Vortex prevention apparatus in pump
    1.
    发明授权
    Vortex prevention apparatus in pump 有权
    泵中防涡流装置

    公开(公告)号:US06533543B2

    公开(公告)日:2003-03-18

    申请号:US09774004

    申请日:2001-01-31

    IPC分类号: F03B1506

    摘要: A vortex prevention apparatus is combined with a pump, and prevents an air entrained vortex or a submerged vortex from being produced when water in the pump pit is pumped up by a pump. A suction member is disposed in an open water channel and has a suction port. An auxiliary flow-path forming structure is disposed substantially concentrically around the suction member with a gap defined between the auxiliary flow-path forming structure and an outer circumferential surface of the suction member.

    摘要翻译: 涡流防止装置与泵组合,并且防止在泵坑中的水被泵泵送时产生空气夹带的涡流或浸没的涡流。 抽吸构件设置在开放水通道中并具有吸入口。 辅助流路形成结构基本上同心地布置在吸附构件周围,其间隙限定在辅助流路形成结构和抽吸构件的外周表面之间。

    Substrate treating method and apparatus
    2.
    发明申请
    Substrate treating method and apparatus 审中-公开
    基板处理方法及装置

    公开(公告)号:US20060118140A1

    公开(公告)日:2006-06-08

    申请号:US11235002

    申请日:2005-09-22

    IPC分类号: B08B3/00 B08B3/12

    摘要: When substrates are immersed in a treating solution stored in an inner tank, micro bubbles are formed in large quantities. Nitrogen gas nozzles supply nitrogen gas to the surface of the treating solution, while the substrates are immersed in the solution. The nitrogen gas supplied drives the bubbles on the surface from the inner tank to an outer tank, thereby removing the bubbles from the inner tank. Since the bubbles are driven to the outer tank while the substrates are immersed, particles have a reduced chance of adhering to the substrates when the latter are withdrawn up from the treating solution in the inner tank.

    摘要翻译: 当将基板浸入存储在内箱中的处理液中时,大量形成微气泡。 氮气喷嘴向处理液的表面供给氮气,同时将基板浸入溶液中。 供给的氮气将表面上的气泡从内罐驱动到外罐,从而从内罐除去气泡。 由于在浸没基板时气泡被驱动到外槽,所以当从内池中的处理溶液中取出时,颗粒的粘附机会降低。

    Substrate treating apparatus and method
    3.
    发明申请
    Substrate treating apparatus and method 有权
    底物处理装置及方法

    公开(公告)号:US20060213433A1

    公开(公告)日:2006-09-28

    申请号:US11387880

    申请日:2006-03-22

    摘要: A substrate treating apparatus includes a treating unit for treating substrates, a piping for supplying a treating liquid to the treating unit, a heater mounted on the piping, an electronic thermal unit mounted on the piping in series with the heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling the heater and the electronic thermal unit. The controller sets a first temperature control mode for performing a room temperature control using the electronic thermal unit when the temperature measured by the temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control with the heater when the temperature measured by the temperature sensor is above the predetermined boundary temperature between room temperature and high temperature. The controller sets a second temperature control mode for performing a heating control using the heater and the electronic thermal unit to heat the treating liquid when a difference between the temperature measured by the temperature sensor and a target temperature at least corresponds to a first specified value set beforehand. Further, the controller sets the first temperature control mode when, after the second temperature control mode is set, the difference between the temperature measured by the temperature sensor and the target temperature becomes less than a second specified value set beforehand.

    摘要翻译: 基板处理装置包括处理基板的处理单元,向处理单元供给处理液的配管,安装在配管上的加热器,安装在与加热器串联的配管上的电子热单元,测量用温度传感器 处理液的温度,以及用于控制加热器和电子热单元的控制器。 当由温度传感器测量的温度低于室温和高温之间的预定边界温度时,控制器设置第一温度控制模式,用于使用电子热单元执行室温控制,并且使用加热器进行高温控制 当由温度传感器测量的温度高于室温和高温之间的预定边界温度时。 控制器设置第二温度控制模式,用于当由温度传感器测量的温度与目标温度之间的差异至少对应于第一指定值组时,使用加热器和电子热单元执行加热控制以加热处理液体 预先。 此外,控制器设定第一温度控制模式,在设定第二温度控制模式之后,由温度传感器测量的温度与目标温度之间的差变得小于预先设定的第二规定值。

    Substrate treating apparatus and method
    4.
    发明授权
    Substrate treating apparatus and method 有权
    底物处理装置及方法

    公开(公告)号:US07922826B2

    公开(公告)日:2011-04-12

    申请号:US12782265

    申请日:2010-05-18

    IPC分类号: B08B7/00 G05D23/00

    摘要: A substrate treating apparatus includes a treating unit for treating substrates, a piping for supplying a treating liquid to the treating unit, a heater mounted on the piping, an electronic thermal unit mounted on the piping in series with the heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling the heater and the electronic thermal unit. The controller sets a first temperature control mode for performing a room temperature control using the electronic thermal unit when the temperature measured by the temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control with the heater when the temperature measured by the temperature sensor is above the predetermined boundary temperature between room temperature and high temperature. The controller sets a second temperature control mode for performing a heating control using the heater and the electronic thermal unit to heat the treating liquid when a difference between the temperature measured by the temperature sensor and a target temperature at least corresponds to a first specified value set beforehand. Further, the controller sets the first temperature control mode when, after the second temperature control mode is set, the difference between the temperature measured by the temperature sensor and the target temperature becomes less than a second specified value set beforehand.

