公开(公告)号：US08378328B2

公开(公告)日：2013-02-19

申请号：US12036215

申请日：2008-02-22

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Yi-Chou Chen ,  Chung H. Lam ,  Simone Raoux

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Yi-Chou Chen ,  Chung H. Lam ,  Simone Raoux

IPC分类号： H01L29/02 ,  H01L47/00

CPC分类号： H01L45/06 ,  G11C13/0004 ,  H01L27/2436 ,  H01L45/1226 ,  H01L45/14

摘要： A phase change memory cell with a single element phase change thin film layer; and a first electrode and a second electrode coupled to the single element phase change thin film layer. A current flows from the first electrode to the single element phase change thin film layer, and through to the second electrode. The single element phase change thin film layer includes a single element phase change material. The single element phase change thin film layer can be less than 5 nanometers thick. The temperature of crystallization of the single element phase change material can be controlled by its thickness. In one embodiment, the single element phase change thin film layer is configured to be amorphous at room temperature (25 degrees Celsius). In one embodiment, the single element phase change thin film layer is comprised of Antimony (Sb).

摘要翻译： 具有单个元件相变薄膜层的相变存储单元; 以及耦合到单个元件相变薄膜层的第一电极和第二电极。 A电流从第一电极流向单一元件相变薄膜层，并通过第二电极。 单元相变薄膜层包括单一元素相变材料。 单相相变薄膜层可以小于5纳米厚。 单元相变材料的结晶温度可以通过其厚度来控制。 在一个实施例中，单个元件相变薄膜层被配置为在室温（25摄氏度）下是无定形的。 在一个实施例中，单元相变薄膜层由锑（Sb）组成。

公开(公告)号：US20090212274A1

公开(公告)日：2009-08-27

申请号：US12036215

申请日：2008-02-22

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Yi-Chou Chen ,  Chung H. Lam ,  Simone Raoux

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Yi-Chou Chen ,  Chung H. Lam ,  Simone Raoux

IPC分类号： H01L45/00

CPC分类号： H01L45/06 ,  G11C13/0004 ,  H01L27/2436 ,  H01L45/1226 ,  H01L45/14

摘要： A phase change memory cell with a single element phase change thin film layer; and a first electrode and a second electrode coupled to the single element phase change thin film layer. A current flows from the first electrode to the single element phase change thin film layer, and through to the second electrode. The single element phase change thin film layer includes a single element phase change material. The single element phase change thin film layer can be less than 5 nanometers thick. The temperature of crystallization of the single element phase change material can be controlled by its thickness. In one embodiment, the single element phase change thin film layer is configured to be amorphous at room temperature (25 degrees Celsius). In one embodiment, the single element phase change thin film layer is comprised of Antimony (Sb).

摘要翻译： 具有单个元件相变薄膜层的相变存储单元; 以及耦合到单个元件相变薄膜层的第一电极和第二电极。 A电流从第一电极流向单一元件相变薄膜层，并通过第二电极。 单元相变薄膜层包括单一元素相变材料。 单相相变薄膜层可以小于5纳米厚。 单元相变材料的结晶温度可以通过其厚度来控制。 在一个实施例中，单个元件相变薄膜层被配置为在室温（25摄氏度）下是无定形的。 在一个实施例中，单元相变薄膜层由锑（Sb）组成。

公开(公告)号：US08363463B2

公开(公告)日：2013-01-29

申请号：US12729837

申请日：2010-03-23

申请人： Yen-Hao Shih ,  Huai-Yu Cheng ,  Chieh-Fang Chen ,  Chao-I Wu ,  Ming Hsiu Lee ,  Hsiang-Lan Lung ,  Matthew J. Breitwisch ,  Simone Raoux ,  Chung H Lam

发明人： Yen-Hao Shih ,  Huai-Yu Cheng ,  Chieh-Fang Chen ,  Chao-I Wu ,  Ming Hsiu Lee ,  Hsiang-Lan Lung ,  Matthew J. Breitwisch ,  Simone Raoux ,  Chung H Lam

IPC分类号： G11C11/00

CPC分类号： H01L45/1625 ,  G11C13/0004 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1641

摘要： A phase change memory device with a memory element including a basis phase change material, such as a chalcogenide, and one or more additives, where the additive or additives have a non-constant concentration profile along an inter-electrode current path through a memory element. The use of “non-constant” concentration profiles for additives enables doping the different zones with different materials and concentrations, according to the different crystallographic, thermal and electrical conditions, and different phase transition conditions.

