Abstract:
Various embodiments of the present invention relate to systems, devices and methods of oversampling electronic components where high frequency oversampling clock signals are generated internally. The generated oversampling clock is automatically synchronous with the input clock and the input serial data in a serial data link, and is adaptive to predetermined parameters, such as bit depth and oversampling rate.
Abstract:
Various embodiments of the present invention relate to systems, devices and methods of oversampling electronic components where high frequency oversampling clock signals are generated internally. The generated oversampling clock is automatically synchronous with the input clock and the input serial data in a serial data link, and is adaptive to predetermined parameters, such as bit depth and oversampling rate.
Abstract:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
Abstract:
Generally, the present invention is directed to marketing techniques and more particularly to direct-to-patient marketing for medical devices, pharmaceutical drugs, and biotechnology products. The approach presented here may also be applied to the recruitment of patients for clinical trials evaluation including tracking outcomes after treatment. An embodiment of the invention includes the steps of finding potential patients, qualifying potential patients, connecting potential patients to preferred physicians, and tracking the patient's progress through the appointment phase and tracking outcomes.
Abstract:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
Abstract:
An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The power rails are electrically coupled to a power supply and the integrated circuits. At the same time, the power rails are used to thermally couple one or more heatsinks to the integrated circuit(s). Each power rails includes at least one slot configured to receive a flange on the heatsink(s). In situations under which different voltages are supplied via the power rails, means are provided to electrically insulate at least one power rail from the heatsink(s) while maintaining thermal coupling to the power rails. In one embodiment, a split-rail configuration is used, wherein the power rail includes multiple conductive sections separated by one or more insulator sections. The scheme is well-suited for modular board/blade architectures, such as the Advanced Telecommunications Architecture (ATCA).
Abstract:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
Abstract:
A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.
Abstract:
Embodiments of the invention are generally directed to a connector. In one embodiment, the connector includes a plurality of flexible circuit partitions and a first mating portion to receive and couple a contact for a device to a first end of one or more flexible circuit partitions. The connector also includes a second mating portion to receive and couple a contact for another device to a second end of the one or more flexible circuit partitions. A connector housing is connected to the other device to contain the first and second mating portions. Each flexible circuit partition further includes a twist to increase a range of movement along three axes of movement in which the first mating portion receives and couples the device's contact to the first end of one or more flexible circuit partitions without a proportional increase in movement of either end of each flexible circuit partition.
Abstract:
A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.