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1.发明授权公开(公告)号：US06168872A
公开(公告)日：2001-01-02
申请号：US09220439
申请日：1998-12-24
申请人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Shoichi Osada , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Shoichi Osada , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , H01L2924/0002 , H01L2924/12044 , Y10T428/12528 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.
摘要翻译： 包含环氧树脂，固化剂，无机填料和固化促进剂的环氧树脂组合物适用于半导体封装。 使用特定的有机磷化合物作为固化促进剂。 组合物流畅平稳，储存期间稳定，有效固化和脱模，并且可以模制和固化成不含导线流动和空隙的产品。
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2.发明授权公开(公告)号：US06274251B1
公开(公告)日：2001-08-14
申请号：US09337520
申请日：1999-06-22
申请人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Kazutoshi Tomiyoshi , Shoichi Osada , Toshio Shiobara
发明人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Kazutoshi Tomiyoshi , Shoichi Osada , Toshio Shiobara
IPC分类号： C09D16300
CPC分类号： H01L23/293 , C08G59/688 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.
摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂固化剂，（C）固化催化剂和（D）无机填料。 催化剂是与具有至少两个羟基的酚醛树脂混合并反应的季磷化合物或季磷化合物。 该组合物是有效流动的，可模制的和可固化的，因此适合于半导体封装。
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公开(公告)号：US07095125B2
公开(公告)日：2006-08-22
申请号：US10617827
申请日：2003-07-14
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L23/29
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
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4.发明授权公开(公告)号：US06894091B2
公开(公告)日：2005-05-17
申请号：US09883276
申请日：2001-06-19
申请人： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
发明人： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
摘要翻译： 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。
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5.发明授权公开(公告)号：US06297306B1
公开(公告)日：2001-10-02
申请号：US09310924
申请日：1999-05-13
IPC分类号： C08K310
CPC分类号： C08K3/22 , C08K3/2279 , C08K2003/2227 , C08L63/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的 并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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6.发明授权公开(公告)号：US06291556B1
公开(公告)日：2001-09-18
申请号：US09534386
申请日：2000-03-24
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： C08K6300
CPC分类号： H01L23/293 , C08K3/2279 , C08K9/08 , C08K2003/026 , C08K2201/019 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）包含涂覆有热塑性树脂和/或热固性树脂的红磷基芯的微胶囊阻燃剂， （D）钼化合物和（E）无机填料。 即使没有卤化环氧树脂和氧化锑，该组合物及其固化产品具有防湿可靠性和高阻燃性。
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7.发明授权公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2329
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。
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公开(公告)号：US06518332B2
公开(公告)日：2003-02-11
申请号：US09841046
申请日：2001-04-25
IPC分类号： C08K310
CPC分类号： H01L23/293 , C08G59/3218 , C08K9/12 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
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9.发明授权
公开(公告)号：US6162878A
公开(公告)日：2000-12-19
申请号：US310999
申请日：1999-05-13
IPC分类号： C08G59/08 , C08G59/20 , C08G59/40 , C08G59/62 , C08K3/00 , C08L61/04 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/08 , C08G59/4085 , C08L61/04 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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10.发明授权Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device 失效半导体封装阻燃环氧树脂组合物和半导体器件公开(公告)号：US06783859B2
公开(公告)日：2004-08-31
申请号：US10358188
申请日：2003-02-05
IPC分类号： B32B2738
CPC分类号： C08G59/621 , C08K3/04 , C08K3/10 , C08K3/36 , C08K5/5399 , C08K5/5419 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.
摘要翻译： 包含环氧树脂，酚醛树脂固化剂，无机填料，无机载体上的钼酸锌和两种磷腈化合物的互补组合的环氧树脂组合物是有效的可模塑的，阻燃的并且适用于半导体封装。 用固化的环氧树脂组合物封装的半导体器件的阻燃性和防潮可靠性得到改善。
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