摘要翻译： 一种具有存储元件的相变存储器件，该存储元件包括诸如硫族化物的基本相变材料和一种或多种添加剂，其中所述添加剂或添加剂沿着穿过存储元件的电极间电流路径具有非恒定浓度分布 。 根据不同的晶体学，热学和电学条件以及不同的相变条件，使用非恒定浓度分布的添加剂可以使用不同的材料和浓度掺杂不同的区域。

公开(公告)号：US20120193595A1

公开(公告)日：2012-08-02

申请号：US13076169

申请日：2011-03-30

申请人： Huai-Yu Cheng ,  Chieh-Fang Chen ,  Hsiang-Lan Lung ,  Yen-Hao Shih ,  Simone Raoux ,  Matthew J. Breitwisch

发明人： Huai-Yu Cheng ,  Chieh-Fang Chen ,  Hsiang-Lan Lung ,  Yen-Hao Shih ,  Simone Raoux ,  Matthew J. Breitwisch

IPC分类号： H01L45/00 ,  C23C14/14 ,  C23C14/34

CPC分类号： H01L47/00 ,  C23C14/06 ,  C23C14/0623 ,  C23C14/3414 ,  H01L21/06 ,  H01L27/24 ,  H01L45/144 ,  H01L45/1625

摘要： A layer of phase change material with silicon or another semiconductor, or a silicon-based or other semiconductor-based additive, is formed using a composite sputter target including the silicon or other semiconductor, and the phase change material. The concentration of silicon or other semiconductor is more than five times greater than the specified concentration of silicon or other semiconductor in the layer being formed. For silicon-based additive in GST-type phase change materials, sputter target may comprise more than 40 at % silicon. Silicon-based or other semiconductor-based additives can be formed using the composite sputter target with a flow of reactive gases, such as oxygen or nitrogen, in the sputter chamber during the deposition.

摘要翻译： 使用包括硅或其它半导体的复合溅射靶和相变材料形成具有硅或另一半导体或硅基或其它基于半导体的添加剂的相变材料层。 硅或其他半导体的浓度比正在形成的层中规定浓度的硅或其它半导体的浓度高五倍以上。 对于GST型相变材料中的硅基添加剂，溅射靶可以包含超过40at％的硅。 可以在沉积期间使用复合溅射靶在溅射室中形成具有诸如氧或氮的反应气体流的硅基或其它基于半导体的添加剂。

公开(公告)号：US08426242B2

公开(公告)日：2013-04-23

申请号：US13076169

申请日：2011-03-30

申请人： Huai-Yu Cheng ,  Chieh-Fang Chen ,  Hsiang-Lan Lung ,  Yen-Hao Shih ,  Simone Raoux ,  Matthew J. Breitwisch

发明人： Huai-Yu Cheng ,  Chieh-Fang Chen ,  Hsiang-Lan Lung ,  Yen-Hao Shih ,  Simone Raoux ,  Matthew J. Breitwisch

IPC分类号： H01L21/06

CPC分类号： H01L47/00 ,  C23C14/06 ,  C23C14/0623 ,  C23C14/3414 ,  H01L21/06 ,  H01L27/24 ,  H01L45/144 ,  H01L45/1625

摘要： A layer of phase change material with silicon or another semiconductor, or a silicon-based or other semiconductor-based additive, is formed using a composite sputter target including the silicon or other semiconductor, and the phase change material. The concentration of silicon or other semiconductor is more than five times greater than the specified concentration of silicon or other semiconductor in the layer being formed. For silicon-based additive in GST-type phase change materials, sputter target may comprise more than 40 at % silicon. Silicon-based or other semiconductor-based additives can be formed using the composite sputter target with a flow of reactive gases, such as oxygen or nitrogen, in the sputter chamber during the deposition.

摘要翻译： 使用包括硅或其它半导体的复合溅射靶和相变材料形成具有硅或另一半导体或硅基或其它基于半导体的添加剂的相变材料层。 硅或其他半导体的浓度比正在形成的层中规定浓度的硅或其它半导体的浓度高五倍以上。 对于GST型相变材料中的硅基添加剂，溅射靶可以包含超过40at％的硅。 可以在沉积期间使用复合溅射靶在溅射室中形成具有诸如氧或氮的反应气体流的硅基或其它基于半导体的添加剂。

公开(公告)号：US08324605B2

公开(公告)日：2012-12-04

申请号：US12286874

申请日：2008-10-02

申请人： Hsiang-Lan Lung ,  Chieh-Fang Chen ,  Yen-Hao Shih ,  Ming-Hsiu Lee ,  Matthew J. Breitwisch ,  Chung Hon Lam ,  Frieder H. Baumann ,  Philip Flaitz ,  Simone Raoux