    摘要翻译: 基板处理装置包括处理基板的处理单元,向处理单元供给处理液的配管,安装在配管上的加热器,安装在与加热器串联的配管上的电子热单元,测量用温度传感器 处理液的温度,以及用于控制加热器和电子热单元的控制器。 当由温度传感器测量的温度低于室温和高温之间的预定边界温度时,控制器设置第一温度控制模式,用于使用电子热单元进行室温控制,并且使用加热器进行高温控制 当由温度传感器测量的温度高于室温和高温之间的预定边界温度时。 控制器设置第二温度控制模式,用于当由温度传感器测量的温度与目标温度之间的差异至少对应于第一指定值组时,使用加热器和电子热单元执行加热控制以加热处理液体 预先。 此外,控制器设定第一温度控制模式,在设定第二温度控制模式之后,由温度传感器测量的温度与目标温度之间的差变得小于预先设定的第二规定值。

    SUBSTRATE TREATING APPARATUS AND METHOD
    6.
    发明申请
    SUBSTRATE TREATING APPARATUS AND METHOD 有权
    基板处理装置和方法

    公开(公告)号:US20100224219A1

    公开(公告)日:2010-09-09

    申请号:US12782265

    申请日:2010-05-18

    IPC分类号: B08B7/00

    摘要: A substrate treating apparatus includes a treating unit for treating substrates, a piping for supplying a treating liquid to the treating unit, a heater mounted on the piping, an electronic thermal unit mounted on the piping in series with the heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling the heater and the electronic thermal unit. The controller sets a first temperature control mode for performing a room temperature control using the electronic thermal unit when the temperature measured by the temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control with the heater when the temperature measured by the temperature sensor is above the predetermined boundary temperature between room temperature and high temperature. The controller sets a second temperature control mode for performing a heating control using the heater and the electronic thermal unit to heat the treating liquid when a difference between the temperature measured by the temperature sensor and a target temperature at least corresponds to a first specified value set beforehand. Further, the controller sets the first temperature control mode when, after the second temperature control mode is set, the difference between the temperature measured by the temperature sensor and the target temperature becomes less than a second specified value set beforehand.

    摘要翻译: 基板处理装置包括处理基板的处理单元,向处理单元供给处理液的配管,安装在配管上的加热器,安装在与加热器串联的配管上的电子热单元,测量用温度传感器 处理液的温度,以及用于控制加热器和电子热单元的控制器。 当由温度传感器测量的温度低于室温和高温之间的预定边界温度时,控制器设置第一温度控制模式,用于使用电子热单元进行室温控制,并且使用加热器进行高温控制 当由温度传感器测量的温度高于室温和高温之间的预定边界温度时。 控制器设置第二温度控制模式,用于当由温度传感器测量的温度与目标温度之间的差异至少对应于第一指定值组时,使用加热器和电子热单元执行加热控制以加热处理液体 预先。 此外,控制器设定第一温度控制模式,在设定第二温度控制模式之后,由温度传感器测量的温度与目标温度之间的差变得小于预先设定的第二规定值。

    Signal processing circuit with timing recovery PLL
    8.
    发明授权
    Signal processing circuit with timing recovery PLL 有权
    具有定时恢复PLL的信号处理电路

    公开(公告)号:US06643820B2

    公开(公告)日:2003-11-04

    申请号:US09430100

    申请日:1999-10-29

    申请人: Tsuyoshi Tomita

    发明人: Tsuyoshi Tomita

    IPC分类号: G06K504

    CPC分类号: G11B20/1403

    摘要: A signal processing circuit for processing a read signal corresponding to data read from a recording medium, such as a magnetic disc. The signal processing circuit detects a preamble data signal of the read signal. A decision feedback equalizer (DFE) generates a computation read signal by performing a predetermined computation on the read signal in accordance with a clock signal. The DFE generates first code data using the computation read signal. A code data generating circuit connected to the DFE compares the computation read signal with a first reference signal and generates second code data, which corresponds to the preamble data signal. A phase error detection circuit detects a phase error between the clock signal and the read signal using one of the first and second code data. A timing recovery PLL is connected to the phase error detection circuit and uses the detected phase error to generate the clock signal such that the phase of the clock signal matches the phase of the preamble data signal.

