公开(公告)号：US4761493A

公开(公告)日：1988-08-02

申请号：US24074

申请日：1987-03-10

申请人： Masayuki Umeno ,  Satoshi Takita

发明人： Masayuki Umeno ,  Satoshi Takita

IPC分类号： C07F9/54 ,  C08G77/08 ,  C07F9/02

CPC分类号： C07F9/54

摘要： A quaternary phosphonium hydroxide, which is represented by the following general formula (II): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 mean independently an alkyl group having 1-8 carbon atoms, a phenyl group or a benzyl group, is prepared by dissolving a quaternary phosphonium halide represented by the following general formula (I): ##STR2## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 has the same meaning as defined above and X denotes a chlorine, bromine or iodine atom, in a solvent selected from water, lower alcohols and aqueous lower alcohols, and then bringing the resultant solution into contact with a strongly basic anion exchange resin (OH-form).

摘要翻译： 由下列通式（II）表示的季鏻氢氧化物：其中R1，R2，R3和R4独立地表示具有1-8个碳原子的烷基，苯基或苄基 通过溶解由以下通式（I）表示的季鏻卤化物制备：其中R 1，R 2，R 3和R 4具有与上述相同的含义，X表示氯，溴或碘原子 在选自水，低级醇和低级醇的溶剂中，然后将所得溶液与强碱性阴离子交换树脂（OH-型）接触。

公开(公告)号：US4613373A

公开(公告)日：1986-09-23

申请号：US694064

申请日：1985-01-23

申请人： Masayuki Umeno ,  Akitomo Wakabayashi ,  Kazuo Tomozane ,  Sumio Wakabayashi ,  Hitoshi Okamoto ,  Junji Yokoi

发明人： Masayuki Umeno ,  Akitomo Wakabayashi ,  Kazuo Tomozane ,  Sumio Wakabayashi ,  Hitoshi Okamoto ,  Junji Yokoi

IPC分类号： A01N55/08 ,  C07D213/06 ,  C07D233/54 ,  C07F5/02 ,  C09D5/16 ,  C09D5/14

CPC分类号： C07D213/06 ,  A01N55/08 ,  C07D233/54 ,  C07F5/027 ,  C09D5/1625

摘要： New tetraarylboron-ammonium complexes having the general formula: ##STR1## wherein R.sub.1 represents a hydrogen or a halogen atom or a lower alkyl group; R.sub.2 represents a halogen atom or a lower alkyl or a lower alkenyl group; and R.sub.3 represents a heterocyclic amine are provided as active ingredient of anti-fouling paint and also of antiseptic, antifungal agent. These compounds exhibit remarkably long-lasting anti-fouling activities against substantially all kinds of aquatic organisms including slimes with acceptably low toxicity against human beings and also exhibit high antimicrobial activities against various fungi, bacteria and yeasts.

摘要翻译： 具有以下通式的新的四芳基硼 - 铵络合物：其中R 1表示氢或卤素原子或低级烷基; R2表示卤素原子或低级烷基或低级烯基; 提供作为防污涂料的有效成分和抗菌，抗真菌剂的R3代表杂环胺。 这些化合物对基本上所有种类的水生生物（包括对人类具有可接受的低毒性的泥土）表现出显着的持久的抗结垢活性，并且还表现出对各种真菌，细菌和酵母菌的高抗微生物活性。

公开(公告)号：US06168872A

公开(公告)日：2001-01-02

申请号：US09220439

申请日：1998-12-24

申请人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

发明人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/12528 ,  H01L2924/00

摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.

摘要翻译： 包含环氧树脂，固化剂，无机填料和固化促进剂的环氧树脂组合物适用于半导体封装。 使用特定的有机磷化合物作为固化促进剂。 组合物流畅平稳，储存期间稳定，有效固化和脱模，并且可以模制和固化成不含导线流动和空隙的产品。

公开(公告)号：US06274251B1

公开(公告)日：2001-08-14

申请号：US09337520

申请日：1999-06-22

申请人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

发明人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

IPC分类号： C09D16300

CPC分类号： H01L23/293 ,  C08G59/688 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.

摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂固化剂，（C）固化催化剂和（D）无机填料。 催化剂是与具有至少两个羟基的酚醛树脂混合并反应的季磷化合物或季磷化合物。 该组合物是有效流动的，可模制的和可固化的，因此适合于半导体封装。