发明人： Hsiang-Lan Lung ,  Chieh-Fang Chen ,  Yen-Hao Shih ,  Ming-Hsiu Lee ,  Matthew J. Breitwisch ,  Chung Hon Lam ,  Frieder H. Baumann ,  Philip Flaitz ,  Simone Raoux

IPC分类号： H01L47/00 ,  H01L21/06

CPC分类号： H01L45/1226 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/144 ,  H01L45/1625 ,  H01L45/1641

摘要： A method for manufacturing a memory device, and a resulting device, is described using silicon oxide doped chalcogenide material. A first electrode having a contact surface; a body of phase change memory material in a polycrystalline state including a portion in contact with the contact surface of the first electrode, and a second electrode in contact with the body of phase change material are formed. The process includes melting and cooling the phase change memory material one or more times within an active region in the body of phase change material without disturbing the polycrystalline state outside the active region. A mesh of silicon oxide in the active region with at least one domain of chalcogenide material results. Also, the grain size of the phase change material in the polycrystalline state outside the active region is small, resulting in a more uniform structure.

摘要翻译： 使用氧化硅掺杂的硫族化物材料来描述用于制造存储器件的方法和所得到的器件。 具有接触表面的第一电极; 形成包括与第一电极的接触表面接触的部分的多晶状态的相变记忆材料体以及与相变材料体接触的第二电极。 该方法包括在相变材料体内的有源区内熔化和冷却相变存储材料一次或多次，而不会干扰有源区外的多晶态。 导致活性区域中的氧化硅网格与至少一个硫族化物材料结构域形成。 此外，活性区域外的多晶态的相变材料的晶粒尺寸小，结果更均匀。

公开(公告)号：US20100328996A1

公开(公告)日：2010-12-30

申请号：US12729837

申请日：2010-03-23

申请人： YEN-HAO SHIH ,  Huai-Yu Cheng ,  Chieh-Fang Chen ,  Chao-I Wu ,  Ming-Hsiu Lee ,  Hsiang-Lan Lung ,  Matthew J. Breitwisch ,  Simone Raoux ,  Chung Hon Lam

发明人： YEN-HAO SHIH ,  Huai-Yu Cheng ,  Chieh-Fang Chen ,  Chao-I Wu ,  Ming-Hsiu Lee ,  Hsiang-Lan Lung ,  Matthew J. Breitwisch ,  Simone Raoux ,  Chung Hon Lam

IPC分类号： G11C11/00 ,  H01L45/00

CPC分类号： H01L45/1625 ,  G11C13/0004 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1641

摘要： A phase change memory device with a memory element including a basis phase change material, such as a chalcogenide, and one or more additives, where the additive or additives have a non-constant concentration profile along an inter-electrode current path through a memory element. The use of “non-constant” concentration profiles for additives enables doping the different zones with different materials and concentrations, according to the different crystallographic, thermal and electrical conditions, and different phase transition conditions.

摘要翻译： 一种具有存储元件的相变存储器件，该存储元件包括诸如硫族化物的基本相变材料和一种或多种添加剂，其中所述添加剂或添加剂沿着穿过存储元件的电极间电流路径具有非恒定浓度分布 。 根据不同的晶体学，热学和电学条件以及不同的相变条件，使用“非恒定”浓度分布的添加剂可以使用不同的材料和浓度掺杂不同的区域。

公开(公告)号：US20100084624A1

公开(公告)日：2010-04-08

申请号：US12286874

申请日：2008-10-02

申请人： Hsiang-Lan Lung ,  Chieh Fang Chen ,  Yen-Hao Shih ,  Ming Hsiu Lee ,  Matthew J. Breitwisch ,  Chung Hon Lam ,  Frieder H. Baumann ,  Philip Flaitz ,  Simone Raoux

发明人： Hsiang-Lan Lung ,  Chieh Fang Chen ,  Yen-Hao Shih ,  Ming Hsiu Lee ,  Matthew J. Breitwisch ,  Chung Hon Lam ,  Frieder H. Baumann ,  Philip Flaitz ,  Simone Raoux

IPC分类号： H01L47/00 ,  H01L21/06

CPC分类号： H01L45/1226 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/144 ,  H01L45/1625 ,  H01L45/1641

摘要： A method for manufacturing a memory device, and a resulting device, is described using silicon oxide doped chalcogenide material. A first electrode having a contact surface; a body of phase change memory material in a polycrystalline state including a portion in contact with the contact surface of the first electrode, and a second electrode in contact with the body of phase change material are formed. The process includes melting and cooling the phase change memory material one or more times within an active region in the body of phase change material without disturbing the polycrystalline state outside the active region. A mesh of silicon oxide in the active region with at least one domain of chalcogenide material results. Also, the grain size of the phase change material in the polycrystalline state outside the active region is small, resulting in a more uniform structure.