    摘要翻译: 一种用于处理对应于从诸如磁盘的记录介质读取的数据的读取信号的信号处理电路。 信号处理电路检测读信号的前同步码数据信号。 判决反馈均衡器(DFE)通过根据时钟信号对读取信号执行预定的计算来生成计算读取信号。 DFE使用计算读取信号产生第一代码数据。 连接到DFE的代码数据生成电路将计算读取信号与第一参考信号进行比较,并产生对应于前导码数据信号的第二代码数据。 相位误差检测电路使用第一和第二代码数据之一检测时钟信号和读取信号之间的相位误差。 定时恢复PLL连接到相位误差检测电路,并使用检测到的相位误差来产生时钟信号,使得时钟信号的相位与前导码数据信号的相位匹配。

    Substrate treating apparatus and method
    9.
    发明授权
    Substrate treating apparatus and method 有权
    底物处理装置及方法

    公开(公告)号:US07744699B2

    公开(公告)日:2010-06-29

    申请号:US11387880

    申请日:2006-03-22

    IPC分类号: B08B7/00 G05D23/00

    摘要: A substrate treating apparatus includes a treating unit for treating substrates, a piping for supplying a treating liquid to the treating unit, a heater mounted on the piping, an electronic thermal unit mounted on the piping in series with the heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling the heater and the electronic thermal unit. The controller sets a first temperature control mode for performing a room temperature control using the electronic thermal unit when the temperature measured by the temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control with the heater when the temperature measured by the temperature sensor is above the predetermined boundary temperature between room temperature and high temperature. The controller sets a second temperature control mode for performing a heating control using the heater and the electronic thermal unit to heat the treating liquid when a difference between the temperature measured by the temperature sensor and a target temperature at least corresponds to a first specified value set beforehand. Further, the controller sets the first temperature control mode when, after the second temperature control mode is set, the difference between the temperature measured by the temperature sensor and the target temperature becomes less than a second specified value set beforehand.

    摘要翻译: 基板处理装置包括处理基板的处理单元,向处理单元供给处理液的配管,安装在配管上的加热器,安装在与加热器串联的配管上的电子热单元,测量用温度传感器 处理液的温度,以及用于控制加热器和电子热单元的控制器。 当由温度传感器测量的温度低于室温和高温之间的预定边界温度时,控制器设置第一温度控制模式,用于使用电子热单元进行室温控制,并且使用加热器进行高温控制 当由温度传感器测量的温度高于室温和高温之间的预定边界温度时。 控制器设置第二温度控制模式,用于当由温度传感器测量的温度与目标温度之间的差异至少对应于第一指定值组时,使用加热器和电子热单元执行加热控制以加热处理液体 预先。 此外,控制器设定第一温度控制模式,在设定第二温度控制模式之后,由温度传感器测量的温度与目标温度之间的差变得小于预先设定的第二规定值。

    Signal processing circuit for preventing pseudo lock of timing recovery PLL
    10.
    发明授权
    Signal processing circuit for preventing pseudo lock of timing recovery PLL 有权
    用于防止定时恢复PLL的伪锁定的信号处理电路

    公开(公告)号:US06931088B1

    公开(公告)日:2005-08-16

    申请号:US09263766

    申请日:1999-03-05

    申请人: Tsuyoshi Tomita

    发明人: Tsuyoshi Tomita

    IPC分类号: G11B20/14 H03D3/24 H03L7/08

    CPC分类号: H03L7/08

    摘要: A signal processing circuit used in a hard disk controller is able to quickly match its clock signal with preamble data read from a hard disk. The signal processing circuit includes a decision feedback equalizer (DFE) that equalizes a digital read signal in accordance with a clock signal. A timing recovery PLL generates the clock signal having a phase which is coincident with a phase of the digital read signal. The DFE includes a first filter for filtering the digital signal, a decision circuit for adding a feedback signal to the filtered digital signal and generating a decision signal based on the value of the addition. A shift register is connected to the decision circuit and samples the decision signal in accordance with the clock signal, and stores the sampled signal as sampling data. A feedback filter filters the sampled data and feeds it back to the decision circuit. A loop control circuit monitors the filtered digital signal and the feedback signal and controls the feedback loop based on the values of these signals.

    摘要翻译: 在硬盘控制器中使用的信号处理电路能够将其时钟信号与从硬盘读取的前导码数据快速匹配。 信号处理电路包括根据时钟信号均衡数字读取信号的判决反馈均衡器(DFE)。 定时恢复PLL产生具有与数字读取信号的相位一致的相位的时钟信号。 DFE包括用于对数字信号进行滤波的第一滤波器,用于将反馈信号加到经滤波的数字信号并根据加法值产生判定信号的判定电路。 移位寄存器连接到判定电路,并根据时钟信号对判定信号进行采样,并将采样信号存储为采样数据。 反馈滤波器对采样数据进行滤波并将其反馈给判决电路。 回路控制电路监视滤波后的数字信号和反馈信号,并根据这些信号的值控制反馈回路。