摘要:
A semiconductor device includes a semiconductor substrate, source and drain regions, a channel region, a gate insulating film, a charge storage layer, and a control gate electrode. The source and drain regions include first impurities of a first conductivity type. The channel region includes second impurities of a second conductivity type. The gate insulating film includes the second impurities in a region thereof located immediately above at least a portion of the channel region. The charge storage layer is formed on the gate insulating film. The control gate electrode is provided on the charge storage layer. The control gate electrode is formed on the charge storage layer and is electrically connected to the charge storage layer by a connection portion provided on a part of the charge storage layer, which is located immediately above at least a part of the region of the gate insulating film including the second impurities.
摘要:
A semiconductor device includes a semiconductor substrate, source and drain regions, a channel region, a gate insulating film, a charge storage layer, and a control gate electrode. The source and drain regions include first impurities of a first conductivity type. The channel region includes second impurities of a second conductivity type. The gate insulating film includes the second impurities in a region thereof located immediately above at least a portion of the channel region. The charge storage layer is formed on the gate insulating film. The control gate electrode is provided on the charge storage layer. The control gate electrode is formed on the charge storage layer and is electrically connected to the charge storage layer by a connection portion provided on a part of the charge storage layer, which is located immediately above at least a part of the region of the gate insulating film including the second impurities.
摘要:
A semiconductor device includes a semiconductor substrate, source and drain regions, a channel region, a gate insulating film, a charge storage layer, and a control gate electrode. The source and drain regions include first impurities of a first conductivity type. The channel region includes second impurities of a second conductivity type. The gate insulating film includes the second impurities in a region thereof located immediately above at least a portion of the channel region. The charge storage layer is formed on the gate insulating film. The control gate electrode is provided on the charge storage layer. The control gate electrode is formed on the charge storage layer and is electrically connected to the charge storage layer by a connection portion provided on a part of the charge storage layer, which is located immediately above at least a part of the region of the gate insulating film including the second impurities.
摘要:
A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要:
A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要:
A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要:
A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要:
A semiconductor device includes a structure in which a first electrode layer, an inter-electrode insulating film and a second electrode layer are laminated in a main circuit in this order, and includes a capacitor element having a lower electrode formed of the same layer as the first electrode layer, a charge storage layer formed of the same layer as the inter-electrode insulating film, and an upper electrode formed of the second electrode layer. The semiconductor device further includes an opening portion formed in the charge storage layer, the opening portion having a bottom to which the lower electrode is exposed, and a first region electrically connected to the lower electrode via the opening portion and electrically isolated from the upper electrode, the first region being formed of the same layer as the second electrode layer.
摘要:
A semiconductor memory device includes a semiconductor substrate, an element isolation region formed in the semiconductor substrate and including a thick element isolating insulation film, for isolating an element region, a first gate electrode provided on the element region in the semiconductor substrate in self-alignment with the element isolation region, a second gate electrode provided on the first gate electrode with an insulation film interposed therebetween, and a resistance element formed on the element isolation region, the resistance element and the second gate electrode being formed of the same conductive film.
摘要:
A semiconductor memory device includes a semiconductor substrate, an element isolation region formed in the semiconductor substrate and including a thick element isolating insulation film, for isolating an element region, a first gate electrode provided on the element region in the semiconductor substrate in self-alignment with the element isolation region, a second gate electrode provided on the first gate electrode with an insulation film interposed therebetween, and a resistance element formed on the element isolation region, the resistance element and the second gate electrode being formed of the same conductive film.