摘要翻译： 使用氧化硅掺杂的硫族化物材料来描述用于制造存储器件的方法和所得到的器件。 具有接触表面的第一电极; 形成包括与第一电极的接触表面接触的部分的多晶状态的相变记忆材料体以及与相变材料体接触的第二电极。 该方法包括在相变材料体内的有源区内熔化和冷却相变存储材料一次或多次，而不会干扰有源区外的多晶态。 导致活性区域中的氧化硅网格与至少一个硫族化物材料结构域形成。 此外，活性区域外的多晶态的相变材料的晶粒尺寸小，结果更均匀。

公开(公告)号：US20110116307A1

公开(公告)日：2011-05-19

申请号：US12619362

申请日：2009-11-16

申请人： Matthew J. Breitwisch ,  Chung H. Lam ,  Bipin Rajendran ,  Simone Raoux ,  Alejandro G. Schrott ,  Daniel Krebs

发明人： Matthew J. Breitwisch ,  Chung H. Lam ,  Bipin Rajendran ,  Simone Raoux ,  Alejandro G. Schrott ,  Daniel Krebs

IPC分类号： H01L45/00 ,  G11C11/00

CPC分类号： G11C13/0004 ,  G11C7/04 ,  G11C13/0069 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1675

摘要： A phase change memory cell that includes a bottom electrode, a top electrode separated from the bottom electrode, and growth-dominated phase change material deposited between the bottom electrode and the top electrode and contacting the bottom electrode and the top electrode and surrounded by insulation material at sidewalls thereof. The phase change memory cell in a reset state only includes an amorphous phase of the growth-dominated phase change material within an active volume of the phase change memory cell.

摘要翻译： 一种相变存储单元，包括底部电极，从底部电极分离的顶部电极和沉积在底部电极和顶部电极之间的生长主导的相变材料，并且与底部电极和顶部电极接触并被绝缘材料包围 在其侧壁。 处于复位状态的相变存储单元仅包括在相变存储单元的有效体积内的以生长为主的相变材料的非晶相。

公开(公告)号：US07932507B2

公开(公告)日：2011-04-26

申请号：US12727672

申请日：2010-03-19

申请人： Chieh-Fang Chen ,  Shih Hung Chen ,  Yi-Chou Chen ,  Thomas Happ ,  Chia Hua Ho ,  Ming-Hsiang Hsueh ,  Chung Hon Lam ,  Hsiang-Lan Lung ,  Jan Boris Philipp ,  Simone Raoux

发明人： Chieh-Fang Chen ,  Shih Hung Chen ,  Yi-Chou Chen ,  Thomas Happ ,  Chia Hua Ho ,  Ming-Hsiang Hsueh ,  Chung Hon Lam ,  Hsiang-Lan Lung ,  Jan Boris Philipp ,  Simone Raoux

IPC分类号： H01L29/02

CPC分类号： B82Y10/00 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/1273 ,  H01L45/143 ,  H01L45/144 ,  H01L45/148 ,  H01L45/16

摘要： A layer of nanoparticles having a dimension on the order of 10 nm is employed to form a current constricting layer or as a hardmask for forming a current constricting layer from an underlying insulator layer. The nanoparticles are preferably self-aligning and/or self-planarizing on the underlying surface. The current constricting layer may be formed within a bottom conductive plate, within a phase change material layer, within a top conductive plate, or within a tapered liner between a tapered via sidewall and a via plug contains either a phase change material or a top conductive material. The current density of the local structure around the current constricting layer is higher than the surrounding area, thus allowing local temperature to rise higher than surrounding material. The total current required to program the phase change memory device, and consequently the size of a programming transistor, is reduced due to the current constricting layer.

摘要翻译： 使用具有大约10nm的尺寸的纳米颗粒层形成电流收缩层或作为用于从下面的绝​​缘体层形成电流收缩层的硬掩模。 纳米颗粒优选在下面的表面上自对准和/或自平坦化。 电流收缩层可以形成在底部导电板内，在相变材料层内，在顶部导电板内，或在锥形衬垫之间的锥形衬里之间，锥形通孔侧壁和通孔插塞包含相变材料或顶部导电 材料。 电流收缩层周围的局部结构的电流密度高于周围区域，从而允许局部温度比周围材料高。 由于电流收缩层，减少编程相变存储器件所需的总电流以及编程晶体管的尺寸。