    申请日:2010-02-03

    IPC分类号: H01L21/00 H01L21/20 H01L21/36

    摘要: A magnetic material of a magnetoresistive element is formed on a lower electrode. An upper electrode is formed on the magnetic material. A resist for nano-imprint lithography is formed on the upper electrode. A first pattern or a second pattern is formed in the resist by setting a first template or a second template into contact with the resist and curing the resist. The first template has the first pattern that corresponds to the magnetoresistive element and the lower electrode. The second template has the second pattern that corresponds to the magnetoresistive element and the upper electrode. The magnetic material and the lower electrode are patterned at the same time by using the resist having the first pattern, or the magnetic material and the upper electrode are patterned at the same time by using the resist having the second pattern.

    摘要翻译: 磁阻元件的磁性材料形成在下电极上。 在磁性材料上形成上部电极。 在上电极上形成用于纳米压印光刻的抗蚀剂。 通过将第一模板或第二模板与抗蚀剂接触并固化抗蚀剂,在抗蚀剂中形成第一图案或第二图案。 第一模板具有对应于磁阻元件和下电极的第一图案。 第二模板具有对应于磁阻元件和上电极的第二图案。 通过使用具有第一图案的抗蚀剂,同时对磁性材料和下部电极进行图案化,或者通过使用具有第二图案的抗蚀剂同时对磁性材料和上部电极进行图案化。

    Magnetic random access memory
    9.
    发明授权
    Magnetic random access memory 有权
    磁性随机存取存储器

    公开(公告)号:US09276195B2

    公开(公告)日:2016-03-01

    申请号:US13965149

    申请日:2013-08-12

    摘要: According to one embodiment, a magnetic random access memory includes a magnetoresistive element, a contact arranged under the magnetoresistive element and connected to the magnetoresistive element, and an insulating film continuously formed from a periphery of the contact to a side surface of the magnetoresistive element and including a protective portion covering the side surface of the magnetoresistive element.

    摘要翻译: 根据一个实施例,磁性随机存取存储器包括磁阻元件,布置在磁阻元件下方并连接到磁阻元件的触点,以及从触点的周边连续形成到磁阻元件的侧表面的绝缘膜,以及 包括覆盖磁阻元件的侧表面的保护部分。

    Semiconductor memory device
    10.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US08542519B2

    公开(公告)日:2013-09-24

    申请号:US13035168

    申请日:2011-02-25

    IPC分类号: G11C11/02

    CPC分类号: H01L29/82

    摘要: According to one embodiment, a semiconductor memory device is disclosed. The device includes MOSFET1 and MOSFET2 arranged in a first direction, variable resistive element (hereafter R1) above MOSFET1 and MOSFET2, a lower end of the R1 being connected to drains of MOSFET1 and MOSFET2, MOSFET3 and MOSFET4 arranged in the first direction, variable resistive element (hereafter R2) above MOSFET3 and MOSFET4, and a lower end of the R2 being connected to drains of MOSFET3 and MOSFET4. The device further includes first wiring line extending in the first direction and connected to sources of MOSFET1 and MOSFET2, second wiring line extending in the first direction and connected to sources of MOSFET3 and MOSFET4, upper electrode connecting upper end of the R1 and upper end of the R2, and third wiring line extending in the first direction and connected to the upper electrode.

    摘要翻译: 根据一个实施例,公开了一种半导体存储器件。 该器件包括在第一方向上布置的MOSFET1和MOSFET2,MOSFET1和MOSFET2上方的可变电阻元件(以下称为R1),R1的下端连接到沿第一方向布置的MOSFET1和MOSFET2,MOSFET3和MOSFET4的漏极,可变电阻 元件(以下称为R2),MOSFET3和MOSFET4之上,R2的下端连接到MOSFET3和MOSFET4的漏极。 该器件还包括沿第一方向延伸并连接到MOSFET1和MOSFET2的源极的第一布线,第二布线沿第一方向延伸并连接到MOSFET3和MOSFET4的源极,上电极连接R1的上端和上端 R2和第三布线沿第一方向延伸并连接到上电极。